JEDEC
STANDARD
High Temperature Package Warpage
Measurement Methodology
JESD22B112
MAY 2005
JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
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JEDEC Standard No. 22B112
-i-
Introduction
When integrated circuit packages are subjected to the high-temperature solder reflow operation
associated with the mounting of devices to a printed circuit board, deformation and deviation
from an ideal state of uniform planar flatness, i.e., warpage, often results. The deviation of the
package from planarity during board assembly can cause the package terminals to have open
or short circuit connections after the reflow soldering operation. (Certain package types such as
ball grid arrays (BGAs) have been found to be more susceptible to the effects of component
warpage.) Intrinsic package warpage is largely driven by coefficient of thermal expansion
mismatch between the various packaging material constituents. Package warpage is therefore
temperature dependent and the final warpage state is a function of the entire temperature
history or reflow profile, that is typically nonlinear in time. The presence of moisture can also
introduce hygroscopic strain effects which further contribute to changes in total package body
warpage.
JESD22-B108A measures the deviation of the device terminals from coplanarity only at room
temperature. The worst case deviation from flatness may be at room temperature, maximum
reflow temperature, or any temperature in-between. Package warpage cannot be determined
by the condition of the package once it has been reflowed and cooled back to room
temperature, but must be characterized during the entire reflow soldering thermal cycle. Critical
engineering evaluations of the package and printed circuit board warpage must therefore be
conducted in the laboratory under simulated reflow conditions.
JEDEC Standard No. 22B112
-ii-
JEDEC Standard No. 22B112
Page 1
Test Method B112
Package Warpage Test for Surface-Mount Integrated Circuits
(From JEDEC Board Ballot JCB-05-84, formulated under the cognizance of the JC-14.1
Subcommittee on Reliability Test methods for Packaged Devices.)
1 Scope
The purpose of this test method is to measure the deviation from uniform flatness of an
integrated circuit package body for the range of environmental conditions experienced during
the surface-mount soldering operation.
2 Terms and definitions
ball grid array (BGA): A package in which the external connections to the package are made
via a rectangular array of ball-type connections, all on a common plane.
concave warpage: Warpage resulting in the package corners being farther from the seating
plane than the center of the bottom surface of the package. (See Figure 1.)
convex warpage: Warpage resulting in the package corners being closer to the seating plane
than the center of the bottom surface of the package. (See Figure 1.)
Seating Plane
Convex. Warpage Concave warpage
Figure 1 — Package warpage convention
deviation from planarity: The difference in height between the highest point and the lowest
point on the package body bottom surface measured with respect to the seating plane.
fringe order: The nth fringe in a sequence of interference fringes.
peak reflow temperature: The maximum package reflow temperature as specified in
J-STD-020 depending on package dimensions and whether the product is intended for eutectic
Sn-Pb or Pb-free reflow soldering.
rated moisture sensitivity level (MSL): The moisture sensitivity level as determined by
J-STD-020.
JEDEC Standard No. 22B112
Page 2
Test Method B112
2 Terms and definitions (cont’d)
seating plane: The plane formed by the three terminal apexes that exhibit the greatest
perpendicular distance from the package substrate, provided that the triangle formed by those three
apexes encompasses the projection of the center of gravity (COG) of the component. (See
Figure 1.)
shadow moiré method: An optical noncontact method to measure warpage using a moiré
fringe pattern resulting from the geometric interference between a flat reference grating and the
projected shadow of the grating on a warped test object.
thermal shadow moiré method: A method to measure surface deviation using shadow moiré
interference fringes as the package goes through high temperature reflow soldering.
3 Applicable documents
JEP113, Symbols and Labels for Moisture Sensitive Devices.
J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface
Mount Devices.
JESD22-A113, Preconditioning of Nonhermetic Solid State Surface Mount Components Prior to
Reliability Testing.
JESD22-B100, Physical Dimensions.
JESD22-B108, Coplanarity Test for Surface-Mount Semiconductor Devices.
4 Measurement instrument requirements
4.1 General metrology considerations
Warpage metrologies such as Shadow Moiré, 3D Digital Image Correlation, and various forms
of line scanning and/or high-resolution focusing based tools have been successfully applied and
validated under ambient test conditions. A few of these tools have been successfully adapted
and commercialized to support in-situ package warpage measurements at elevated
temperatures. This specification focuses solely on the application of Thermal Shadow Moiré as
the tool for warpage measurement. Nonetheless, any of the above mentioned techniques and
perhaps others not listed in this document are potentially adaptable to elevated temperature
warpage measurements and could be considered.
JEDEC Standard No. 22B112
Page 3
Test Method B112
4 Measurement instrument requirements (cont’d)
4.1 General metrology considerations (cont’d)
The tool used for elevated temperature warpage metrology should be verified using a warpage
standard that is invariant to temperature changes across the temperature range of interest, as
outlined in clause 5. Measurement accuracy should be verified at temperature extremes such
as through the use of a concave or convex ground glass manufactured from ultra-low-expansion
material such as Zerodur® optical ceramic with a coefficient of linear expansion between 20 ˚C
and 300 ˚C of 0.05 ± 0.10 x 10-6/°C. Periodic repeatability measurements should be conducted
at elevated temperature using the high temperature warpage standard.
Reproducibility of test data should be initially evaluated with respect to any operator-to-operator,
day-to-day, or other extrinsic factors which may potentially influence tool performance. Once
successfully validated, the tool should be routinely calibrated and monitored on a periodic basis.
Sample preparation, temperature profiling, and sample temperature distribution guidelines
should be followed according to clause 6 of this document.
4.2 Shadow Moiré apparatus, (Figure 2)
4.2.1 Camera to capture shadow moiré pattern
4.2.2 Ronchi ruled grating made from low CTE glass, specifically defined lined pitch grating
through which light passes to cast a shadow moiré pattern onto the sample.
4.2.3 Light source to project white light through the grating and to cast a shadow moiré pattern
onto the sample.
4.2.4 Electromechanical Z stepping sample stage for phase shifting and acquiring fringe
pattern at different heights.
4.2.5 Computer controlled display system for fringe pattern display, storage, retrieval, printing
and analysis.
4.2.6 Sample Holder used to hold and align the sample and to prevent it from moving during
measurement.
4.2.7 NIST traceable calibration block using step height changes.
4.2.8 A curved glass standard made of ultra low expansion glass of known bend radius is also
recommended for tool validation at elevated temperature.
4.2.9 Thermal chamber used to heat the samples for in situ warpage measurements.
4.2.10 Thermocouples attached to the sample or attached to a second identical reference
sample used for measuring elevated temperature response.
JEDEC Standard No. 22B112
Page 4
Test Method B112
4 Measurement instrument requirements (cont’d)
4.2 Shadow Moiré apparatus, (Figure 2) (cont’d)
Figure 2 — Shadow Moiré Geometry
4.3 Thermal Shadow Moiré
Thermal Shadow moiré is perhaps the most commonly employed metrology for conducting
elevated temperature warpage measurements. Measurements are conducted by placing the
Ronchi ruled grating and sample of interest into a thermally insulated enclosure, see Figure 2.
A heat source is then used to ramp the temperature of the sample under test.
A shadow of the reference grating is cast onto the surface of the specimen below by projecting
a beam of white light at a specified angle through the grating. Moiré fringe patterns are
produced as a result of the geometric interference pattern created between the reference
grating and the shadow grating.
The Ronchi grating line spacing and overall planarity of the glass substrate are generally
invariant to changes in temperature. Thermal Shadow Moiré measurements are successfully
conducted and recorded as the temperature of the sample is increased to the peak reflow
temperature and returned to near room temperature.
NOTE In the case where the specimen is flat and aligned parallel to the reference grating, no moiré
fringe pattern is produced. If a small “wedge angle” is deliberately introduced between the flat test
surface and the reference grating, a series of straight parallel fringes results. In the general case where
the surface of the specimen is curved, or warped, a more complex full field fringe pattern results.
Light
Source
Thermocouple
Thermal
Grease
Kapton
Tape
Thermal
Enclosure
α
Camera
Heating
Element
β as shown usually 0°
JEDEC Standard No. 22B112
Page 5
Test Method B112
4.3 Thermal Shadow Moiré (cont’d)
4.3.1 Shadow moiré fringe
An accurately calibrated fringe constant is required to convert a whole field shadow moiré fringe
pattern into a 3D surface map of package warpage. The shadow moiré fringe count is related to
out-of-plane deformation (warpage) using the fringe constant calibration formula (1).
βα tantan +=
NpW (1)
where:
N = Fringe order
p = grating pitch
α = angle of illumination
β = angle of observation
W = out of plane (normal) displacement or warpage
In typical shadow moiré systems the imaging plane is directly over the object such that the
observation angle β=0° and the light source illumination angle α≥45°.
Phase shifting is routinely implemented as a means of converting whole field fringe patterns into
continuous 3D plots of surface topography, see Figure 3. A precise computer controlled stepper
motor is utilized to displace the sample stage with respect to the glass grating and in doing so
generates a series of discrete phase shifted fringe patterns. Typically four such patterns are
acquired although numerous schemes exist that utilize 3 or more phase shifted patterns.
Figure 3 — Package substrate phase shifted fringe pattern sequence and resulting 3D
Surface Profile.
The Ronchi rule grating line frequency is typically in the range of 100 to 300 lines/inch and the
physical gap required between the grating and sample is typically on the order of several
millimeters. The physical gap between the grating and the sample is adjusted to optimize fringe
contrast of the generated fringe pattern. Following equation (1), finer pitch gratings yield
increased measurement sensitivity but require a smaller gap between the grating and sample in
order to achieve good contrast. An operator should strive to conduct measurements using the
finest possible grating pitch in order to maximize the fundamental sensitivity of the instrument.
JEDEC Standard No. 22B112
Page 6
Test Method B112
4.3 Thermal Shadow Moiré (cont’d)
4.3.1 Shadow moiré fringe (cont’d)
The Ronchi grating should generate a minimum of 2 circular or irregular concentric fringes when
the sample is symmetrically oriented and nominally running parallel with respect to the plane of
the Ronchi grating. If geometric considerations or the height of other assembled electronic
components restrict the proximity of the grating to the package surface, a coarser grating must
then be considered that will necessarily permit a greater grating to sample gap.
Fringe analysis is applied to solve for the phase angle at each pixel location across a region of
interest. Phase angle is then converted to displacement through use of the sensitivity
relationship given by equation 1. The multi-step phase shifting technique has the added benefit
of enhancing the overall system sensitivity since the ability to track small pixel to pixel intensity
variations translates into fractional fringe resolution. Critical factors that ultimately limit phase
shifting assisted resolution are fringe contrast, spatial noise, surface artifacts, CCD camera A/D
bit resolution, and mechanical phase stepping accuracy and calibration.
5 Calibration requirements
5.1 A calibration routine using a warpage standard that is guided by the machine software
should be utilized to initialize the instrument at room temperature before a series of
measurements are made on any package style.
5.2 Measurement accuracy and tool repeatability at elevated temperature may be
independently validated through the use of a ultra-low-expansion glass warpage standard which
exhibits no measurable changes in warpage with increased temperature. The radius of
curvature or warpage of the spherical glass standard should be independently established using
a laser interferometer of higher overall accuracy.
5.3 Figure 4 depicts a sequence of fringe patterns used to generate a phase map and
resulting 3D surface profile of a circular concave warpage standard generated using shadow
moiré. The phase map was cropped to a circumscribed square.
Figure 4 — Warpage calibration using an ultra-low-expansion concave warpage standard.
JEDEC Standard No. 22B112
Page 7
Test Method B112
6 Test sample preparation
For area array packages, warpage measurements should be viewed on the substrate side to
effectively collect data for the entire planar region of the package footprint. Test samples should
be prepared without solder balls attached in order to avoid possible measurement errors caused
by light scattering from the solder balls. A simulated solder ball attachment process is
recommended to subject the components to the thermal process used to attach the solder balls.
For components containing solder balls, these should be removed by either reflow solder
wicking, mechanical polishing, or chemical etching. For any process to remove the solder balls,
care should be taken not to disturb the structural integrity of the package that will ultimately
affect the final warpage characteristic of the component. Verification of the technique used to
remove the solder balls must be conducted.
For lead frame based packages, either the top or bottom for the package body surface can be
measured. All measurements should maintain the (+/-) warpage convention, see Figure 1.
6.1 Sample Size
A minimum of 3 samples shall be measured to determine variation within an assembly lot. It is
recommended that samples be measured in both the moisture soaked and dry states. The
minimum moisture soaked condition shall be the rated moisture sensitivity level per J-STD-020.
NOTE This test is primarily intended for characterization of a package. If any changes to materials are
made then the package should be re-characterized. If this test method is used for monitoring then the
package warpage may be measured in only the dry state.
6.2 Thermal Moiré Considerations
Painting of the measurement surface may be required for enhancing light reflectivity and to
achieve rated instrument accuracy.
6.3 Thermocouple Placement
Accurate temperature measurement of the sample body temperature is required during the
thermal exposure in the chamber of 4.2.9 and will require that proper thermocouple type and
attachment procedures are followed. It is recommended that a thermocouple of gauge 30 or
finer is used and that the thermocouple is attached to the center of the package body using
either a thermally conductive epoxy or attached using high temperature kapton tape. When
kapton tape is used, it is recommended that a thermal paste, such as Fujipoly GR-HN, should
be applied between the thermocouple bead and the surface of the test sample to reduce the
thermal contact resistance, thereby producing a more accurate and consistent body
temperature measurement.
JEDEC Standard No. 22B112
Page 8
Test Method B112
6 Test sample preparation (cont’d)
6.4 Temperature Ramp Rate
The temperature ramp rate during both heating and cooling will influence the measured
warpage and therefore is an important factor. Ideally, a temperature ramp rate that can closely
match the thermal profile response as seen during board assembly should be used. However, if
equi
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