IPCJEDECJSTD033B.1

JOINT INDUSTRY STANDARD Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices IPC/JEDEC J-STD-033B.1 Includes Amendment 1 January 2007 Supersedes IPC/JEDEC J-STD-033B October 2005 Notice JEDEC and IPC Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of JEDEC or IPC from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than JEDEC and IPC members, whether the standard is to be used either domestically or internationally. Recommended Standards and Publications are adopted by JEDEC and IPC without regard to whether their adoption may involve patents on articles, materials, or processes. By such action, JEDEC and IPC do not assume any liability to any patent owner, nor do they assume any obligation whatever to parties adopting the Recommended Standard or Publication. Users are also wholly responsible for protecting themselves against all claims of liabilities for patent infringement. The material in this joint standard was developed by the JEDEC JC-14.1 Committee on Reliability Test Methods for Packaged Devices and the IPC Plastic Chip Carrier Cracking Task Group (B-10a) For Technical Information Contact: JEDEC Solid State Technology Association 2500 Wilson Boulevard Arlington, VA 22201 Phone (703) 907-7500 Fax (703) 907-7583 IPC 3000 Lakeside Drive Suite 309S Bannockburn, Illinois 60015-1249 Tel (847) 615-7100 Fax (847) 615-7105 Please use the Standard Improvement Form shown at the end of this document. ©Copyright 2007. JEDEC Solid State Technology Association, Arlington, Virginia, and IPC, Bannockburn, Illinois. All rights reserved under both international and Pan-American copyright conventions. Any copying, scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States. IPC/JEDEC J-STD-033B.1 Includes Amendment 1 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices A joint standard developed by the JEDEC JC-14.1 Committee on Reliability Test Methods for Packaged Devices and the B-10a Plastic Chip Carrier Cracking Task Group of IPC Users of this standard are encouraged to participate in the development of future revisions. Contact: JEDEC 2500 Wilson Boulevard Arlington, VA 22201 Phone (703) 907-7500 Fax (703) 907-7583 IPC 3000 Lakeside Drive, Suite 309S Bannockburn, Illinois 60015-1249 Tel (847) 615-7100 Fax (847) 615-7105 Supersedes: IPC/JEDEC J-STD-033B - October 2005 IPC/JEDEC J-STD-033A - July 2002 IPC/JEDEC J-STD-033 - April 1999 JEDEC JEP124 IPC-SM-786A - January 1995 IPC-SM-786 - December 1990 ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES ® This Page Intentionally Left Blank Acknowledgment Members of the Joint IPC/JEDEC Moisture Classification Task Group have worked to develop this document. We would like to thank them for their dedication to this effort. Any Standard involving a complex technology draws material from a vast number of sources. While the principal members of the Joint Moisture Classification Working Group are shown below, it is not possible to include all of those who assisted in the evolution of this Standard. To each of them, the members of the JEDEC and IPC extend their gratitude. IPC Plastic Chip Carrier Cracking Task Group, B-10a Chairman Steven Martell Sonoscan, Inc. JEDEC JC 14.1 Committee Chairman Jack McCullen Intel Corporation JEDEC JC 14 Chairman Nick Lycoudes Freescale Semiconductor Joint Working Group Members Jasbir Bath, Solectron Corporation James Mark Bird, Amkor Technology Inc. Michael W. Blazier, Delphi Delco Electronic Maurice Brodeur, Analog Devices Inc. Peter Brooks, Amkor Technology Ralph Carbone, Hewlett Packard Co. Henry Charest, Allegro MicroSystems Inc. Jeffrey C. Colish, Northrop Grumman Corporation Andrew Corriveau, Cogiscan J. Gordon Davy, Northrop Grumman Corporation Werner Engelmaier, Engelmaier Associates L.C. Leo G. Feinstein, Leo Feinstein Associate Barry R. Fernelius, Agilent Technologies John Fink, Honeywell SSEC Curtis Grosskopf, IBM Corporation Joel Heebink, Honeywell Terence Kern, Ambitech International Nick Lycoudes, Freescale Semiconductor Steven R. Martell, Sonoscan Inc. Jack McCullen, Intel Corporation Sean McDermott, Celestica James H. Moffitt, Moffitt Consulting Serv Quang Nguyen, Xilinx Inc. David Nicol John Northrup, BAE Systems Controls Larry Nye, Texas Instruments Inc. Kerry Oren, AcousTech Inc. Deepak K. Pai, C.I.D., General Dynamics-Advanced Information Systems Richard Shook, Agere Systems Inc. Von Sorenson, Micron Technology Inc. Alvin S. Tamanaha, Seika Machinery Inc. Ralph W. Taylor, Lockheed Martin Corporation Jerome Tofel, Northrop Grumman Corporation January 2007 IPC/JEDEC J-STD-033B.1 - Includes Amendment 1 iii This Page Intentionally Left Blank IPC/JEDEC J-STD-033B.1 - Includes Amendment 1 January 2007 iv Table of Contents 1 FOREWORD .............................................................. 1 1.1 Purpose ................................................................. 1 1.2 Scope .................................................................... 1 1.2.1 Packages ............................................................... 1 1.3 Assembly Processes ............................................. 1 1.3.1 Mass Reflow ........................................................ 1 1.3.2 Localized Heating ................................................ 1 1.3.3 Socketed Components ......................................... 1 1.3.4 Point-to-Point Soldering ...................................... 1 1.4 Reliability ............................................................. 2 1.5 Terms and Definitions ......................................... 2 1.5.1 Active Desiccant .................................................. 2 1.5.2 Bar Code Label .................................................... 2 1.5.3 Bulk Reflow ......................................................... 2 1.5.4 Carrier .................................................................. 2 1.5.5 Desiccant .............................................................. 2 1.5.6 Floor Life ............................................................. 2 1.5.7 Humidity Indicator Card (HIC) ........................... 2 1.5.8 Manufacturer’s Exposure Time (MET) ............... 2 1.5.9 Moisture Barrier Bag (MBB) .............................. 2 1.5.10 Rework ................................................................. 2 1.5.11 Shelf Life ............................................................. 2 1.5.12 SMD ..................................................................... 2 1.5.13 Solder Reflow ...................................................... 2 1.5.14 Water Vapor Transmission Rate (WVTR) .......... 2 2 APPLICABLE DOCUMENTS .................................... 3 2.1 American Society for Testing and Materials (ASTM) ................................................................ 3 2.2 Electronic Industries Alliance (EIA, JEDEC) .... 3 2.3 IPC Standards ...................................................... 3 2.4 Joint Industry Standards ...................................... 3 2.5 Department of Defense ........................................ 3 3 DRY PACKING .......................................................... 3 3.1 Requirements ....................................................... 3 3.2 Drying of SMD Packages and Carrier Materials Before Being Sealed in MBBs ........... 4 3.2.1 Drying Requirements - Levels 2a - 5a ............... 4 3.2.2 Drying Requirements - Carrier Materials ........... 4 3.2.3 Drying Requirements - Other .............................. 4 3.2.4 Excess Time Between Bake and Bag ................. 4 3.3 Dry Pack .............................................................. 4 3.3.1 Description ........................................................... 4 3.3.2 Materials ............................................................... 4 3.3.3 Labels ................................................................... 6 3.3.4 Moisture Barrier Bag Sealing ............................. 6 3.3.5 Shelf Life ............................................................. 6 4 DRYING ..................................................................... 7 4.1 Post Exposure to Factory Ambient ..................... 7 4.1.1 Any Duration Exposure ....................................... 7 4.1.2 Short Duration Exposure ..................................... 7 4.2 General Considerations for Baking ..................... 8 4.2.1 High Temperature Carriers .................................. 8 4.2.2 Low Temperature Carriers ................................... 8 4.2.3 Paper and Plastic Container Items ...................... 8 4.2.4 Bakeout Times ..................................................... 9 4.2.5 ESD Protection .................................................... 9 4.2.6 Reuse of Carriers ................................................. 9 4.2.7 Solderability Limitations ..................................... 9 5 USE .......................................................................... 10 5.1 Incoming Bag Inspection ................................... 10 5.1.1 Upon Receipt ..................................................... 10 5.1.2 Component Inspection ....................................... 10 5.2 Floor Life ........................................................... 10 5.3 Safe Storage ....................................................... 10 5.3.1 Dry Pack ............................................................ 10 5.3.2 Shelf Life ........................................................... 10 5.3.3 Dry Atmosphere Cabinet ................................... 10 5.4 Reflow ................................................................ 11 5.4.1 Opened MBB ..................................................... 11 5.4.2 Reflow Temperature Extremes .......................... 11 5.4.3 Additional Thermal Profile Parameters ............. 11 5.4.4 Multiple Reflow Passes ..................................... 11 5.4.5 Maximum Reflow Passes .................................. 11 5.5 Drying Indicators ............................................... 11 5.5.1 Excess Humidity in the Dry Pack ..................... 11 5.5.2 Floor Life or Ambient Temperature/ Humidity Exceeded ........................................... 12 5.5.3 Level 6 SMD Packages ..................................... 12 6 BOARD REWORK .................................................. 12 6.1 Component Removal, Rework and Remount ... 12 6.1.1 Removal for Failure Analysis ........................... 12 6.1.2 Removal and Remount ...................................... 12 6.2 Baking of Populated Boards ............................. 12 7 DERATING DUE TO FACTORY ENVIRONMENTAL CONDITIONS .......................... 12 January 2007 IPC/JEDEC J-STD-033B.1 - Includes Amendment 1 v Appendix A Test Method for Humidity Indicator Card used with Electronic Component Packaging ........................ 14 Appendix B Derivation of Bake Tables .................. 15 Appendix C Amendment 1 - Differences between J-STD-033B.1 and J-STD-033B ........... 15 Figures Figure 3-1 Typical Dry Pack Configuration for Moisture- Sensitive SMD Packages in Shipping Tubes ..... 4 Figure 3-2 Example Humidity Indicator Card ....................... 5 Figure 3-3 Moisture-Sensitive Identification Label (Example) ............................................................ 6 Figure 3-4 Moisture-Sensitive Caution Label (Example) ...... 7 Figure A-1 Photo of Testing Apparatus ............................... 14 Tables Table 3-1 Dry Packing Requirements ................................. 3 Table 3-2 Typical HIC Spot Compliance ............................. 6 Table 4-1 Reference Conditions for Drying Mounted or Unmounted SMD Packages ........................... 8 Table 4-2 Default Baking Times Used Prior to Dry-Pack that were Exposed to Conditions ≤60% RH (Supplier Bake: ‘‘MET’’ = 24 h) ........................... 9 Table 4-3 Resetting or Pausing the ‘‘Floor Life’’ Clock at User Site ......................................................... 9 Table 5-1 Moisture Classification Level and Floor Life ..... 10 Table 7-1 Recommended Equivalent Total Floor Life (days) @ 20°C, 25°C & 30°C, 35°C For ICs with Novolac, Biphenyl and Multifunctional Epoxies .............................................................. 13 IPC/JEDEC J-STD-033B.1 - Includes Amendment 1 January 2007 vi Handling, Packing, Shipping and Use of Moisture/ Reflow Sensitive Surface Mount Devices 1 FOREWORD The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding package damage ‘‘cracks and delamination’’ from the solder reflow process. This document describes the standardized levels of floor life exposure for moisture/reflow-sensitive SMD packages along with the handling, packing and shipping requirements nec- essary to avoid moisture/reflow-related failures. Companion documents J-STD-020 and JEP113 define the classification pro- cedure and the labeling requirements, respectively. Moisture from atmospheric humidity enters permeable packaging materials by diffusion. Assembly processes used to solder SMD packages to printed circuit boards (PCBs) expose the entire package body to temperatures higher than 200°C. During solder reflow, the combination of rapid moisture expansion, materials mismatch, and material interface degradation can result in package cracking and/or delamination of critical interfaces within the package. The solder reflow processes of concern are convection, convection/IR, infrared (IR), vapor phase (VPR) and hot air rework tools. The use of assembly processes that immerse the component body in molten solder are not recommended for most SMD packages. 1.1 Purpose The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMD packages that have been classified to the levels defined in J-STD-020. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags of 12 months from the seal date. 1.2 Scope 1.2.1 Packages 1.2.1.1 Nonhermetic This standard applies to all nonhermetic SMD packages subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages and all other packages made with moisture-permeable poly- meric materials (epoxies, silicones, etc.) that are exposed to the ambient air. 1.2.1.2 Hermetic Hermetic SMD packages are not moisture sensitive and do not require moisture precautionary handling. 1.3 Assembly Processes 1.3.1 Mass Reflow This standard applies to bulk solder reflow assembly by convection, convection/IR, infrared (IR), and vapor phase (VPR) processes. It does not apply to bulk solder reflow processes that immerse the component bodies in mol- ten solder (e.g., wave soldering bottom mounted components). Such processes are not allowed for many SMDs and are not covered by the component qualifications standards used as a basis for this document. 1.3.2 Localized Heating This standard also applies to moisture sensitive SMD packages that are removed or attached sin- gly by local ambient heating, i.e., ‘‘hot air rework.’’ See Clause 6. 1.3.3 Socketed Components This standard does not apply to SMD packages that are socketed and not exposed to solder reflow temperatures. Such SMD packages are not at risk and do not require moisture precautionary handling. 1.3.4 Point-to-Point Soldering This standard does not apply to SMD packages in which only the leads are heated to reflow the solder, e.g., hand-soldering, hot bar attach of gull wing leads, and through hole by wave soldering. The heat absorbed by the package body from such operations is typically much lower than for bulk surface mount reflow or hot air rework, and moisture precautionary measures are typically not needed. January 2007 IPC/JEDEC J-STD-033B.1 - Includes Amendment 1 1 吳進明 Companion documents J-STD-020 and JEP113 define the classification procedure and the labeling requirements, respectively. 吳進明 1.2.1.1 Nonhermetic This standard applies to all nonhermetic SMD packages subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages and all other packages made with moisture-permeable polymeric materials (epoxies, silicones, etc.) that are exposed to the ambient air. 吳進明 1.3.2 Localized Heating This standard also applies to moisture sensitive SMD packages that are removed or attached singly by local ambient heating, i.e., ‘‘hot air rework.’’ See Clause 6. 吳進明 1.3 Assembly Processes 1.3.1 Mass Reflow This standard applies to bulk solder reflow assembly by convection, convection/IR, infrared (IR), and vapor phase (VPR) processes. It does not apply to bulk solder reflow processes that immerse the component bodies in molten solder (e.g., wave soldering bottom mounted components). Such processes are not allowed for many SMDs and are not covered by the component qualifications standards used as a basis for this document. 1.4 Reliability The methods set forth in this specification ensure that an adequate SMD package reliability can be achieved during and after the PCB assembly operation, when the SMD packages are evaluated and verified by J-STD-020 and/or by JESD22-A113 plus environmental reliability testing. This specification does not address or ensure solder joint reliability of attached components. 1.5 Terms and Definitions 1.5.1 Active Desiccant Desiccant that is either fresh (new) or has been baked according to the manufacturer’s recommen- dations to renew it to original specifications. 1.5.2 Bar Code Label The manufacturer’s label that includes information in a code consisting of parallel bars and spaces or a 2D matrix format. NOTE: For the purpose of this standard, the bar code label is on the lowest level shipping container and includes informa- tion that describes the product, e.g., part number, quantity, lot information, supplier identification, and moisture-sensitivity level. 1.5.3 Bulk Reflow Reflow of multiple components with simultaneous attachment by an infrared (IR), convection/IR, con- vection, or vapor phase reflow (VPR) process. 1.5.4 Carrier A container that directly holds components such as a tray, tube, or tape and reel. 1.5.5 Desiccant An absorbent material used to maintain a low relative humidity. 1.5.6 Floor Life The allowable time period after removal from a moisture barrier bag, dry storage or dry bake and before the solder reflow process. 1.5.7 Humidity Indicator Card (HIC) A card on which a moisture-sensitive chemical is applied such that it will make a significant, perceptible change in color (hue), typically from blue (dry) to pink (wet) when the indicated relative humidity is exceeded. The HIC is packed inside the moisture-barrier bag, along with a desiccant, to aid in determining the level of moisture to which the moisture-sensitive devices have been subjected. 1.5.8 Manufacturer’s Exposure Time (MET) The maximum cumulative time af