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Bevel size Common Query I. Board thickness 1. Lay-up 2. Mismatch between the lay-up board thicknesses 3. Relax board thickness tolerance II. Carbon ink III. Cu thickness & Pad 1. Add Cu clearance for NPTH or consider 2nd-drill HYPERLINK \l "III2" 2. Add dummy pattern 3. Copper close to board edge HYPERLINK \l "III4" 4. Copper extending to unit edge 5. Delete NPTH pad 6. Distance between two pads less than 4mil 7. Isolated fiducial mark 8. No space to enlarge pads to ensure 2mil annual ring 9. Pad size is too small 10. PTH hole with elliptic pad 11. Relax Cu thickness on outer layer 12. Relax Cu thickness on outer layer HYPERLINK \l "IV" IV. DWG 1. Label in DWG is undefined 2. No DWG with dimension 3. Unit DWG size is small V. General criteria 1. Common criteria 2. E/T stamp 3. Our logo 4. X-out VI. Gold finger 1. Delete solder mask bridge between gold fingers 2. Relax tolerance for bevel size 3. Relax beveling angle or disregard the remaining thickness 4. Space between gold finger edge and outline is too narrow 5. Space between test pad and the top of gold finger is too narrow VII. Hole 1. Blind/buried hole 2. Breakaway hole is partially on copper plane 3. Change overlapped hole as slot 4. Drilling positional tolerance 5. Relax tolerance for NPTH 6. Relax tolerance for PTH 7. Repeated hole 8. Routing hole 9. Rectangular hole VIII. Impedance 1. Calculated value trends to the limit 2. Match impedance 3. Reference plane 4. Which trace should be controlled IX. Inner corner Right angle X. Outline dimension 1. Connection tab far away from unit edge 2. Mismatch between CAD/CAM data and DWG 3. Miss dimension 4. Narrow connection area between breakaway holes 5. No tooling hole 6. Relax tolerance for outline dimension 7. Uneven tolerance 8. Useless dimension 9. Add overshoot XI. Packing XII. Peelable solder mask 1. Peelable solder mask covered hole 2. Peelable solder mask plugged hole 3. Relax thickness for peelable solder mask 4. Without the detail dimension of peelable solder mask XIII. Silkscreen 1. Marking in hole or pad 2. Marking in large solder surface 3. Legend on step area XIV. Slot 1. Relax tolerance for non-plated slot 2. Relax tolerance for plated slot XV. Solder mask 1. Add S/M Bridge for SMT 2. Change S/M plugged hole to covered hole 3. Hole size is too large to plug 4. Hole size is too small to cover 5. Relax solder mask thickness 6. S/M cover gold finger 7. Solder mask material 8. Spacing is too narrow to add S/M Bridge XVI. Solder thickness Relax solder thickness XVII. TAB Without TAB on one row of units at the center XVIII. Tg Tg value is not specified for High Tg material XIX. Trace 1. Connection between Cu grounds is too thin 2. Exposed trace from solder mask opening 3. Relax etching tolerance 4. Self-spacing 5. Spacing between two traces is too narrow XX. Transfer board Sample approval XXI. V-Cut 1. Discontinuous V-Cut 2. Relax V-Cut remain thickness tolerance 3. Relax V-Cut groove angle tolerance 4. V-Cut remain thickness is too weak 5. V-Cut run across BAT XXII. Warpage Relax warpage I. 板厚 1. 排板结构 2. 排板结构和板厚要求不一致 3. 释放板厚公差 II. 碳油 III. 铜厚& Pad 1. 为考虑二次钻孔的NPTH加Cu clearance HYPERLINK \l "III2" 2. 加 dummy pattern 3. 铜距板边太近 HYPERLINK \l "III4" 4. 铜延伸至单元边 5. 删除NPTH的PAD 6. 相邻两PAD距离小于4mil 7. 独立Fiducial mark 8. 没有足够的空间来加大PAD以保证2mil焊锡圈 9. Pad尺寸太小 10. 有椭圆PAD的PTH孔 11. 释放孔壁铜厚 12. 释放外层铜厚 HYPERLINK \l "IV" IV. DWG 1. 图纸标记不明 2. 没有标注尺寸的图纸 3. 单元图尺寸太小 V. 常规Query 1. 普通标准 2. E/T 印 3. 公司 logo 4. 单元报废 VI. 金手指 1. 删除金指间的绿油桥 2. 释放斜边尺寸公差 3. 释放斜边角度或忽略残留厚度 4. 金指边离外围太近 5. 测试PAD离金指顶部太近 VII. 孔 1. 盲/埋孔 2. 折断孔部分在铜面上 3. 改重孔为槽 4. 钻孔位置公差 5. 释放NPTH公差 6. 释放PTH公差 7. 重孔 8. 锣孔 9. 矩形孔 VIII. 阻抗 1. 阻抗计算值偏向上/下限 2. 匹配阻抗 3. 阻抗参考面 4. 哪一条线要求控制阻抗 IX. 内角 内角为直角 X. 外形尺寸 1. 相连TAB远离单元边 2. CAD/CAM数据与DWG不一致 3. 缺少尺寸 4. 折断孔连接区域太窄 5. 没有工具孔 6. 释放外形尺寸公差 7. 孔到孔公差不对称 8. 无用尺寸 9. 加Overshoot XI. 包装要求 XII. Peelable solder mask 1. 蓝胶盖孔 2. 蓝胶塞孔 3. 释放蓝胶厚度 4. 缺少蓝胶详细尺寸 XIII. 丝印 1. 白字入孔/上PAD 2. 白字上大锡面 3. 白字部分在铜面上部分在基材上 XIV. 槽 1. 释放非电镀槽公差 2. 释放电镀槽公差 XV. 绿油 1. 为SMT加绿油桥 2. 改绿油塞孔为盖孔 3. 孔太大不便绿油塞孔 4. 孔太小不便绿油盖孔 5. 释放绿油厚度 6. 绿油盖金指 7. 绿油 材料 关于××同志的政审材料调查表环保先进个人材料国家普通话测试材料农民专业合作社注销四查四问剖析材料 8. 间距太小不便加绿油桥 XVI. 铅锡厚度 释放铅锡厚度 XVII. TAB 单元间无 TAB XVIII. Tg 高Tg材料的Tg值未指明 XIX. 导线 1. 两个Cu ground间连接太小 2. 绿油开窗露线 3. 释放蚀刻公差 4. 线路自身间距太小 5. 线间太窄 XX. 转板 样板转生产板 XXI. V-Cut 1. 跳 V-Cut 2. 释放V-Cut残留厚度公差 3. 释放V-Cut槽角度公差 4. V-Cut残留厚度太小 5. V-Cut穿过BAT XXII. 板曲 释放板曲 I. Board thickness 1. Lay-up In DWG, customer mentioned layer order only, but didn't indicate the dielectric thickness between layers and Copper thickness. So, we suggest you follow the lay-up shown on attached file XX. Please confirm. 2. Mismatch between the lay-up and board thickness According to the lay-up specified by customer, the overall board thickness will be XXX mil, not the customer nominal requirement of YYY mil. So, we suggest: A). To follow the lay-up specified by customer and change the overall board thickness to YYYmil+/-10%, OR B). To modify the lay-up as shown on attached file and control the overall board thickness to be XXX mil per customer requirement. Please clarify which item (A or B) customer preferred. 3. Relax board thickness tolerance Customer required controlling the finished board thickness to be XX%, however, the standard tolerance for board thickness is +/-10%. We can achieve tighter tolerance by ordering non-standard materials, however, it will take a long lead-time and a high price to purchase this special material. So, we suggest you relax the tolerance from XX% to +/-10%. Please confirm. II. Carbon ink According to master A/W, carbon ink will be printed on contact finger. While the carbon/carbon isolation spacing is too narrow: Item Master A/W Our capability Carbon/carbon isolation spacing: X mil 14mil Carbon width: Y mil 12mil(min) Cu finger width: U mil NIL Carbon/Cu overlapping: Z mil 6mil(min) Carbon misregistration: +/-X mil +/-5mil In order to facilitate in production, we suggest you modify master A/W as below: Item on Master A/W Change to Carbon/carbon isolation spacing: X mil Carbon width: Y mil Cu finger width: U mil Carbon/Cu overlapping: Z mil Please confirm. III. Cu thickness & Pad 1. Add Cu clearance for NPTH or consider 2nd-drill The non-plated hole located in ground plane (OR a large pad: DIAXXX), in order to facilitate in production, we suggest we shave Cu and add a 10mil clearance around non-plated holes. Please confirm. 2. Add dummy pattern As the distribution of Cu pattern is very uneven on outer layers, in order to balance plating and improve quality, we suggest you add some dummy pattern in blank area. The dummy shape and size see attached file. Please confirm. 3. Copper close to board edge In some locations, copper features are closer than 15mil(10mil) from the outline. This presents the risk of exposed copper at board edges. We suggest we shave copper to get sufficient spacing. Please confirm. 4. Copper extending to unit edge In some locations, copper has extended to unit edge. If we follow master A/W to build, copper will be exposed at unit edge. So, we suggest we shave copper to get sufficient spacing. Please confirm. 5. Delete NPTH pad For some non-plated holes (DIA: XX), their pad size (DIA: XXX) is larger than hole size. In order to facilitate in production, we suggest you delete these pads. Please confirm 6. Distance between two pads less than 4mil On component side/solder side, the spacing between two pads is too narrow (X mil only). As the two pads have been connected together in inner layer YY. In order to facilitate in production, we suggest we shave the pads and keep 5mil spacing. Please confirm. 7. Isolated fiducial mark The isolated fiducial marks are easy to be peeled off during the hot air leveling. In order to avoid this problem, we would suggest you add a circular copper ring around the fiducial mark under solder mask. 8. No space to enlarge pads to ensure 2mil annual ring To ensure 2mil annual ring, we need enlarge the pads to 35mil (min). But according to master film, there is no enough spacing to enlarge these pads, so we suggest to try our best to enlarge them, and ensure 2mil annual ring at the joint of trace and pad. By doing this, there may be hole breakout in other area, please suggest customer to accept. 9. Pad size is too small According to master A/W, the via hole pad is too small (hole size: MMM, pad size: NNN). As there isn't enough spacing for us to add these pads. In order to select a smaller drill we suggest you change the tolerance of via hole from XXXX+/-3mil to XXXX+0/-6mil. Please confirm. 10. PTH hole with elliptic pad Per master artwork, we found some PTH holes (DIA: XXX mil) with elliptic pad (pad size: MM X NN mil) (see attached file). As the elliptic pad was too small, thus it was ineluctable that hole will be broken on short side if we follow master artwork to proceed. We suggest to enlarge the pad suitably to guarantee a 2 mil (min) annular ring on the conjoint area, please confirm. 11. Relax Cu thickness on hole wall Customer required plating a thick copper of XXX mil on plated hole wall; however, the standard for hole wall copper plating thickness is 1.0mil minimum. Thicker copper plating can overplate surface features, depending on the circuitry distribution and create yield problems. In order to facilitate in production, we suggest you relax your minimum to the specification above from XXX mil (min). Please confirm. 12. Relax Cu thickness on outer layer Customer required using X oz copper foil for outer layer and plated to YY mil finish. Because circuit distribution will significantly affect outer layer conductor copper thickness, it is difficult to guarantee thickness greater than 1.4mil for 1/2oz foil, and 2.1mil for 1oz foil. In order to facilitate in production, we suggest you relax the overall copper thickness to be ZZ mil. Please confirm. IV. DWG 1. Label in DWG is undefined On the panel DWG, there was one dimension XXX, which we didn't know what it indicated, please customer to clarify it, or we suggest to ignore it, please confirming. 2. No DWG with dimension After measuring out-line of the Drill DWG, we suggest a draft DWG with dimension as attached file X shown. Please confirm. 3. Unit DWG size is small Because of the unit DWG size is too small (MMM x NNN), in order to facilitate in our production, we design a panel DWG (see attached file), please confirm. If the above is accepted, how many scrap units (XX up/per panel) could be accept, please confirm. In order to distinguish X-out board with good board, we will draw a black cross on X-out board, and we will pack the X-out board separately, please take note. V. General criteria 1. Common criteria Some common criteria were not specified. We suggest you follow IPC-6012A CLASS 2 and our default conditions: 1. Surface finish: HAL/Immersion Gold/Entek 2. Annular ring: 2mil min 3. Solder mask color: green 4. Legend color: White (Yellow) 5. Solder thickness: On Cu Ground Area: 40u'(min) (30u'(min) for new customer) On SMT Pad; 100u'(min) (80u'(min) for new customer) 6. Etching tolerance: +/-20% 7. Outline tolerance: +/-5mil 8. Inner Radius: R63mil (max) 9. The Cu thickness of hole wall: 0.8mil(min) 10. The Au thickness: 15u'(min) The Ni thickness: 80u'(min) 11. Warp and twist: 0.75%(max) 12. Tolerance of hole size: For Via (Dia: 12mil): +0/-6mil For PTH (except Via): +/-3mil For NPTH: +/-2mil 13. Slot tolerance: Plated slot: width: +/-4.5mil X length: +/-5.5mil (width: +/-3mil X length: +/-4mil for tighter tolerance) Non-plated slot: width: +/-3mil X length: +/-4mil (width: +/-2mil X length: +/-3mil for tighter tolerance) 14. For blind or buried hole: The Cu thickness of hole wall: 0.5mil(min) per IPC Standard; Annular ring: 2mil(min) at connection area, 90-degree breakout at rest area. In order to strengthen the connection between hole to pad, we suggest you add teardrop for all blind/buried hole at connection area. Please confirm. 2. E/T stamp In order to show the board has passed E-Test, we will place a white/black “T” stamp without S/M opening on solder/component side. Please confirm. 3. Our logo We suggest to silkscreen/etch our marking on solder/component side. Please confirm. 4. X-out Could one scrap unit per panel (2-UP per panel) be accepted, please confirm. How many scrap units per panel (X-UP per panel) be accepted, please confirm. In order to distinguish X-out board with good board, we will draw a black cross on X-out board, and we will pack the X-out board separately, please take note. VI. Gold finger 1. Delete solder mask bridge between gold fingers There has solder mask bridge between gold fingers (see attached file 1), in order to improve gold finger quality, grinding copper surface of gold finger is required before plated gold finger process. So the small rubbish of solder mask would be created on gold finger's copper surface, which will affect gold finger quality. In order to avoid this problem, we suggest to delete solder mask bridge between gold fingers, to get full solder mask opening for gold finger. Please confirm. 2. Relax tolerance for bevel size In UNIT DWG, the bevel size is XXX mil, however, the tolerance of bevel height is too tight. The standard tolerance for bevel size is +/-5mil for 30/40 degree cutter (+/-8mil for a 20 degree cutter). Tighter tolerance can be achieved with special processing. Bevel size is easily affected by the board thickness. In order to facilitate in production, we suggest you relax your tolerance to the standards above. Please confirm. 3. Relax beveling angle or disregard the remaining thickness According to customer's DWG, the beveling dimension was required as below sketched: Angle: XX degree; Height: YY mil; Remaining thickness: ZZ mil i) For angle +/-X degree, however, tighter tolerance can be achieved with special process. In order to facilitate the production and improve efficiency, we suggest to relax to +/-3 degree. Please confirm. ii) For the remaining thickness. In general, the beveling height was adjustable and controlled in production, while the remaining thickness was a reference in the beveling process. We suggest to only control the beveling height and disregard the remaining thickness. Please confirm. 4. Space between gold finger edge and outline is too narrow The minimum space was only X mil between the gold finger edge and outline (see attached file). Because of registered tolerance, after finished, the copper may be exposed at the edge of key-slot. In order to avoid this question, we suggest to shave suitable copper and assuring the space to our standard space: 8mil (min) (see attached file). Please confirm 5. Space between test pad and the top of finger is too narrow The space between test pad and the top of gold finger is closer than 30mil (only XX mil) (see attached file M) on bottom side. It is necessary to cover gold finger with high temperature tape during HAL process, and this operation is performed by hand, We required a 30mil spacing as deviation area to avoid that these pads with solder mask opening were covered with the tape. So, we suggest to shift down solder mask opening 10mil(max) (see attached file N). Please confirm. VII. Hole 1. Blind/buried hole Is this blind hole design for your component bonding purpose? So that copper plating is required on these blind hole surfaces. Please specify and confirm. 2. Breakaway hole is partially on copper plane Per the breakaway detail, the breakaway hole would be located partially on the copper planes of all layers. We suggest to create a suitable clearance (about 0.50mm larger than the hole size). Please confirm. 3. Change overlapped hole as slot On drill file, three holes (PTH/NPTH, DIA: VVV) are overlapped each other, the distance between two holes is XXX mil. In order to facilitate in production, we suggest you change them as a slot. Please confirm. 4. Drilling positional tolerance Customer required controlling the drill positional tolerance to be +/-X mil, however, the standard tolerance for drill positional accuracy is +/-3mil. Tighter tolerance can be achieved with special processing. In order to facilitate in production, we suggest you relax the tolerance from +/-X mil to +/-3mil. Please confirm. 5. Relax tolerance for NPTH Customer required controlling the tolerance of +/-X mil for non-plated hole of DIAXXX; however, the standard tolerance for PTH diameter is +/-2mil. Tighter tolerance can be achieved with special processing. In order to facilitate in production, we suggest you relax the tolerance from +/-X mil to +/-2mil. Please confirm. 6. Relax tolerance for PTH Customer required controlling the tolerance of +/-X mil for plated hole of DIAXXX; however, the standard tolerance for PTH diameter is +/-3mil. This allows for variations caused by circuitry distribution and processing. In order to facilitate in production, we suggest you relax the tolerance from +/-X mil to +/-3mil. Please confirm. 7. Repeated hole On CAD/CAM data, we found some holes overlapped each other. The distance between hole is 1-5mil. We suggest you remove one of two. Please confirm. Accordingly, the hole quantity of DIA: XXX will be changed to be VVV. Please confirm. 8. Routing hole As the hole size (NPTH, DIA: XXX) is too large, we will have to build them by routing, accordingly, we suggest you relax their tolerance from +/-X mil to +/-5mil. Please confirm. 9. Rectangular hole Per the drill DWG, there are some DIA: XX mil plated holes, which locate at the rectangular hole of YY mm x ZZ mm (See attached file X). i). From the additional sheet of rectangular holes artwork, which includes these rectangular holes, we found the rectangular holes in this artwork were not centered with the plated holes and the corresponding pad (See attached file Y). We suggest to build the rectangular holes/slots with reference to the plated hole as the center of slot. Please confirm. ii). Per the shape of rectangular holes, there was a FULL R included at the end of each rectangular hole, that means the slot size as 3mm x 0.6mm rectangular holes will be built as 3.6mm x 0.6mm plated slot with full radius. 2mm x 0.6mm rectangular holes will be built as 2.6mm x 0.6mm plated slot with full radius. The illustration see attached file Z, please confirm. iii). We suggest to control the plated slot length/width tolerance as +/-0.127mm, please confirming. VIII. Impedance 1. Calculated value trends to the limit Based on the lay-up specified by customer, the calculated value of impedance is YY ohms per our Polar not the customer nominal requirement of XX ohms. So, we suggest: A) To modify the controlled trace width to AA mil from BB mil, and/or make a micro-adjustment for the lay-up as the one on attached file. We will control impedance to be: XX ohms per customer requirement, OR B) We won't make any change for trace width and lay-up, but we have to change the impedance to be YYohms+/-10%. Please clarify which item (A or B) customer preferred. 2. Match impedance According to stack up on DWG, the calculated result of impedance mean value was XXX for layer X and layer Y which shifted to upper/lower limit by XX ohms and there will be certain percentage of scrap due to the impedance out of control requirement. In order to improve the impedance control and tend the mean to nominal value of ZZ ohms, we suggest: A. To change the dielectric thickness From XXX to YYY between layer X and layer Y. B. To change the trace width to XXX from YYY. C. To change the controlled impedance value to XXX from YYY. Please clarify which item (A, B or C) customer preferred. 3. Reference plane Customer didn't clearly indicate which layer is reference plane of layer X. According to our experiences of calculated impedance value, we think layer Y and Z are reference planes of layer X, Please confirm. 4. Which trace should be controlled Customer required controlling the impedance within the range of Xohms+/-10%, but customer didn't mention which trace width should be controlled. X mil trace is with a high percent on all signal layers, so we suggest to control the impedance of 60ohms for X mil trace. Pl