PCB封装设计规范V.

PCB封装 设计规范 民用建筑抗震设计规范配电网设计规范10kv变电所设计规范220kv变电站通用竖流式沉淀池设计 PCB封装 设计 领导形象设计圆作业设计ao工艺污水处理厂设计附属工程施工组织设计清扫机器人结构设计 规范 编程规范下载gsp规范下载钢格栅规范下载警徽规范下载建设厅规范下载 文件编号:受控标识:版本状态:发放序号:编制：日期：审核：日期：批准：日期：目录TOC\o"1-3"\h\z\u1、目的32、适用范畴43、职责44、术语定义45、引用标准46、PCB封装设计过程框图47、SMC（ 表 关于同志近三年现实表现材料材料类招标技术评分表图表与交易pdf视力表打印pdf用图表说话 pdf 面组装元件）封装及命名简介58、SMD（表面组装器件）封装及命名简介69、设计规则610、PCB封装设计命名方式711、PCB封装放置入库方式712、封装设计分类712.1、矩形元件（标准类）712.2、圆形元件（标准类）1612.3、小外形晶体管（SOT）及二极管（SOD）（标准类）1812.4、集成电路（IC）（标准类）2412.5、微波器件（非标准类）3412.6、接插件（非标准类）361、目的本规范是为电子元器件的表面属性提供模版信息，即为表面器件焊盘图形设计提供模版尺寸，外形以及公差，以便检查和测试，确保表面装配产品的可靠性，从而规范电子元器件的PCB封装设计2、适用范畴本规范适用于研发中心PCB部所有PCB封装的设计。3、职责PCB封装库评审由PCB部门经理与工艺部门经理共同评审完成，特别封装除外。PCB部门专职PCB封装设计人员负责PCB封装库的设计、评审和更新。4、术语定义PCB（PrintcircuitBoard)：印刷电路板Footprint：封装IC（integratedcircuits）：集成电路SMC（SurfaceMountedComponents）：表面组装元件SMD（SurfaceMountedDevices）：表面组装器件5、引用标准下列标准包含的条文，通过在本规范中引用而构成本规范的条文。在规范归档时，所示版本均为有效。所有规范都会被修订，使用本规范的各方应探讨，使用下列标准最新版本的可能性。IPCBatchFootprintGeneratorReferenceIPC-7351GenericRequirementsforSurfaceMountDesignandLandPatternStandardIPC-SM-782ASurfaceMountDesignandLandPatternStandard《表面组装技术基础与可制造性设计》6、PCB封装设计过程框图图6.1PCB封装设计过程框图7、SMC（表面组装元件）封装及命名简介SMC主要是指无源元件的机电元件，包括各种电阻器、陶瓷电容器、铝电解电容器、电感器、磁珠、陶瓷振子、滤波器、电阻网络、电容网络、微调电容器、电位器、各种开关、继电器、连接器等，封装形状有矩形、圆柱形、复合形和异形。SMC的封装是以元件的外形尺寸来命名的，其标称以3位或4位数字来表示，SMC的封装命名及标称已经标准化。SMC常用外形尺寸长度和宽度命名，来标志其外形大小，通常有公制（mm）和英制（inch）两种表示方法。公制（mm）/英制（inch）转换式如下：25.4mm×英制（inch）尺寸=公制（mm）尺寸例如：0805（0.08inch×0.05inch）英制转换为公制元件长度=25.4mm×0.08=2.032≈2.0mm元件宽度=25.4mm×0.05=1.27≈1.25mm0805的公制表示法为2125（2.0mm×1.25mm）8、SMD（表面组装器件）封装及命名简介SMD主要是指有源器件，包括半导体分立器件（二极管、三极管和半导体特别器件）、集成电路。SMD是贴在PCB表面的，而不是插在PCB通孔中；SMD的体积小、重量轻、速度快；SMD可以两面贴装，焊接质量好、可靠性高。SMD封装命名是以器件的外形命名的。SMD的引出脚有羽翼形（GULL）、J形、球形、和无引线引线框架形。SMD的封装形式有：SOP(SmallOutlinePackages)羽翼形小外形塑料封装，其中包括SOIC（SmallOutlineIntegratedCircuits）小外形集成电路，SSOIC（ShrinkSmallOutlineIntegratedCircuits）缩小型小外形集成电路，TSOP（ThinSmallOutlinePackage）薄型小外形封装；SOJ(SmallOutlineIntegratedCircuits)，J形小外形塑料封装；PLCC(PlasticLeadedChipCarriers)塑封J形引脚芯片载体；BGA(BallGridArray/ChipScalePackage)球形栅格阵列，根据材料和尺寸可分为六个类型：PBGA（PlasticBallGridArray）塑料封装BGA，CBGA（CeramicBallGridArray）陶瓷封装BGA，CCGA（CeramicColumnBGA）陶瓷柱状封装BGA，TBGA（TapeBallGridArray）载带BGA，µBGA（微型BGA）芯片级封装，FC-PBGA（FlipChipPlasticBallGridArray）倒装芯片塑料封装BGA；CSP(ChipScalePackage)又称µBGA；QFN(QuadFlatNo-lead)四方形扁平无引线引线框架封装。9、设计规则由RF或控制人员预先给出需要设计PCB封装器件的DATASHEET至PCB封装设计人员，同时转给原理图封装设计人员同步设计原理图封装，同步设计完成后需统一其命名方式，即PCB封装的命名与原理图封装载入PCB设计时的封装命名一致，否则无法导入PCB设计。设计PCB时，必须使用我司标准的PCB封装库，不得自己创建PCB封装库。PCB封装库在不同的项目设计里同种类型器件必须使用同种类型的PCB封装库，保证PCB封装库的唯独性与统一性，从而提高设计的正确率。非标准且无明显方向性的PCB封装有输入输出 要求 对教师党员的评价套管和固井爆破片与爆破装置仓库管理基本要求三甲医院都需要复审吗 的必须在相应管脚增加输入（IN）输出(OUT)标识，有极性的器件PCB封装必须增加极性标识；标准且有方向性的PCB封装必须给出1Pin标识。有引脚序号标识的器件按DATASHEET标明PCB封装焊盘的引脚顺号，DATASHEET引脚序号标识模糊不清或根本没有标识引脚序号的按IC管脚焊盘序号来标识，即逆时针顺序标识。同一个PCB封装里不能有相同的引脚序号显现。PCB封装储存时封装信息包含PCB封装“命名”，该封装“高度”等，如有其他的可增加“描述”等。属IPC标准封装的参考IPC标准封装来设计PCB封装库；除IPC标准封装以外，DATASHEET有举荐封装的采用举荐封装设计PCB封装，特别情形除外；非标准封装采用我司规定的标准来设计PCB封装。所有封装均用PAD设计焊盘；用PAD或keepout层设计定位孔；丝印与PADS的距离≥10mil。设计PCB封装外形丝印要求≥其自身的最大尺寸，IC除外。设计ICPCB封装自动生成的PAD上有过孔（VIA）时，其过孔的内径为0.25mm，外径为15～20mil。10、PCB封装设计命名方式属于规则封装命名方式的统一用IPC的封装命名。属于不规则的单一的命名统一用其型号的全称命名。设计人员完成PCB封装设计后，要及时与原理图封装设计同步。11、PCB封装放置入库方式目前我司PCB封装库分类有：标识.lib，SMA.lib，电位器.lib，电感.lib，电容.lib，晶体管.lib，电源.lib，开关.lib，插件.lib，微波.lib，功放管.lib，芯片.lib，时钟.lib等等，设计人员根据DATASHEET所属类型自行判定放置入库，如分类不够或不全可适当增减种类，其中设计人员可设计一个“新器件.lib”类别以放置待评审类型或有疑问的PCB封装。PCB封装放置入库时以它封装本身的1pin中心或器件本身中心点为原点放置。12、封装设计分类电阻电容，晶体管，集成电路（IC），功放管，隔离器与环形器，耦合器，接插件等，分为标准类与非标准类。12.1、矩形元件（标准类）贴片电阻封装实际尺寸：图12.1贴片电阻封装实际尺寸表12.1贴片电阻封装实际尺寸mm(in)componentidentifierLSWTHminmaxminmaxminmaxminmaxmax1005（0402）1.001.100.400.700.480.600.100.300.401608（0603）1.501.700.701.110.700.950.150.400.602012（0805）1.852.150.551.321.101.400.150.650.653216（1206）3.053.351.552.321.451.750.250.750.713225（1210）3.053.351.552.322.342.640.250.750.715025（2010）4.855.153.153.922.352.650.350.850.716332（2512）6.156.454.455.223.053.350.350.850.71贴片电阻封装举荐尺寸：图12.2贴片电阻封装举荐尺寸表12.2贴片电阻封装举荐尺寸RLPNo.ComponentIdentifiermm(in)Z(mm)G(mm)X(mm)Y(mm)C(mm)Placementgridrefref100A1005（0402）2.200.400.700.901.302X6101A1608（0603）2.800.601.001.101.704X6102A2012（0805）3.200.601.501.301.904X8103A3216（1206）4.401.201.801.602.804X10104A3225（1210）4.401.202.701.602.806X10105A5025（2010）6.202.602.701.804.406X14106A6332（2512）7.403.803.201.805.608X16贴片电容封装实际尺寸：图12.3贴片电容封装实际尺寸表12.3贴片电容封装实际尺寸ComponentIdentifiermm(in)LSWTHminmaxminmaxminmaxminmaxmax1005（0402）0.901.100.300.650.400.600.100.300.601310（0504）1.021.320.260.720.771.270.130.381.021608（0603）1.451.750.450.970.650.950.200.500.852012（0805）1.802.200.301.111.051.450.250.751.103216（1206）3.003.401.502.311.401.800.250.751.353225（1210）3.003.401.502.312.302.700.250.751.354532（1812）4.204.802.303.463.003.400.250.951.354564（1825）4.204.802.303.466.006.800.250.951.10贴片电容封装举荐尺寸：图12.4贴片电容封装实际尺寸表12.4贴片电容封装实际尺寸RLPNo.ComponentIdentifiermm(in)Z(mm)G(mm)X(mm)Y(mm)C(mm)Placementgridrefref130A1005(0402)2.200.400.700.901.302X6131A1310(0504)2.400.401.301.001.404X6132A1608(0603)2.800.601.001.101.704X6133A2012(0805)3.200.601.501.301.904X8134A3216(1206)4.401.201.801.602.804X10135A3225(1210)4.401.202.701.602.806X10136A4532(1812)5.802.003.401.903.908X12137A4564(1825)5.802.006.801.903.9014X12贴片电感封装实际尺寸：图12.5贴片电感封装实际尺寸表12.5贴片电感封装实际尺寸ComponentIdentifier(mm)L(mm)S(mm)W1(mm)W2(mm)T(mm)H1(mm)H2(mm)minmaxminmaxminmaxminmaxminmaxmaxmax2012chip1.702.301.101.760.601.20------0.100.301.20---3216chip2.903.501.902.631.301.90------0.200.501.90---4516chip4.204.802.603.530.601.20------0.300.801.90---2825prec.w/w2.202.800.901.621.952.112.102.540.370.652.290.073225prec.w/w2.903.500.901.831.401.80------0.501.002.000.504532prec.w/w4.204.802.203.133.003.40------0.501.002.800.505038prec.w/w4.354.952.813.512.462.623.413.810.510.773.800.763225/3230molded3.003.401.602.181.802.002.302.700.400.702.400.514035molded3.814.320.811.601.201.502.923.181.201.502.671.274532molded4.204.802.303.152.002.203.003.400.650.953.400.505650molded5.305.503.304.323.804.204.705.300.501.005.801.008530molded8.258.765.256.041.201.502.923.181.201.502.671.27贴片电感封装举荐尺寸：图12.6贴片电感封装举荐尺寸表12.6贴片电感封装举荐尺寸RLPNo.ComponentIdentifier(mm)Z(mm)G(mm)X(mm)C(mm)Y(mm)Placementgridrefrfe1602012chip3.001.001.002.001.004X81613216chip4.201.801.603.001.206X101624516chip5.802.601.004.201.604X121632825Prec3.801.002.402.401.406X101643225Prec4.601.002.002.801.806X101654532Prec5.802.203.604.001.808X141665038Prec5.803.002.804.401.408X141673225/3230Molded4.401.202.202.801.606X101684035Molded5.401.001.403.202.208X121694532Molded5.801.802.403.802.008X141705650Molded6.803.204.005.001.8012X161718530Molded9.805.001.407.402.408X22钽电容封装实际尺寸：图12.7钽电容封装实际尺寸图12.7钽电容封装实际尺寸ComponentIdentifier(mm)L(mm)S(mm)W1(mm)W2(mm)T(mm)H1(mm)H2(mm)minmaxminmaxminmaxminmaxminmaxminmax32163.003.400.801.741.171.211.401.800.501.100.701.8035283.303.701.102.042.192.212.603.000.501.100.702.1060325.706.302.503.542.192.212.903.501.001.601.002.8073437.007.603.804.842.392.414.004.601.001.601.003.10钽电容封装举荐尺寸：图12.8钽电容封装举荐尺寸表12.8钽电容封装举荐尺寸RLPNo.ComponentIdentifier(mm)Z(mm)G(mm)X(mm)Y(mm)C(mm)Placementgridrefref180A32164.800.801.202.002.806X12181A35285.001.002.202.003.008X12182A60327.602.402.202.605.008X18183A73439.003.802.402.606.4010X2012.2、圆形元件（标准类）贴片二极管封装实际尺寸：图12.9贴片二极管封装实际尺寸表12.9贴片二极管封装实际尺寸ComponentIdentifierMm(in)L(mm)S(mm)W(mm)T(mm)ComponenttypeminmaxminmaxminmaxminmaxSOD-80/MLL343.303.702.202.651.601.700.410.55DiodeSOD-87/MLL414.805.203.804.252.442.540.360.50Diode2012(0805)1.902.101.161.441.351.450.230.370.10mwresistor3216(1206)3.003.401.862.311.751.850.430.570.25mwresistor3516(1406)3.303.702.162.611.551.650.430.570.12wresistor5923(2309)5.706.104.364.812.402.500.530.670.25wresistor贴片二极管封装举荐尺寸：图12.10贴片二极管封装举荐尺寸表12.10贴片二极管封装举荐尺寸RLPNo.ComponentIdentifierMm(in)Z(mm)G(mm)X(mm)Y(mm)C(mm)ABPlacementgridrefref200ASOD-80/MLL344.802.001.801.403.400.500.506X12201ASOD-87/MLL416.303.402.601.454.850.500.506X14202A2012(0805)3.200.601.601.301.900.500.354X8203A3216(1206)4.401.202.001.602.800.500.556X10204A3516(1406)4.802.001.801.403.400.500.556X12205A5923(2309)7.204.202.601.505.700.500.656X1812.3、小外形晶体管（SOT）及二极管（SOD）（标准类）SOT23封装实际尺寸：图12.11SOT23封装实际尺寸表12.11SOT23封装实际尺寸ComponentIdentifierL(mm)S(mm)W(mm)T(mm)H(mm)P(mm)minmaxminmaxminmaxminmaxmaxnomSOT232.302.601.101.470.360.460.450.601.100.95SOT23封装举荐尺寸：图12.12SOT23封装举荐尺寸表12.12SOT23封装举荐尺寸RLPNo.ComponentidentifierZ(mm)G(mm)X(mm)Y(mm)C(mm)E(mm)PlacementGirdrefrefref210SOT233.600.801.001.402.200.958X8SOT89封装实际尺寸：图12.13SOT89封装实际尺寸表12.13SOT89封装实际尺寸ComponentIdentifierL(mm)T(mm)W1(mm)W2(mm)W3(mm)K(mm)H(mm)P(mm)minmaxminmaxminmaxminmaxminmaxminmaxmaxnomSOT893.944.250.891.200.360.480.440.561.621.832.602.851.601.50SOT89封装举荐尺寸：图12.14SOT89封装举荐尺寸表12.14SOT89封装举荐尺寸RLPNo.ComponentIdentifierZ(mm)Y1(mm)X1(mm)X2(mm)X3(mm)Y2(mm)Y3(mm)E(mm)Placementgridminmaxminmaxrefrefnom215SOT895.401.400.800.801.001.802.002.404.601.5012X10SOD123封装实际尺寸：图12.15SOD123封装实际尺寸表12.15SOD123封装实际尺寸ComponentIdentifierL(mm)S(mm)W1(mm)W2(mm)T(mm)HminmaxminmaxminmaxminmaxminmaxmaxSOD1233.553.852.352.930.450.651.401.700.250.601.35SMB5.215.592.173.311.962.213.303.940.761.522.41SOD123封装举荐尺寸：图12.16SOD123封装举荐尺寸表12.16SOD123封装举荐尺寸RLPNo.ComponentIdentifierZ(mm)G(mm)X(mm)Y(mm)C(mm)Placementgridrefref220ASOD1235.001.800.801.603.404X12221ASMB6.802.002.402.404.408X16SOT143封装实际尺寸：图12.17SOT143封装实际尺寸表12.17SOT143封装实际尺寸ComponentIdentifierL(mm)S(mm)W1(mm)W2(mm)T(mm)P1(mm)P2(mm)H(mm)minmaxminmaxminmaxminmaxminmaxnomnommaxSOT1432.102.641.001.690.370.460.760.890.250.551.921.721.20SOT143封装举荐尺寸：图12.18SOT143封装举荐尺寸表12.18SOT143封装举荐尺寸RLPNO.ComponentIdentifierZ(mm)G(mm)X1(mm)X2(mm)CE1E2YPlacementgridminmaxrefnomnomref225SOT1433.600.801.001.001.202.201.901.701.408X8SOT223封装实际尺寸：图12.19SOT223封装实际尺寸表12.19SOT223封装实际尺寸ComponentIdentifierL(mm)S(mm)W1(mm)W2(mm)T(mm)H(mm)P1(mm)P2(mm)minmaxminmaxminmaxminmaxminmaxmaxnomnomSOT2236.707.304.104.920.600.882.903.180.901.301.802.304.60SOT223封装举荐尺寸：图12.20SOT223封装举荐尺寸表12.20SOT223封装举荐尺寸RLPNo.ComponentIdentifierZ(mm)G(mm)X1(mm)X2(mm)Y(mm)C(mm)E1(mm)E2(mm)Placementgridminmaxrefrefnomnom230SOT2238.404.001.203.403.602.206.202.304.6018X14特别晶体管（DPAK）：图12.21特别晶体管（DPAK）-1表12.21特别晶体管（DPAK）-1ComponentIdentifierLW1W2T1T2P1P2HminmaxminmaxminmaxminmaxminmaxbasicbasicMaxTS-003*9.3210.410.640.914.355.350.510.804.005.502.284.572.38TS-005**14.6015.880.510.916.226.862.292.798.009.002.545.084.83TO36818.7019.101.151.4513.3013.602.402.7012.4012.705.4510.905.10图12.22特别晶体管（DPAK）-2表12.22特别晶体管（DPAK）-2RLPNo.ComponentIdentifierZ(mm)Y1Y2X1X2CPlacementGridref235ATS-003*11.201.606.201.005.407.3024X16236TS-005**16.603.409.601.006.8010.1036X24237TO26819.803.4013.401.4013.6011.4042X3412.4、集成电路（IC）（标准类）所有对称IC都需增加1pin标识。SOIC系列封装实际尺寸：图12.23SOIC系列封装实际尺寸表12.23SOIC系列封装实际尺寸ComponentIdentifierJEDECL(mm)S(mm)W(mm)T(mm)A(mm)B(mm)H(mm)PminmaxminmaxminmaxminmaxminmaxminmaxminmaxnomSO8MS-012AA5.806.203.264.550.330.510.401.273.804.004.805.001.351.751.27SO8W---10.0010.657.468.850.330.510.401.277.407.605.055.452.352.651.27SO14MS-012AB5.806.203.264.550.330.510.401.273.804.008.558.751.351.751.27SO14W---10.0010.657.468.850.330.510.401.277.407.608.809.202.352.65SO16MS-012AC5.806.203.264.550.330.510.401.273.804.009.8010.001.351.751.27SO16WMS-013AA10.0010.657.468.850.330.510.401.277.407.6010.1010.502.352.651.27SO20WMS-013AC10.0010.657.468.850.330.510.401.277.407.6012.6013.002.352.651.27SO24WMO-119AA10.2910.648.219.010.360.510.531.047.407.6015.5415.852.342.641.27SO24XMO-120AA11.8112.179.7310.540.360.510.531.048.769.0215.5415.852.342.641.27SO28WMO-119AB10.2910.648.219.010.360.510.531.047.407.6018.0818.392.342.641.27SO28XMO-120AB11.8112.179.7310.540.360.510.531.048.769.0218.0818.392.342.641.27SO32WMO-119AC10.2910.648.219.010.360.510.531.047.407.6020.6220.932.342.641.27SO32XMO-120AC11.8112.179.7310.540.360.510.531.048.769.0220.6220.932.342.641.27SO36WMO-119AD10.2910.648.219.010.360.510.531.047.407.6023.1623.472.342.641.27SO36XMO-120AD11.8112.179.7310.540.360.510.531.048.769.0223.1623.472.342.641.27SOIC系列封装举荐尺寸：图12.24SOIC系列封装举荐尺寸表12.24SOIC系列封装举荐尺寸RLPNo.ComponentidentifierZ(mm)G(mm)X(mm)Y(mm)C(mm)D(mm)E(mm)PlacementgridrefRefrefref300ASO87.403.000.602.205.203.811.2716X12301ASO8W11.407.000.602.209.203.811.2724X12302ASO147.403.000.602.205.207.621.2716X20303ASO14W11.407.000.602.209.207.621.2724X20304ASO167.403.000.602.205.208.891.2716X22305ASO16W11.407.000.602.209.208.891.2724X22306ASO20W11.407.000.602.209.2011.431.2724X28307ASO24W11.407.000.602.209.2013.971.2724X32308ASO24X13.008.600.602.2010.8013.971.2728X32309ASO28W11.407.000.602.209.2016.511.2724X38310ASO28X13.008.600.602.2010.8016.511.2728X38311ASO32W11.407.000.602.209.2019.051.2724X44312ASO32X13.008.600.602.2010.8019.051.2728X44313ASO36W11.407.000.602.209.2021.591.2724X48314ASO36X13.008.600.602.2010.8021.591.2728X48SOPIC系列封装实际尺寸：图12.25SOPIC系列封装实际尺寸表12.25SOPIC系列封装实际尺寸ComponentidentifiertypeL(mm)S(mm)W(mm)T(mm)A(mm)B(mm)H(mm)P(mm)minmaxminmaxminmaxminmaxminmaxmaxmaxnomSOP6I5.726.993.725.110.350.510.601.003.924.726.351.501.27SOP8I5.726.993.725.110.350.510.601.003.924.726.351.501.27SOP10I5.726.993.725.110.350.510.601.003.924.728.891.501.27SOP12I5.726.993.725.110.350.510.601.003.924.728.891.501.27SOP14I5.726.993.725.110.350.510.601.003.924.7211.431.501.27SOP16II7.628.895.627.010.350.510.601.005.026.2211.432.001.27SOP18II7.628.895.627.010.350.510.601.005.026.2213.972.001.27SOP20II7.628.895.627.010.350.510.601.005.026.2213.972.001.27SOP22III9.5310.807.538.920.350.510.601.006.338.1316.512.501.27SOP24III9.5310.807.538.920.350.510.601.006.338.1316.512.501.27SOP28IV11.4312.709.4310.820.350.510.601.008.2310.0319.053.001.27SOP30IV11.4312.709.4310.820.350.510.601.008.2310.0321.593.001.27SOP32V13.3414.6111.3412.730.350.510.601.0010.1411.9421.593.501.27SOP36V13.3414.6111.3412.730.350.510.601.0010.1411.9424.133.501.27SOP40VI15.2416.5113.2414.630.350.510.601.0012.0413.8427.944.001.27SOP42VI15.2416.5113.2414.630.350.510.601.0012.0413.8427.944.001.27SOPIC系列封装举荐尺寸：图12.27SOPIC系列封装举荐尺寸表12.27SOPIC系列封装举荐尺寸RLPNo.ComponentidentifierZ(mm)G(mm)X(mm)Y(mm)C(mm)D(mm)E(mm)PlacementGridrefrefrefnom360ASOP67.403.000.602.205.202.541.2716X14361ASOP87.403.000.602.205.203.811.2716X14362ASOP107.403.000.602.205.205.081.2716X18363ASOP127.403.000.602.205.206.351.2716X18364ASOP147.403.000.602.205.207.621.2716X24365ASOP169.405.000.602.207.208.891.2720X24366ASOP189.405.000.602.207.2010.161.2720X28367ASOP209.405.000.602.207.2011.431.2720X28368ASOP2211.206.800.602.209.0013.971.2724X34369ASOP2411.206.800.602.209.0013.971.2724X34370ASOP2813.208.800.602.2011.0016.511.2728X40371ASOP3013.208.800.602.2011.0017.781.2728X44372ASOP3215.0010.600.602.2012.8019.051.2732X44373ASOP3615.0010.600.602.2012.8021.591.2732X50374ASOP4017.0012.600.602.2014.8024.131.2736X56375ASOP4217.0012.600.602.2014.8025.401.2736X56TSOP系列封装实际尺寸：图12.28TSOP系列封装实际尺寸表12.28TSOP系列封装实际尺寸ComponentIdentifierPinCountL(mm)S(mm)W(mm)T(mm)A(mm)B(mm)H(mm)P(mm)minmaxminmaxminmaxminmaxminmaxminmaxmaxnomTSOP6X141613.8014.2012.4012.980.200.400.400.705.806.2012.2012.601.270.65TSOP6X162415.8016.2014.4014.980.100.300.400.705.806.2014.2014.601.270.50TSOP6X182817.8018.2016.4016.780.050.220.400.705.806.2016.2016.601.270.40TSOP6X203619.8020.2018.4018.980.050.150.400.705.806.2018.2018.601.270.30TSOP8X142413.8014.2012.4012.980.200.400.400.707.808.2012.2012.601.270.65TSOP8X163215.8016.2014.4014.980.100.300.400.707.808.2014.2014.601.270.50TSOP8X184017.8018.2016.4016.780.050.220.400.707.808.2016.2016.601.270.40TSOP8X205219.8020.2018.4018.980.050.150.400.707.808.2018.2018.601.270.30TSOP10X142813.8014.2012.4012.980.200.400.400.709.8010.2012.2012.601.270.65TSOP10X164015.8016.2014.4014.980.100.300.400.709.8010.2014.2014.601.270.50TSOP10X184817.8018.2016.4016.780.050.220.400.709.8010.2016.2016.601.270.40TSOP10X206419.8020.2018.4018.980.050.150.400.709.8010.2018.2018.601.270.30TSOP12X143613.8014.2012.4012.980.200.400.400.7011.8012.2012.2012.601.270.65TSOP12X164815.8016.2014.4014.980.100.300.400.7011.8012.2014.2014.601.270.50TSOP12X186017.8018.2016.4016.780.050.220.400.7011.8012.2016.2016.601.270.40TSOP12X207619.8020.2018.4018.980.050.150.400.7011.8012.2018.2018.601.270.30TSOP系列封装举荐尺寸：图12.29TSOP系列封装举荐尺寸表12.29TSOP系列封装举荐尺寸RLPNo.ComponentIdentifierZ(mm)G(mm)X(mm)Y(mm)C(mm)D(mm)E(mm)PinCountPlacementGridrefrefrefnom390ATSOP6X1414.8011.600.401.6013.204.550.651614X32391ATSOP6X1616.8013.600.301.6015.205.500.502414X36392ATSOP6X1818.8015.600.251.6017.205.200.402814X40393ATSOP6X2020.8017.600.171.6019.205.100.303614X44394ATSOP8X1414.8011.600.401.6013.207.150.652418X32395ATSOP8X1616.8013.600.301.6015.207.500.503218X36396ATSOP8X1818.8015.600.251.6017.207.600.404018X40397ATSOP8X2020.8017.600.171.6019.207.500.305218X44398ATSOP10X1414.8011.600.401.6013.208.450.652822X32399ATSOP10X1616.8013.600.301.6015.209.500.504022X36400ATSOP10X1818.8015.600.251.6017.209.200.404822X40401ATSOP10X2020.8017.600.171.6019.209.300.306422X44402ATSOP12X1414.8011.600.401.6013.2011.050.653626X32403ATSOP12X1616.8013.600.301.6015.2011.500.504826X36404ATSOP12X1818.8015.600.251.6017.2011.600.406026X40405ATSOP12X2020.8017.600.171.6019.2011.100.307626X44SOJ系列A封装实际尺寸：图12.30SOJ系列A封装实际尺寸表12.30SOJ系列A封装实际尺寸ComponentIdentifierL(mm)S(mm)W(mm)T(mm)B(mm)H(mm)P(mm)minmaxminmaxminmaxminmaxminmaxmaxnomSOJ14/3008.388.764.385.060.380.511.602.009.659.963.751.27SOJ16/3008.388.764.385.060.380.511.602.0010.9211.233.751.27SOJ18/3008.388.764.385.060.380.511.602.0012.1912.503.751.27SOJ20/3008.388.764.385.060.380.511.602.0013.4613.773.751.27SOJ22/3008.388.764.385.060.380.511.602.0014.7315.043.751.27SOJ24/3008.388.764.385.060.380.511.602.0016.0016.313.751.27SOJ26/3008.388.764.385.060.380.511.602.0017.2717.583.751.27SOJ28/3008.388.764.385.060.380.511.602.0018.5418.853.751.27SOJ14/3509.6510.035.656.330.380.511.602.009.659.963.751.27SOJ16/3509.6510.035.656.330.380.511.602.0010.9211.233.751.27SOJ18/3509.6510.035.656.330.380.511.602.0012.1912.503.751.27SOJ20/3509.6510.035.656.330.380.511.602.0013.4613.773.751.27SOJ22/3509.6510.035.656.330.380.511.602.0014.7315.043.751.27SOJ24/3509.6510.035.656.330.380.511.602.0016.0016.313.751.27SOJ26/3509.6510.035.656.330.380.511.602.0017.2717.583.751.27SOJ28/3509.6510.035.656.330.380.511.602.0018.5418.853.751.27SOJ系列A封装举荐尺寸：图12.31SOJ系列A封装举荐尺寸表12.31SOJ系列A封装举荐尺寸RLPNo.ComponentIdentifierZ(mm)G(mm)X(mm)Y(mm)C(mm)D(mm)E(mm)PlacementGridrefrefnomnom480ASOJ14/3009.405.000.602.207.207.621.2720X22481ASOJ16/3009.405.000.602.207.208.891.2720X24482ASOJ18/3009.405.000.602.207.2010.161.2720X26483ASOJ20/3009.405.000.602.207.2011.431.2720X28484ASOJ22/3009.405.000.602.207.2012.701.2720X32485ASOJ24/3009.405.000.602.207.2013.971.2720X34486ASOJ26/3009.405.000.602.207.2015.241.2720X36487ASOJ28/3009.405.000.602.207.2016.511.2720X38490ASOJ14/35010.606.200.602.208.407.621.2724X22491ASOJ16/35010.606.200.602.208.408.891.2724X24492ASOJ18/35010.606.200.602.208.4010.161.2724X26493ASOJ20/35010.606.200.602.208.4011.431.2724X28494ASOJ22/35010.606.200.602.208.4012.701.2724X32495ASOJ24/35010.606.200.602.208.4013.971.2724X34496ASOJ26/35010.606.200.602.208.4015.241.2724X36497ASOJ28/35010.606.200.602.208.4016.511.2724X38SOJ系列B封装实际尺寸：图12.32SOJ系列B封装实际尺寸表12.32SOJ系列B封装实际尺寸ComponentIdentifierL(mm)S(mm)W(mm)T(mm)B(mm)H(mm)P(mm)minmaxminmaxminmaxminmaxminmaxmaxnomSOJ14/40010.9211.306.927.600.380.511.602.009.659.963.751.27SOJ16/40010.9211.306.927.600.380.511.602.0010.9211.233.751.27SOJ18/40010.9211.306.927.600.380.511.602.0012.1912.503.751.27SOJ20/40010.9211.306.927.600.380.511.602.0013.4613.773.751.27SOJ22/40010.9211.306.927.600.380.511.602.0014.7315.043.751.27SOJ24/40010.9211.306.927.600.380.511.602.0016.0016.313.751.27SOJ26/40010.9211.306.927.600.380.511.602.0017.2717.583.751.27SOJ28/40010.9211.306.927.600.380.511.602.0018.5418.853.751.27SOJ14/45012.1912.578.198.870.380.511.602.009.659.963.751.27SOJ16/45012.1912.578.198.870.380.511.602.0010.9211.233.751.27SOJ18/45012.1912.578.198.870.380.511.602.0012.1912.503.751.27SOJ20/45012.1912.578.198.870.380.511.602.0013.4613.773.751.27SOJ22/45012.1912.578.198.870.380.511.602.0014.7315.043.751.27SOJ24/45012.1912.578.198.870.380.511.602.0016.0016.313.751.27SOJ26/45012.1912.578.198.870.380.511.602.0017.2717.583.751.27SOJ28/45012.1912.578.198.870.380.511.602.0018.5418.853.751.27SOJ系列B封装举荐尺寸：图12.33SOJ系列B封装举荐尺寸表12.33SOJ系列B封装举荐尺寸RLPNo.ComponentIdentifierZ(mm)G(mm)X(mm)Y(mm)C(mm)D(mm)E(mm)PlacementGridrefrefnomnom500ASOJ14/40011.807.400.602.209.607.621.2726X22501ASOJ16/40011.807.400.602.209.608.891.2726X24502ASOJ18/40011.807.400.602.209.6010.161.2726X26503ASOJ20/40011.807.400.602.209.6