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IPC
IPC-S-100 Standards and Specification Manual (
IPC-TM-650 Test Methods Manual (
IPC-A-600F Acceptability of Printed Boards ( Nov.1999)
4. IPC-A-610C Acceptability of Electronic Assemblies (Jan.2000)
5. IPC-PE-740A Troubleshooting for Printed Board (Dec.1997)
6. IPC-SM-782A Surface Mount Design and Land Pattern Standard
(Oct.1996)
7. IPC-7711 Rework of Electronic Assemblies (Feb.1998)
8. IPC-7721 Repair and Modification of Printed Boards and
Electronic Assemblies (Feb.1998)
IPC-S-100 Standards Manual
IPC-T-50F Terms and Definitions
IPC-SC-60 Post Solder Solvent Cleaning Handbook
IPC-SA-61 Post Solder Semiaqueous Cleaning Handbook IPC-AC-62A Post Solder Aqueous Cleaning Handbook IPC-PC-90 General Requirements for Implementation of Statistical Process Control IPC-QS-95 General Requirements for Implementation of ISO 9000 Quality Systems IPC-L-125A Specification for Plastic Substrates, Clad or Unclad, for High-Speed/High
Frequency Interconnections
IPC-DD-135 Qualification Testing for Deposited Organic Innerlayer Dielectric
Materials for Multichip Modules
IPC-EG-140 Specification for Finished Fabric Woven from 揈?Glass for Printed
Boards (including updated Amendment to Appendix 2)
IPC-SG-141 Specification for Finished Fabric Woven from 揝?Glass for Printed
Boards
IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards IPC-QF-143 Specification for Finished Fabric Woven from Quartz (Pure Fused Silica)
for Printed Boards
IPC-CF-148A Resin Coated Metal for Printed Boards IPC-MF-150F Metal Foil for Printed Wiring Applications (includes Amendment 1) IPC-CF-152B Composite Metallic Materials Specification for Printed Wiring Boards IPC-FC-231C Flexible Bare Dielectrics for Use in Flexible Printed Wiring (includes
Slash Sheet Amendment)
IPC-FC-232C Specification for Adhesive Coated Dielectric Films for Use as Cover
Sheets for Flexible Printed Wiring (includes Slash Sheet Amendment)
IPC-FC-241C Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed
Wiring (includes Slash Sheet Amendment)
IPC-D-300G Printed Board Dimension and Tolerances IPC-D-322 Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel
Sizes
IPC-MC-324 Performance Specification for Metal Core Boards IPC-D-325A Documentation Requirements for Printed Boards, Assemblies, and
Support Drawings (supersedes IPC-ML-975)
IPC-D-326 Information Requirements for Manufacturing Printed Board Assemblies IPC-NC-349 Computer Numerical Control Formatting for Drillers and Routers IPC-D-356A Bare Board Electrical Test Information in Digital Form IPC-BP-421 General Specification for Rigid Prntd. Bd. Backplanes with Press-Fit
Contracts
IPC-DW-424 General Specification for Encapsulated Discrete Wiring Interconnection
Boards
IPC-DW-425A Design and End Product Requirements for Discrete Wiring Boards
(includes Amendment 1)
IPC-DW-426 Specifications for Assembly of Discrete Wiring
IPC-DR-570A General Specification for 1/8 inch Diameter Shank Carbide Drills for
Printed Bds.
IPC-OI-645 Standard for Visual Optical Inspection Aids IPC-QL-653A Qualification of Facilities that Inspect/Test Printed Boards, Components,
and Materials
IPC-SM-786A Procedures for Characterizing and Handling of Moisture/Reflow Sensitive
Plastic Ics
IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives IPC-CA-821 General Requirements for Thermally Conductive Adhesives IPC-CC-830A Qualification and Performance of Electrical Insulating Compounds for
Printed Board Assemblies
IPC-SM-840C Qualification and Performance of Permanent Solder Mask IPC-D-859 Design Standard for Thick Film Multilayer Hybrid Circuits IPC-HM-860 Performance Specification for Multilayer Hybrid Circuits IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards IPC-ML-960 Qualification and Performance Specification for Mass Laminated Panels for
Multilayer Printed Boards
IPC-2221 Generic Standard on Printed Board Design (Supersedes IPC-D-275) IPC-2222 Sectional Design Standard for Rigid Organic Printed Boards (Supersedes IPC-
D-275)
IPC-2223 Sectional Design Standard for Flexible Printed Boards (Supersedes IPC-D-249) IPC-2224 Sectional Standard for Design of PWBs for PC Cards
IPC-2225 Sectional Design Standard for Organic Multichip Modules (MCM-L) and
MCM-L Assemblies
IPC-2511 Generic Requirements for Implementation of Product Manufacturing
Description Data and Transfer Methodology (Supersedes IPC-D-350D, D-
351, D-352, D-354 and D-355)
IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives IPC-3408 General Requirements for Anisotropically Conductive Adhesive Films IPC-4101 Laminate/Prepreg Materials Standard for Printed Boards (Supersedes IPC-L-
108, IPC-L-109, IPC-L-112, IPC-L-115, and IPC-AM-361)
IPC-4110 Specification and Characterization Methods for Nonwoven Cellulose Based
Paper for Printed Boards
IPC-4130 Specification and Characterization Methods for Nonwoven ''E" Glass Mat IPC-6011 GenericPerformance Specification for Printed Boards (Supersedes IPC-RB-276) IPC-6012 Qualification and Performance Specification for Rigid Printed Boards
(Supersedes IPC-RB-276)
IPC-6013 Qualification and Performance Specification for Flexible Printed Boards
(Supersedes IPC-RF-245 and IPC-FC-250A)
IPC-6015 Qualification and Performance Specification for Organic Multichip Module
(MCM-L) Mounting and Interconnecting Structures
IPC-6018 Microwave End Product Board Inspection and Test (Supersedes IPC-HF-
318A)
J-STD-001B Requirements for Soldered Electrical and Electronic Assemblies J-STD-002A Solderability Tests for Component Leads, Terminations, Lugs, Terminals
and Wires (replaces IPC-S-805)
J-STD-003 Solderability Tests for Printed Boards (replaces IPC-S-804A) J-STD-004 Requirements for Soldering Fluxes – (includes Amendment 1)
J-STD-005 General Requirements and Test Methods for Electronic Grade Solder Paste –
(includes Amendment 1)
J-STD-006 General Requirements and Test Methods for Soft Solder Alloys and Fluxed
and Non-Fluxed Solid Solders for Electronic Applications – (includes
Amendment 1)
J-STD-020 Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices
2 IPC TM-650 Test Methods Manual
Section 2.1 Visual Test Methods(目视检测
方法
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)
Section 2.2 Dimensional Test Methods(物理量纲测试方法)
Section 2.3 Chemical Test Methods(化学量纲测试方法)
Section 2.4 Mechanical Test Methods(机械测试方法)
Section 2.5 Electrical Test Methods(电学测试方法)
Section 2.6 Environmental Test Methods(环境测试方法)
PC TM-650 Test Methods Manual
SECTION 2.1 - VISUAL TEST METHODS
2.1.1. Microsectioning - 3/98(显微剖切)或(金相切片
2.1.1.1. Microsectioning, Ceramic Substrate - 12/87
2.1.1.2. Microsectioning - Semi or Automatic Technique Microsection Equipment
(Alternate) - 7/93
2.1.2. Pinhole Evaluation, Dye Penetration Method - 3/76
2.1.3 .Plated-Through Hole Structure Evaluation - 8/76
2.1.5 .Surface Examination, Unclad and Metal Clad Material - 12/82
2.1.6 .Thickness of Glass Fabric - 12/94(玻璃纤维布厚度)
2.1.6.1 .Weight of Fabric Reinforcements - 12/94
2.1.7 .Thread Count of Glass Fabric - 12/94(半固化片的玻璃布线数) 2.1.7.1 .Thread Count, Organic Fibers - 12/87
2.1.8 .Workmanship - 12/94
2.1.9. Surface Scratch Examination Metal Clad Foil - 5/86覆金属箔
表
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面划痕检验) 2.1.10. Visual Inspection for Undissolved Dicyandiamide - 12/94(直观检查双氰胺晶体)
2.1.13a .Inspection for Inclusions and Voids in Flexible Printed Wiring Materials - 5/98 IPC TM-650 Test Methods Manual
SECTION 2.2 - DIMENSIONAL TEST METHODS
2.2.1. Mechanical Dimensional Verification - 8/97
2.2.2. Optical Dimensional Verification - 8/97
2.2.4c. Dimensional Stability, Flexible Dielectric Materials - 5/98
2.2.5. Dimensional Inspections Using Mircosections - 8/97
2.2.6. Hole Size Measurement, Drilled - 8/97
2.2.7. Hole Size Measurement, Plated - 5/86
2.2.8. Location of Holes - 4/73
2.2.10. Hole Location and Conductor Location - 12/83
2.2.12. Thickness of Copper by Weight- 3/76
2.2.12.1. Overall Thickness and Profile Factor of Copper Foils Treated and Untreated –
9/87
2.2.12.2. Weight and Thickness of Copper Foils with Releasable Carriers - 7/89 2.2.12.3. Weight and Thickness Determination of Copper Foils With Etchable Carriers –
7/89
2.2.13.1. Thickness, Plating in Holes, Microhm Method - 1/83(孔镀层厚度-微欧法) 2.2.14. Solder Powder Particle Size Distribution - Screen Method for Types 1-4 - 1/95 2.2.14.1. Solder Powder Particle Size Distribution - Measuring Microscope Method –
1/95
2.2.14.2. Solder Powder Particle Size Distribution - Optical Image Analyzer Method—
1/95
2.2.14.3. Determination of Maximum Solder Powder Particle Size - 1/95 2.2.15. Cable Dimensions (Flat Cable) - 6/79
2.2.16. Artwork Master Evaluation by Use of a Drilled Panel - 12/87 2.2.16.1. Artwork Master Evaluation by Overlay - 12/87
2.2.17. Surface Roughness and Profile of Metallic Foils (Contacting Stylus Technique)-
3/90
2.2.18. Determination of Thickness of Laminates by Mechanical Measurement - 12/94 2.2.18.1. Determination of Thickness of Metallic Clad Laminates, Cross-sectional - 12/94 2.2.19. Measuring Hole Pattern Location-12/87
2.2.19.1. Length, Width and Perpendicularity of Laminate and Prepreg Panels - 12/94 2.2.20. Solder Paste Metal Content by Weight - 1/95
2.2.21. Planarity of Dielectrics for High Density Interconnection (HDI) Microvia IPC TM-650 Test Methods Manual Technology - 11-98 SECTION 2.3 - CHEMICAL TEST METHODS
2.3.1. Chemical Processing, Suitable Processing Material- 4/73
2.3.1.1. Chemical Cleaning of Metal Clad Laminates- 5/86(覆金属箔层压板的化学清洗) 2.3.2f. Chemical Resistance Of Flexible Printed Wiring Materials - 5/98 2.3.3a. Chemical Resistance of Insulating Materials- 2/78
2.3.4. Chemical Resistance, Marking Paints and Inks - 8/97
2.3.4.2. Chemical Resistance of Laminates, Prepreg and Coated Foil Products, by Solvent
Exposure - 12/94
2.3.4.3. Chemical Resistance of Core Materials to Methylene Chloride- 5/86(基材的耐化
) 学性
2.3.5. Density, Insulating Material - 8/97
2.3.6. Etching, Ammonium Persulfate Method - 7/75
2.3.7. Etching, Ferric Chloride Method - 7/75
2.3.7.1. Cupric Chloride Etching Method - 12/94(氯化铜蚀剂方法) 2.3.7.2. Alkaline Etching Method - 12/94
2.3.8a. Flammability, Flexible Insulating Materials- 12/82
2.3.8.1. Flammability of Flexible Printed Wiring- 12/88
2.3.9. Flammability of Prepreg and Thin Laminate - 8/97(印制线路用
材料
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的燃烧性) 2.3.10. Flammability of Laminate - 12/94() 印制线路用层压板的燃烧性
2.3.10.1. Flammability of Soldermask on Printed Wiring Laminate- 8/98(印制线路板上阻
) 焊剂的燃烧性
2.3.11. Glass Fabric Construction- 4/73
2.3.13. Determination of Acid Value of Liquid Solder Flux- Potentiometric and Visual
Titration Methods- 1/95
2.3.14. Print, Etch, and Plate Test- 4/73
2.3.15. Purity, Copper Foil or Plating - 8/97
2.3.16. Resin Content of Prepreg, by Burn-off - 12/94() 半固化片材料的树脂含量
2.3.16.1CResin Content of Prepeg, by Treated Weight--12/94(半固化片材料的树脂含量
(涂覆物称重) )
2.3.16.2. Treated Weight of Prepreg - 12/94
2.3.17. Resin Flow Percent of Prepreg - 8/97(半固化片材料(B阶)的树脂流动度) 2.3.17.1b. Resin Flow of Adhesive Coated Films and Unsupported Adhesive Films - 5/98 2.3.17.2. Resin Flow of "No Flow" Prepreg - 8/97(”不流动”树脂的树脂流动度) 2.3.18. Gel Time, Prepreg Materials - 4/86(预浸渍材料的凝胶时间) 2.3.19. Volatile Content of Prepreg - 12/94(半固化片材料的挥发物含量) 2.3.21. Plating Quality, Hull Cell Method - 8/97
2.3.22. Copper Protective Coating Quality - 2-78
2.3.23. Cure (Permanency) Thermally Cured Solder Mask - 2/88(热固性阻焊剂的固化
(耐久性) )
2.3.23.1a. Cure (Permanency) UV Initiated Dry Film Solder Mask - 2/88(UV诱发的干膜
(耐久性) ) 阻焊剂的固化
2.3.24Porosity of Gold Plating- 2/78
2.3.24.1. Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate
Electrographic Method - 10/85
2.3.24.2. Porosity of Metallic Coatings on Copper-Based Alloys and Nickel (Nitric Acid
Vapor Test) - 8/97
2.3.25. Detection and Measurement of Ionizable Surface Contaminants - 8/97---
Supersedes 2.3.26 and 2.3.26.1(表面污染物的离子检测.动
)2.3.26ASuperseded by Test Method 2.3.252.3.26.1Superseded by Test 态法
Method 2.3.25
2.3.26.2. Mobile Ion Content of Polymer Films - 7/95
2.3.27. Cleanliness Test - Residual Rosin - 1/95
2.3.27.1. Rosin Flux Residue Analysis-HPLC Method - 1/95
2.3.28. Ionic Analysis of Circuit Boards, Ion Chromatography Method - 1/95
紫外光固化材料的相对 2.3.29. Flammability, Flexible Flat Cable- 11/88
2.3.30a. Solvent pH Determination in Anhydrous Flourocarbon Solvents- 11/81 ) 固化程度
2.3.31. Relative Degree of Cure of U.V. Curable Material - 2/88(2.3.32. Flux Induced Corrosion (Copper Mirror Method)- 1/95 2.3.33. Presence of Halides in Flux, Silver Chromate Method - 1/95 2.3.34. Solids Content, Flux - 1/95
2.3.34.1. Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder - 1/95 2.3.35. Halide Content, Quantitative (Chloride and Bromide)- 1/95 2.3.35.1. Fluorides by Spot Test, Fluxes - Qualitative - 1/95
2.3.35.2. Flouride Concentration, Fluxes - Quantitative--1/95 2.3.36. Acid Acceptance of Chlorinated Solvents- 10/85
2.3.37b. Volatile Content of Adhesive Coated Dielectric Films - 5/98 2.3.38. Surface Organic Contaminant Detection Test - 8/97( 表面有机污染物的检测方
(企业内) ) 浊
2.3.39. Surface Organic Contaminant Identification Test (Infrared Analytical Method) –
8/97( 表面有机污染物的检测方法(红外分析法) ) 2.3.40. Thermal Stability - 7/95
IPC TM-650 Test Methods Manual
SECTION 2.4 - MECHANICAL TEST METHODS
2.4.1d. Adhesion, Tape Testing--8/97( 镀层附着力)
2.4.1.1b. Adhesion, Marking Paints and Inks--11/88
2.4.1.2. Adhesion of Conductors on Hybrid Substrates--12/87 2.4.1.3. Adhesion, Resistors (Hybrid Circuits)--12/87
2.4.1.4. Adhesion, Overglaze (Hybrid Circuits)--12/87
2.4.1.5a. Determination of Heat Transfer--5/95
2.4.1.6. Adhesion, Polymer Coating--7/95
2.4.2a. Ductility of Copper Foil--3/76
2.4.2.1d. Flexural Fatigue and Ductility, Foil--3/91
2.4.3d. Flexural Fatigue, Flexible Printed Wiring Materials--5/98 2.4.3.1c. Flexural Fatigue and Ductility, Flexible Printed Wiring--3/91 2.4.3.2c. Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics--3/91 2.4.4b. Flexural Strength of Laminates (at Ambient Temperature)--12/94(刚性绝缘层压
(室温下) ) 材料抗弯曲强度
2.4.4.1a. Flexural Strength of Laminates (at Elevated Temperature)--12/94(刚性绝缘层压
(高温下) ) 材料抗弯曲强度
2.4.5. Folding Endurance, Flexible Printed Wiring Materials--4/73 2.4.6. Hot Oil--4/73
2.4.7a. Machinability, Printed Wiring Materials--7/75
2.4.8c. Peel Strength of Metallic Clad Laminates--12/94(金属箔层压板的剥离强度) 2.4.8.1. Peel Strength, Metal Foil (Keyhole Method for Thin Laminates)--1/86 2.4.8.2a.Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Fluid
Method)--12/94(高温下金属箔层压板的剥离强度热流法) ) 2.4.8.3a.Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Air
Method)--12/94(高温下金属箔层压板的剥离强度(热风法) ) 2.4.8.4. Carrier Release, Thin Copper--1/90
2.4.9d. Peel Strength, Flexible Dielectric Materials--10/88
2.4.9.1Peel Strength of Flexible Circuits - 11/98
2.4.9.2. Bonding Process - 11/98
2.4.10. Plating Adhesion--4/73
2.4.11. Shear Strength Flexible Dielectric Materials--4/73
2.4.12a. Solderability, Edge Dip Method--6/91
2.4.13f. Solder Float Resistance Flexible Printed Wiring Materials--5/98 2.4.13.1. Thermal Stress of Laminates--12/94
2.4.14. Solderability of Metallic Surfaces--4/73
2.4.14.1. Solderability, Wave Solder Method--3/79
2.4.14.2. Liquid Flux Activity, Wetting Balance Method--1/95 2.4.15a. Surface Finish, Metal Foil--3/76
2.4.16a. Initiation Tear Strength, Flexible Insulating Materials--12/82 2.4.17. Tear Strength, Propagation--4/73
2.4.17.1a. Propagation, Tear Strength, Flexible Insulating Materials--12/82 2.4.18b. Tensile Strength and Elongation, Copper Foil--8/80
2.4.18.1. Tensile Strength and Elongation, In-House Plating--8/97 2.4.18.2. Hot Rupture Strength, Foil--7/89
2.4.18.3. Tensile Strength, Elongation, and Modulus--7/95
2.4.19c. Tensile Strength and Elongation, Flexible Printed Wiring Materials--5/98 2.4.20. Terminal Bond Strength, Flexible Printed Wiring--4/73 2.4.21d. Land Bond Strength, Unsupported Component Hole--8/97 弓曲和扭曲) 2.4.21.1c. Bond Strength, Surface Mount Lands Perpendicular Pull Method--5/91 2.4.22.1c. Bow and Twist-Laminate--5/93 2.4.22c. Bow and Twist (Percentage)--6/99(2.4.22.2. Substrate Curvature: Silicon Wafers with Deposited Dielectrics--7/95 2.4.23. Soldering Resistance of Laminate Materials--3/79
2.4.24c. Glass Transition Temperature and Z-Axis Thermal Expansion by TMA—
12/94(玻璃化温度和Z向膨胀-TMA法)
2.4.24.1. Time to Delamination (TMA Method)--12/94
2.4.24.2. Glass Transition Temperature of Organic Films - DMA Method--7/95 2.4.24.3. Glass Transition Temperature of Organic Films - TMA Method--7/95 2.4.24.4. Glass Transition and Modulus of Materials Used in High Density
Interconnection (HDI) and Microvias -DMA Method - 11/98 2.4.24.5. Glass Transition Temperature and Thermal Expansion of Materials Used In
High Density Interconnection (HDI) and Microvias –TMA Method -11/98 2.4.25c. Glass Transition Temperature and Cure Factor by DSC--12/94(玻璃化温度和固
---DSC法) 化系数
2.4.26. Tape Test for Additive Printed Boards--3/79
2.4.27.1b. Abrasion (Taber Method), Solder Mask and Conformal Coating--1/95(阻焊剂
:Taber) 法 和覆形涂层耐磨擦性测试
2.4.27.2a. Solder Mask Abrasion (Pencil Method)--2/88(阻焊剂耐磨擦性测试:Pencil法) 2.4.28b. Adhesion, Solder Mask (Non-Melting Metals)--8/97(阻焊膜附着力(在不熔金
) ) 属上
2.4.28.1b. Adhesion, Solder Resist (Mask), Tape Test Method--3/98(阻焊膜附着力测
:(胶带法) ) 试
2.4.29b. Adhesion, Solder Mask, Flexible Circuit--2/88(挠性印制电路阻焊剂的附着力
) 测试
2.4.30. Impact Resistance, Polymer Film--10/86
2.4.31a. Folding, Flexible Flat Cable--4/86
2.4.32a. Fold Temperature Testing, Flexible Flat Cable--4/86
2.4.33c. Flexural Fatigue and Ductility, Flat Cable--3/91
2.4.34. Solder Paste Viscosity - T-Bar Spin Spindle Method (applicable for 300,000 to
1,600,000 Centipose)--1/95
2.4.34.1. Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less Than
300,000 Centipose)--1/95
2.4.34.2. Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to
1,600,000 Centipose)--1/95
2.4.34.3. Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000
Centipose)--1/95
2.4.34.4. Paste Flux Viscosity - T-Bar Spindle Method--1/95 引线 2.4.35. Solder Paste - Slump Test--1/95 ) 金属化通孔的模拟返工2.4.36b. Rework Simulation, Plated-Through Holes for Leaded Components--8/97(2.4.37a. Evaluation of Hand Soldering Tools for Terminal Connections--7/91 2.4.37.1a. Evaluation of Hand Soldering Tools for Printed Wiring Board Applications—
7/91
2.4.37.2. Evaluation of Hand Soldering Tools on Heavy Thermal Loads--7/93 2.4.38a. Prepeg Scaled Flow Testing--6/91(半固化片流动性的换算测试) 2.4.39a. Dimensional Stability, Glass Reinforced Thin Laminates--2/86(增强型玻璃纤维
) 薄层压板尺寸稳定性测试
2.4.40. Inner Layer Bond Strength of Multilayer Printed Circuit Boards--10/87 2.4.41. Coefficient of Lintear Thermal Expansion of Electrical Insulating Boards--3/86(电
) 气绝缘材料线性热膨胀系数测试方法
2.4.41.1a. Coefficient of Thermal Expansion by the Vitreous Silica (Quartz) Dilatometer
Method--8/97
2.4.41.2. Coefficient of Thermal Expansion - Strain Gage Method--8/97 2.4.41.3. In-Plane Coefficient of Thermal Expansion, Organic Films--7/95 2.4.41.4. Volumetric Thermal Expansion Polymer Coatings on Inorganic Substrates--7/95 2.4.42. Torsional Strength of Chip Adhesives--2/88
2.4.42.1. High Tempreature Mechanical Strength Retention of Adhesives--3/88 2.4.42.2. Die Shear Strength--2/98
2.4.42.3. Wire Bond Pull Strength--2/98
2.4.43. Solder Paste - Solder Ball Test--1/95
2.4.44. Solder Paste - Tack Test--3/98
2.4.45. Solder Paste - Wetting Test--1/95
2.4.46. Spread Test, Liquid or Extracted Solder Flux, Solder Paste and Extracted Cored
Wires or Preforms--1/95
2.4.47. Flux Residue Dryness--1/95
2.4.48. Spitting of Flux-Cored Wire Solder--1/95
2.4.49. Solder Pool Test--1/95
2.4.50. Thermal Conductivity, Polymer Films--7/95
2.4.51. Self Shimming Thermally Conductive Adhesives--1/95
IPC TM-650 Test Methods Manual
SECTION 2.5 - ELECTRICAL TEST METHODS
2.5.1b. Arc Resistance of Printed Wiring Materials--5/86(印制线路基材的耐弧性) 2.5.2a. Capacitance of Insulating Materials--7/75
2.5.3b. Current Breakdown, Plated Through Holes--8/97
2.5.4. Current Carrying Capacity, Multilayer Printed Wring--4/73(多层线路板耐电流) 2.5.4.1a. Conductor Temperature Rise Due to Current Changes in Conductors--8/97 2.5.5a. Dielectric Constant of Printed Wiring Materials--7/75
2.5.5.1b. Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of
Insulating Material at 100MHz (Contacting Electrode Systems)--5/86 2.5.5.2a. Dielectric Constant and Dissipation Factor of Printed Wiring Board Material—
Clip Method--12/87(印制线路板材介电常数和损耗因数妁测试:夹持法) 2.5.5.3c. Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of
Materials (Two Fluid Cell Method)--12/87(电容率(介电常数)和损耗角正切
(损耗因数)的测试(二流体槽法) )
2.5.5.4. Dielectric Constant and Dissipation Factor of Printed Wiring Board Material—
Micrometer Method--10/85
2.5.5.5c. Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and
Dissipation Factor) at X-Band--3/98
2.5.5.5.1. Stripline Test for Complex Relative Permittivity of Circuit Board Materials to
14 GHZ--3/98
2.5.5.6. Non-Destructive Full Sheet Resonance Test for Permittivity of Clad Laminates—
5/89
2.5.5.7. Characteristic Impedance and Time Delay of Lines on Printed Boards by TDR—
11/92
2.5.5.8. Low Frequency Dielectric Constant and Loss Tangent, Polymer Films--7/95 刚性印制电路材料 2.5.5.9. Permittivity and Loss Tangent, Parallel Plate, 1MHz to 1.5 GHz--11/98 ) 介质击穿强度的测试2.5.6b. Dielectric Breakdown of Rigid Printed Wiring Material--5/86(2.5.6.1a. Dielectric Strength, Polymer Solder Mask and/or Conformal oatings--2/88(聚合
) 物阻焊剂及覆形涂层的介电强度
2.5.6.2a. Electric Strength of Printed Wiring Material--8/97(印制线路材料的抗电强度) 2.5.6.3Dielectric Breakdown Voltage and Dielectric Strength--10/86 2.5.7c. Dielectric Withstanding Voltage, PWB--8/97(印制电路板的耐电压) 2.5.8a. Dissipation Factor of Flexible Printed Wiring Material--7/75 2.5.10a. Insulation Resistance, Multilayer Printed Wiring (Between Layers)--12/87 2.5.10.1. Insulation Resistivity for Adhesive Interconnection Bonds--11/98 2.5.11. Insulation Resistance, Multilayer Printed Wiring (Within a Layer)--4/73 2.5.12. Interconnection Resistance, Multilayer Printed Wiring--4/73 2.5.13a. Resistance of Copper Foil--3/76
2.5.14a. Resistivity of Copper Foil--8/76
2.5.15a. Guidelines and Test Methods for RFI-EMI Shielding of Flat Cable--10/86 2.5.16a. Shorts, Internal on Multilayer Printed Wiring--11/88(多层印制电路板内部的短
) 路
2.5.17e. Volume Resistivity and Surface Resistance of Printed Wiring Materials--5/98 2.5.17.1a. Volume and Surface Resistivity of Dielectric Materials--12/94(印制线路层压
) 板体积电阻率和表面电阻率
2.5.17.2. Volume Resistivity of Conductive Resistance Used in High Dentisty
Interconnection (HDI) and Microvias, Two-Wire Method—11/98 2.5.18b. Characteristic Impedance Flat Cables (Unbalanced)--7/84
2.5.19a. Propagation Delay of Flat Cables Using Time Domain Reflectometer--7/84 2.5.19.1a. Propagation Delay of Flat Cables Using Time Domain Reflectometer (TDR)—
7/84
2.5.21a. Digital Unbalanced Crosstalk, Flat Cable--3/84
2.5.24. Conductor Resistance, Flexible Flat Cable--6/79
2.5.25a. Dielectric Withstand Voltage Flexible Fat Cable--11/85
2.5.26a. Insulation Resistance Flexible Flat Cable--11/85
2.5.27. Surface Insulation Resistance of Raw Printed Wiring Board Material--3/79 2.5.28a. Q Resonance, Flexible Printed Wiring Materials--4/88(挠性印制线路材料谐振
Q值的测试)
2.5.30. Balanced and Unbalanced Cable Attenuation Measurements--12/87 2.5.31. Current Leakage (Through Overglaze Films)--12/87
2.5.32. Resistance Test, Plated Through-Holes--12/87
2.5.33. Measurement of Electrical Overstress from Soldering Hand Tools--11/98 2.5.33.1. Measurement of Electrical Overstress from Soldering Hand Tools (Ground
Measurements)--11/98
2.5.33.2. Measurement of Electrical Overstress from Soldering Hand Tools (Transient
Measurements)--11/98
2.5.33.3. Measurement of Electrical Overstress from Soldering Hand Tools (Current
Leakage Measurements)--11/98
2.5.33.4. Measurement of Electrical Overstress from Soldering Hand Tools (Shielded
Enclosure)--11/98
IPC TM-650 Test Methods Manual
SECTION 2.6 - ENVIRONMENTAL TEST METHODS
印制线路材料的耐霉性) 2.6.2c. Water Absorption, Flexible Printed Wiring--5/98 2.6.1e. Fungus Resistance Printed Wiring Materials--8/97(2.6.2.1a. Water Absorption, Metal Clad Plastic Laminates--5/86(覆金属塑性层压板的吸
) 水性
2.6.3e. Moisture and Insulation Resistance, Printed Boards--8/97(,,刚性刚挠挠性印制线
) 路板的耐湿性和绝缘电阻
2.6.3.1c. Moisture and Insulation Resistance-Polymeric Solder Masks and Conformal
Coatings--11/98() 聚合物阻焊剂和敷形涂层的耐湿性和绝缘电阻
2.6.3.2b. Moisture and Insulation Resistance, Flexible Base Dielectric--5/88 2.6.3.3a. Surface Insulation Resistance, Fluxes--1/95
2.6.4a. Outgassing, Printed Boards--8/97
2.6.5c. Physical Shock, Multilayer Printed Wiring--8/97
2.6.6b. Temperature Cycling, Printed Wiring Board--12/87
2.6.7a. Thermal Shock and Continuity, Printed Board--8/97
2.6.7.1. Thermal Shock--Polymer Solder Mask Coatings--2/88(聚合物阻杆剂涂层的耐
) 热冲击
2.6.7.2a. Thermal Shock, Continuity and Microsection, Printed Board--8/97 2.6.8d. Thermal Stress, Plated Through-Holes--3/98
2.6.8.1. Thermal Stress, Laminate--9/91
2.6.9a. Vibration, Rigid Printed Wiring--8/97
2.6.9.1. Test to Determine Sensitivity of Electronic Assemblies to Ultrasonic Energy—
1/95
2.6.9.2. Test to Determine Sensitivity of Electronic Components to Ultrasonic Energy—
1/95
2.6.10a. X-Ray (Radiography), Multilayer Printed Wiring Board Test Methods--8/97(多
X射线检查) 层印制电路板
2.6.11b. Hydrolytic Stability Solder Mask and/or Conformal Coating--11/88(阻焊剂和敷
) 形涂层的水稳定性
2.6.12. Temperature Testing, Flexible Flat Cable--6/79
2.6.13. Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed
Wiring--10/85
2.6.14a. Resistance to Electrochemical Migration, Polymer Solder Mask--8/87(聚合物
) 阻焊剂抗电迁移性
2.6.15b. Corrosion, Flux--1/95(助焊剂腐蚀性测试)
2.6.16. Pressure Vessel Method for Glass Epoxy Laminate Integrity--7/85(环氧玻璃布层
:压力容器法) 压板完善性试验方法
2.6.16.1. Moisture Resistance of HDIS Under High Temperature and Pressure (Pressure
Vessel)--8/98
2.6.17. Hydrolitic Stability, Flexible Printed Wiring Material--12/82 2.6.18a. Low Temperature Flexibility, Flexible Printed Wiring Materials--7/85 2.6.19. Environmental and Insulation Resistance Test of Hybrid Ceramic Multilayer
Substrate Boards--12/87
2.6.20a. Assessment of Plastic Encapsulated Electronic Components for Susceptibility to
Moisture/Reflow Induced Damage--1/95
2.6.21. Service Temperature of Flexible Printed Wiring--12/882.6.22Superseded by J-
STD-035 (.pdf file)
2.6.23. Test Procedure for Steam Ager Temperature Repeatability--7/93
2.6.24
2-6-24. Junction Stability Under Environmental Conditions