PCB相关专业术语英汉对照

PCB相关专业术语英汉对照安装孔mountinghole跨接线jumperwire凹痕dents跨距离span凹蚀etchback拉出强度pulloutstrength凹蚀死角etchback拉尖solderprejection白斑measling拉离强度pullstrength白度whitenness拉伸弹性模量tensilemodulesofelasticity板边连接器edge-boardconnector拉脱强度pulloffstrength板厚孔径比aspectratio冷冲coldpunching半加成法semi-additiveprocess冷流coldflow半润湿dewetting离子清洁度cleanlinessionic半润湿dewetting离子污染ionizablecontaminant包装packing连接盘land背板backplance连接盘起翘liftedlands边距edgespacing连接盘图形landpattern边缘edges连接器区connertorarea边缘腐蚀试验electrolyticcorrcosiontestatedge连通性continuity扁簧式接触件bellowscontact连线表from-to-list扁平封装flatpackage裂缝split标记marking裂缝(镀铜）cracking标志mark零省略zerosuppression表面安装技术surfacemounttechnology(SMT)领先产品leadingedgeproduct表面安装元（器件）surface-mountcomponent(device)笼状缺陷birdcage表面电阻surfaceresistance露纤维fibreexposure表面电阻率surfaceresistivity露织物weaveexposure表面腐蚀试验surfacecorrosiontest绿油窗clearance表面间连接interfacialconnection逻辑图logicdiagram表面空洞voidinsurface裸铜覆阻焊 工艺 钢结构制作工艺流程车尿素生产工艺流程自动玻璃钢生产工艺2工艺纪律检查制度q345焊接工艺规程 (SMOBC)soldermaskonbarecopper表面铜导线厚度conductorthicknessexternal麻点pit丙烯酸树脂acrylicresin盲埋孔blind(buried)via波峰焊wayesoldering毛刺burrs玻璃布glassfabric毛刺（箔）foilburr玻璃化温度glasstransitiontemperature毛圈长featherlength玻璃纤维(E)E-glassfibre铆钉rivetpin玻璃纤维突出glassfiberprotrusion密（脚）距式脚格列封装品BGA剥离强度peelstrength密度（光密度）density箔（剖面）轮廓foilprofile模拟返工reworksimulation薄层压板thinlaminate母板motherborad薄铜箔thincopperfoil目检visualexamination不饱和聚酯unsaturatedpolyester内部识别标志internalidentificationmark不饱满焊点insufficientsolderconnection内层internallayer不润湿nonwetting内层分离innerlayerseparation布局placement内层夹杂物inclusioninnerlayer布局效率layoutefficiency内层孔环annularringinternal布设总图masterdrawing内层曝光innerlayerfullyauomaticexposure布线routing内层铜箔裂缝crackofinternalfoil布线密度circuitdensity内审internalaudit步进重复step-and-repeat耐电镀抗蚀剂platingresist材料检验materialsinspection耐电弧性arcresistance参考尺寸datumdimension耐电压dielectricwithstandingvoltage参考基准datumreference耐化学性chemicalresistance残余铜estraneouscopper耐热性thermalporformance测试板testboard耐热性heatresistance测试图形testpattern耐震动vibration側蚀undercut挠性覆铜板flexiblecoppercladlaminate层间距layer-to-layerspacing挠性覆铜箔绝缘薄膜flexiblecopper-claddielectricfilm层间连接internalyerconnection挠性印制板flexibleprintcircuit(FPC)层压（复合）laminating挠性印制板flexibleprintedborad层压板laminate捻度裂缝twistofyarn层压板裂缝crackoflaminate凝胶时间geltime层压板面uncladlaminatesurface凝渍体gel层压板缺陷laminateimperfections偶联剂couplingagent层压板完整性laminateintegrity排气outgassing层压膜板laminatemouldingplate盘址anchoring插（贴）装mounting喷嘴sparynozzle差分驱动differentiadrive坯布greyfabric差分蚀刻法differentialetching坯料blank差示扫描量热法differentialscanningcaborimetry偏移excursion潮湿和绝缘电阻moistureandinsulationresistance偏址连接盘offsetland成品板productionboard偏置定位polariztion成像imaging拼板multipleprintedpanel尺寸稳定性dimensionalstability拼底版multiple-imageproductionmaster尺寸 要求 对教师党员的评价套管和固井爆破片与爆破装置仓库管理基本要求三甲医院都需要复审吗 dimensionalrequirements拼图multiplepattern冲切punching品质因素Qfactor(Q值）抽查spot-check平纹组织plainweave出厂交收条件inspectinofproductfordelivery破坏holebreakout储存storage曝光exposure储存期storagelife曝光灯UV-lamp处理剂含量finishlevel曝光机能量计uvmeter处理面treatedside齐平导线flushconductor处理物转移treatmenttransfer齐平印制板flushprintedborad处理织物finishedfabric起泡blister触变性thixotopic气孔blowhole穿线弯连clinched-wirethroughconnection气相再流焊vaporphasefeflowsoldering(VPS)传输线transmissionline铅lead串扰crosstalk桥接solderbridge垂直度rectangularity切削量chipload粗糙面matteside清晰度definition粗化面mattfinish去毛刺deburr大众化产品commodityproduct去铜箔面foilremovalsurface带载式元件tapedcomponents去钻污smearremoval带载自动安装tapeautomatedbonding(TAB)缺胶区resin-starvedarea带状线stripline缺口nick单板底版single-imageproductionmaster缺纬mis-picks单面印制板single-sideprintedboard绕接solderlesswrap单体simplesubstance热冲击thermalshock刀具标记toolmarks热导率thermalconductivity刀片blade热风整平hotairlevelingline导电箔conductivefoil热风整平HASL导电图形conductivepattern热隔离heatshield导通孔via热机分板thermal-machanicalanalysis导线conductor热膨胀系数coefficientofthermalexpansion导线（体）层conductorlayer热熔fusing导线底距conductorbasespacing热熔液fusingfluid导线底宽conductorbasewidth热态强度保留率hotstrengthretention导线厚度conductorthickness热应力方法thermalstressmethod导线厚度conductorthickness热应力试验thermaltest导线厚度减少conductorthicknessintermalcopperfoil人力资源部humanresourcedepartment导线间距conductorspacing乳胶面emulsionside导线间距缩小conductorspacingreduction润湿剂wettingagent导线精度conductordefinition三级封装(各种电子整机产品)electronicequipment导线宽度conductorwidth三聚氰胺甲醛树脂melamineformaldehyderesin导线宽度减少conductorwidthreduction散热层heatsinkplane导线面conductorside扫描式电子显微镜SEM导线缺陷conductorimperfections闪镀strike导线 设计 领导形象设计圆作业设计ao工艺污水处理厂设计附属工程施工组织设计清扫机器人结构设计 间距designspacingofconductor烧焦镀层burnedpalting导线设计宽度designofconductor烧灼cauterization倒角chanfer设计规则检查designrulechecking等离子体显示器PDP射频干扰RFI低压压制10W-Pressuremoulding伸长率elongation第一导线层conductorlayerNo.1渗出bleading电磁干扰EMI生产底版productionmaster电磁屏蔽electromagneticshielding生物制品biologicalproduct电镀palting施工质量constructionquality电解清洗electrolyticcleaning湿法贴膜wetlamination电解铜箔electrodepositedcopperfoil湿强度保留率wetstrengthretention电路层circuitlager湿热后绝缘电阻insulationresistanceanterexposuretomoisture电路绝缘性insulationresistance蚀刻etching电路修复repaircircuit蚀刻剂etchant电木板riserplate蚀刻系数etchfactor电气性能electroniccharacteristics蚀刻指示图etchingindicator电桥接electricalbridging食品food电容耦合capacitivecoupling适用期potlife电源层voltageplane术语terms电源层隔离voltageplaneclearance树脂凹缩resinrecession电子制造服务EMS树脂含量resincontent垫内孔via-in-pad树脂流动度resinflow叠层layup树脂塞孔resinfill钉头nailheading树脂钻污resinsmear定位特征toolingfeature数字化digitizing定义definitions双列直插式封装dual-in-linepackage(DIP)镀层分离platingseparation双马来酰亚胺三嗪树脂bismaleimide-triazineresin镀层附着力platingadhesion双面印制板double-sideprintedborad镀层裂缝crackofplating双氰胺dicyandiamide镀层突沿voerhang水平显微剖切horizontalmicrosection镀层完整性platerintrgrity撕裂强度tearstrength镀层增宽outgrowth损耗因数dielectricdissipationfactor镀层折叠platingfolds探测点probepoint镀覆plating陶瓷印制板ceramicsubstrateprintedborad镀覆孔platedthroughhole特性阻抗characteristicinpedance镀覆孔结构检验plated-throughholestructuretest体积电阻volumeresistance镀通孔paltedthrough体积电阻率volumeresistivity镀屑sliver贴膜rollercoater断经endmissing贴膜机热压辘hotroll断裂长breakinglength贴装装连SMT对位registration通孔安装through-holemounting对准标记registermark通孔孔径viadiameters多层次印制板multilayerprintedborad铜箔copperfoil多层叠层mutilayerlayup铜箔面copper-cladsurface多层线路板multilayerPCB铜纯度copperpurity多层压制multilayerlaminating凸瘤bump多官能环氧树脂polyfunctionalepoxyresin凸起bulge多重布线印制板multi-wringprintedborad图形pattern返工rework图形电镀patternplating防静电用品anti-staticelectricityproduct图形转移imaging防霉性fungusresistance图形转移patterntranfer防锈处理stainproofing涂胶铜箔adhesirecoatedfoil防粘膜releasefilm涂胶粘剂绝缘薄膜adhesivecoateddielectricfilm放气degassing退火铜箔annealedcopperfoil飞针测试机flyingprodetester拖焊dragsoldering非导电图形non-conductivepattern脱膜剂releaseagent非功能表面间连接nonfunctionalinterfacialconnection外层externallayer非功能连接盘nonfunctionalland外层孔环annularringexternal非支撑孔unsupportedhole外层铜箔裂缝crackofexternalfoil非支撑孔孔环annularringofunsupoportedhiole外镀层overplate非织布non-wovenfabric外观检查externallyinspection分辨率resolution外来夹杂物foreigninclusions分步层stepdrilling外形线trimline分部焊接stepsoldering弯度camber分层delamination弯曲强度flexuralstrength分流阴极platingthief网版stencial分散能力throwingpower网表netlist酚醛树脂phenolicresin网格grid粉红环pinkring网印screenprinting封装package网状残锡solderwebbing敷形涂层conformalcoating微带线microstrip敷形涂层微裂纹crazingofconformalcoating微导通孔microviahole浮焊试验solderfloatteat微电子microelectronics辅面secondaryside微裂纹crazing负凹蚀negativeetchback微蚀soft-etching负像negative微蚀刻microetch负像图形nagativepattern纬向weft-wise;　filling-wise负性抗蚀剂negative-actingresist纬斜bias附加连线haywire位置定位槽polarizinghot附连测试板testcoupon温度指数temperatureindex(TI)附着力adhesion无连接盘孔landlesshole复合层压板compositelaminate无卤型halogen-free复合金属箔compositemetallicmaterial无支撑粘剂膜unsupportedadhesivefilm富胶区resin-richarea吸水高度heightofcapillayrise覆箔clad稀松织物wovenscrim覆箔板厚度metal-cladlaminatethickness锡珠solderplugs覆盖层coverlayer洗孔holecleaning覆盖检验板inspectionoverlay显布纹weavetexture覆金属箔基材metal-cladbasematerial显微剖切mircosectioning覆铜箔层压板copper-cladlaminate显微剖切技术microsectiontechnology干膜光致抗蚀剂dryfilmphotoresist相比起痕指数comparativetrackingindex干扰信号interferencesignal相对坐标incremental刚挠印制板flex-rigidprintedborad消除应力stressrelief刚性单面印制板rigidsingle-sidedprintedborad斜孔splay刚性多层印制板rigidmultilayerprintedboard芯板core刚性双面印制板rigiddouble-sidedprintedborad芯带拆焊solderwicking刚性印制板rigidprintedboard芯片尺度级封装品CSP高层印制线路板highlayercountPCB芯片载体chipcarrier高可靠性highreliable芯片直装chip-on-board(COB)高密度互连highdensityinterconnect(HDI)芯吸wicking高频电子机器highfrequencyelectronicmachine芯吸作用wicking高压压制high-pressuremoulding信号层signalplane隔离孔clearancehole修复repair 工程 路基工程安全技术交底工程项目施工成本控制工程量增项单年度零星工程技术标正投影法基本原理 管理projectmanagement修复repairing工程设计engineerdesigning修整tuchingup工程图engineeringdrawing溴化环氧树脂brominatedepoxyresin工业除湿加湿eliinating(oradding)dampsystem虚焊点coldsolderconnection工艺导线platingbar讯号完整性signalintegrity弓曲和扭曲bowandtwist压板pressplaten弓纬bowofweave压板间距daylight固化cure压垫材料cushion固化剂curingagent压痕dent固化时间curingtime压配合接触件press-fitcontact拐角corner压延铜箔rolledcopperfoil关键工序keyprocess压制周期mouldingcycle管位钉stackpin掩蔽法tenting光绘图photoplotting验收态asreceived光亮剂brightener验收态表面绝缘电阻insulationresistanceasrec.光密度尺grayscale氧指数oxygenindex(OI)光面shinyside液体光致抗蚀剂liquidphotoresist光梯尺stepscale液体光致阻焊剂liquidphotorseneitivesolderresist光致抗蚀剂photoresist一级封装(集成电路)ICpackaging过量焊点excesssolderconnection医药medicine过量松香焊点resinsolderconnection仪器检验equipmentcalibration过热焊点overheatedsolderconnection移位焊点disturbed海棉吸水辘sponzeroller异物inclusion焊点solderconnection银盐底片silverfilm焊缝solderfilet引线伸出长度leadprojection焊膏solderpaste印制printing焊剂flux印制板printedboard焊接连接区solderconnectionareas印制板尺寸boarddimensions焊接面solderside印制板厚度printedboardthickness焊料solder印制板计算机辅助设计printedboardcomputer-aideddesign焊料润湿wetting印制板总厚度totalboardthickness焊料塞solderplugs印制板组装件printedboardassembly焊料整平solderleveling印制板组装图printedboardassemblydrawing焊盘pad印制插头edgeboardcontact焊盘起翘liftedlands印制电路printedcircuit焊渣dross印制脚（贴装焊盘）footprint黑化blackoxidation印制接触片printedcontact横向crosswisedirection印制线路printedwiring红化redoxidation印制线路布设printedwiringlayour红外再流焊infraredreflowsoldering(IRS)印制元件printedcomponent后固化postcure永久性保护层permanentresist厚薄段mark用途application互串杂讯crosstalknoise优质焊点preferredsolderconnection互连缺陷interconnectingdefect有机污染organiccontamination化学蚀刻chemical-etching有焰燃烧flamingcombustion划痕scratch余隙孔accesshole环境试验environmenttesting鱼眼fisheye环形断裂circumferentialseparation预浸材料prepreg环氧树脂epoxyresin预浸材料固化厚度prepregcuredthickness环氧值epoxyvalue预制内层覆箔板masslaminationpanel黄菲林diazofilm元件插脚componentpin挥发物含量volatilecontent元件孔componenthole汇流条busbar元件露出端leadextension混合安装技术mixedcomponentmountingtechnlogy元件密度componentdensity活化activating元件面componentside火山灰磨辘pumicbrush元件引线componentlead机械缠绕mechanicalwrap原理图schematicdiagram机械冲击mechanicalshock原始光洁面platefinish机械加工性machinability云织waviness基材basematerial运输shipment基材厚度basematerialthickness晕圈haloing基础知识培训elementrayknowledge杂讯noise基膜面basefilmsurface载流量current-carryingcapacity基准边referenceedge载体箔carrierfoil基准尺寸basicdimension再流焊reflowsoldering激光钻孔机laserdrilling在线测试in-linetest挤压引线swagedlead在制板panel计算机辅助设计技术CAD脏污stain计算机辅助制造技术CAM增强材料reinforcingmaterial技术服务technicalservices摘要abstract加成法additiveprocess粘合力增强处理adhesionpromotion加成法用层压板laminateforadditiveprocess粘合强度bondstrength加工规范manufacturingspecification粘接片bondingsheet加工图manufacturingdrawing粘接增强处理(目检)bondenhancementtreament(visual)加工质量workmanship粘结层bondinglayer加工中测蚀undercutinprocess粘结剂binder夹杂物inclusion粘结增强处理bondenhancingtreatment减成法subtractivepeocess粘性时间tacktime剪切板cut-tosizepanel照相底版artwork剪切强度shearstrength照相底片photographicfilm检验分类categoriesforinspection照相底图artworkmaster检验条件inspectionconditions照相缩小尺寸photographicreductiondimesion检验职责responsibilityforinspection照相原版originalproductionmaster键key遮光剂opaquer键槽keyingsolt折痕crease胶化颗粒gelationparticle折弯引线clinchedlead胶粘剂adhesive针孔pinhole胶粘剂adhesive针孔pinhole胶粘剂面adhesiveface真空吸锡法pulsevacumtinremoval角标cornermark整板电镀panelplating阶树脂(A阶)A-stageresin整平剂levelingagent接触电阻contactresistance正向rightreading接触脚contactangle正像positive接触面积contactarea正像图形positivepattern接触压力kisspressure正性抗蚀剂positive-actiongresist接地ground支撑孔supportedhole接地层groundplane支撑面supportingplane接地层隔离groundplaneclearance织物经纬密度threadcount节距pitch织物组织weavestructure结构完整性structuretolerance直角板边连接器right-angleedgeconnector结瘤nodules制作工艺manufacturingtechnology结瘤nodule质量保证条款qualityassuranceprovisions介电常数dielectricconstant质量一致性检验电路qualityconformancetestcircuit介电击穿dielecricbreakdown中心距centertocenterspacing介电强度dielectricstrength重氮底片diazofilm介质层厚度dielectricthickness重合度registration介质耐电压dielectricwithstandingvoltage轴向引线axiallead金属箔裂缝crackoffoil皱褶wrinkle金属化metallization主面primaryside金属芯matalcore注尺寸孔dimensionedhole金属芯覆铜箔层压板metalcorecopper-cladlaminate装联构件packagingandinterconnectingstructure金属芯印制板metalcoreprintedboard装联件packagingandinterconnectingassembly进给速率feedrate锥口孔flare进给转速比feedrotationrate灼热燃烧glowingcombu浸焊dipsoldering啄层peckdrilling浸亮brightdip字符legend浸润剂size自熄性self-extinguishing浸润剂残留量sizeresidue综合测试图形compositetestpattern浸润剂含量sizecontent棕化brownoxidation浸渍impregnating纵向lengthwisedirection;machinedirection浸渍绝缘纸impregnatinginsulationpaper阻焊soldermask经向warp-wise阻焊干膜dryfilmsoldermask晶须whiskers阻焊剂solderresist(soldermask)精密仪器preciseinstrument阻焊剂solderresist净化工程purificationproject阻焊印料soldermaskink径向电间距internalspacing阻抗测试impedancetesting镜像拼版flipflop阻燃剂flameretardant聚芳酰胺纤维纸aromaticpolyamidepaper阻燃性elammabilityretardant聚合物polyer组装密度packagingdensity聚四氟乙烯polytetrafluoetylene(PTFE)钻孔drilling聚酰亚胺树脂polyimideresin钻孔文件NC-drill聚酯树脂polyesterresin最先进产品stateoftheartproduct聚酯纤维非织布non-wovenpolyesterfabric最小电气间距minimumelectricalspacing绝对坐标absolute最小环宽minimunannularring绝缘电阻insulationresistance最终涂覆覆盖finalfinishcoverage绝缘性isolation预防性的preventive开槽接触件bifurcatedcontace抑制行动containmentaction开窗口cross-hatching不良现象failurephenomenon抗拉强度tensilestrength不良比率failurerate抗蚀镀层platerresist良品normalgood可焊性solderability存货inventory可靠度reliability抱怨complaint可燃性flammability空调系统airconditionersystem空洞void空气净化purifyingair孔壁holebarrel孔壁空洞holevoid孔长较短的导孔shortvialengths孔底连接盘targerland孔环（外层）annularring(outlayer)孔径和孔图精度holepatternaccuracyandsize孔口连接盘captureland孔密度holedensity孔图holepattern孔图精度toleranceofholediameter孔位holelocation