【SMT资料】BGA双球(枕头效应)原因分析及改善对策BGA soldering-Head in pillBGASoldering-HeadInPillowIn-situobservationofBGAsolderingClassificationofBGAsolderingfailuremodeCasestudyforBGAsolderingOutline1-1ObservationofBGAsoldering----gapchangeIn-situobservationofBGAsolderingPeakTemp.CoolingdownPKGPCBSoldersphereSolderpasteFluxcleanti...
BGASoldering-HeadInPillowIn-situobservationofBGAsolderingClassificationofBGAsolderingfailuremodeCasestudyforBGAsolderingOutline1-1ObservationofBGAsoldering----gapchangeIn-situobservationofBGAsolderingPeakTemp.CoolingdownPKGPCBSoldersphereSolderpasteFluxcleantinoxideSolderball&pastemeltatmeltingpointThickeroxideandweakerfluxactivitycausednon-meltingDuringpeak&coolingNon-meltingcausedheadinpillowReflowProfileofProcessClassificationofBGAsolderingfailuremodea.Voidb.Bridged.Cracke.Head-in-Pillowf.Non-wettingc.Missingballg.de-wettingh.shifti.solderballHead-in-pillowheatingheatingcoolingPeakTempBGAassemblyproblemanalysisVoidReflowPCBsubstrateBGAballPasteFluxPowdersizealloycompositionActivatorViscosityOxidationcontaminationCleannessshelflifeSurfacefinishDesignofpadOxidationofpadDegausstimingBridgeProcessSubstrateSolderFluxBendingMissmountingSlumpDewettingPCBsubstrateBGAballPasteFluxAlloycompositionOxidationcontaminationCleanness&shelflifeSurfacefinishOxidationofpadActivatorCrackPCBsubstrateSolderReflowconditionAlloycompositionDesignBendingPillowAssemblyDeviceSolderBallSubstrateSurfaceissueShapeIssueCompositiondesignSplitSurfaceoxidationResidueoffluxContaminationCo-planarityBallsizedesignBendingSubstrate(PCB)PasteReflowMountingBendingAlloycompositiondesignPrintingTackinessdecayHeightorvolumeinsufficientFluxactivatorefficiencyHeatinsufficientOver-preheatFluxactivatordecayOxidationofBGAballHalf-meltingornon-meltingPickingPrecisionBGACaseStudyBGAHead-in-pillowdefectissueHead-in-pillowcross-sectionviewComponentinspectionTherearesomeblackareasonthesolderballSEM-EDSanalysisNormalsurface:C、O<10%TheblackareahasS、Brelements,andhigherC、OcontentonthesurfaceSEM-EDSanalysisNormalsurfacehashigherOxygencontentTheblackareahasSelements,andhigherC、OcontentonthesurfaceSEMinspectionSEMinspectionSEMinspectionSMTreflow-ProfileRedsettingprofileGreenrealprofileSMTreflow-Shenmaosolderpastepre-heatHeatingto220℃Heatingto230℃Heatingto210℃Coolingto235℃Coolingto225℃Heatingto244℃Heatingto240℃SMTreflow-ShenmaosolderpasteCoolingto100℃Coolingto215℃Shenmaosolderpastedoesnothaveheadinpillowresultduetogoodfluxperformance.SMTreflow-ShenmaosolderpasteThanksforyourattention!
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