MIL-HDBK-2164A

I I 1 I I 1 MIL-HDBK-2164A 19 June 1996 SUPERSEDING MIL-HDBK-2164(SH) 16 January 1996 DEPARTMENT OF DEFENSE HANDBOOK ENVIRONMENTM-J STRESS SCREENING PROCESS FOR ELECTRONIC EQUIPMENT THIS HANDBOOK IS FOR GUIDANCE ONLY. DO NOT CITE THIS DOCUMENT AS A REQUIREMENT. AMSC NIA AREA RELI Downloaded from http://www.everyspec.com on 2010-06-06T6:29:04. ,., .._. -.. —.. MIL-HDBK-2164A FOREWORD 1. This handbook is approved for use by all Departments and Agencies of the Department of Defense (DoD) 2. This handbook is for guidance only. This handbook cannot be cited as a requirement. If it is, the contractor does not have to comply. 3. The current emphasis on quality, reliability and hardware design integrity has resulted in efforts to provide a sound and inherently reliable design. The increased complexity and density of packaging of contemporary electronic equipment amplifies the ever present problems of detecting and correcting latent manufacturing defects. The occurrence of a malfunction incurs extremely high maintenance costs after the equipment has been deployed. It is also important that laboratory testing be extensive enough to prevent failure that would result in loss of life or mission. 4. This handbook provides guidelines that will help in the Environmental Strese Screening (ESS) of electronic equipment so that latent defects may be located and eliminated before the equipment is accepted. It has been written in compliance with the DoD Acquisition Reform Initiatives (ARI), Single PrOCeSe Initiative (sPI), and the latest series of DoD acquisition directives. 5. Beneficial connnents (recommendations, additions, deletionfi) and any pertinent data which may be of use in improving thie document should be addressed to: Commander, Naval Sea Systems Conmnand, SEA 03R42, 2531 Jeff erson Davis Highway, l+rlington, VA 22242-5160, by using the self- addressed Standardization Document Improvement Proposal (DD Fonn 1426) appearing at the end of this document or by letter. . . ii Downloaded from http://www.everyspec.com on 2010-06-06T6:29:04. . . MIL-HDBK-2164A cONTENTS ~ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1. 1.1 Purpose ............................................ 1.2 Application to products ............................ 1.2.1 Large, heavy items ................................. 1 .2.2 Contractual responsibility considerations. ......... 2. 2.1 General ............................................ 2.2 Government documents ............................... 2 .2.1 Specif icat ions, standarda, and handbooks ............ 2.2.2 Other Government documents, drawings, and publications ....................................... 2.3 Non-Governm6nt publications ........................ 2.4 Order of precedence ................................ 3. 3.1 De finitions ........................................ 3.2 Acronyms used in this handbook. .................... 4. 4.1 4.2 4 .2.1 4 .2.1.1 4.2. 1.2 4.2.1.3 4.2 .1.4 4 .2.1.5 4 .2.2 4.3 4 .3.1 4.3.2 4 .3.3 4.4 4.5 4.5.1 4 .5.1.1 4 .5.2 General ............................................ Screening conditions ............................... General environmental guidelines. .................. Standard ambient ................................... Controlled ambient ................................. Thermal screening tolerances ....................... Vibration screening tolerances. .................... Time ............................................... Accuracy of screening instrumentation calibration. . Screening facilities ............................... Screening chamber .................................. Vibration apparatus ................................ Quality of air for supplementary cooled equipment. . General instrumentation guidelines. ................ Vibration screening guidelines. .............. .... Screening fixture .................................. .Fixture checkout ................................... Control excitation ........................”......... iii EAGE ii 1 1 1 2 2 3 3 3 3 4 4 4 4 4 6 -7 7 7’ 9 9 9 9 10 .. 10 10 10 10 11 11 11 12 12 13 13 Downloaded from http://www.everyspec.com on 2010-06-06T6:29:04. _. .._, MIL-HDBK-2164A CONTENTS 4.6 4.7 4 .7.1 4 .7.2 4 .7.3 4.8 Performance monitoring guidelines. ................ Failure reporting, analysis, and correction action system (FRACAS ).................................... Failure during pre defect-free screening. ......... Failures during defect-free screening. ............ Rescreening ....................................... Sampling .......................................... 5. 5.1 5.1.1 5. 1.1.1 5.1.2 5. 1.2.1 5. 1.2.1.1 5 .1.2.1.2 5.1.2.2 5. 1.2.2.1 5.1.2 .2.2 5.2 5.2.1 5.2.2 5.2 .2.1 5.2 .2.2 5.2.3 5.2.3.1 5.2 .3.1.1 5.2 .3.1.2 5.2 .3.2 5.3 Environmental stresses. ........................... Random vibration spectrum. ........................ Applied axis detemination. ....................... Temperature cycling ............................... Thermal survey .................................... Procedure for ambient-cooled equipment. ........... Procedure for supplementally cooled equipment. ..... Thermal screening ................................... Ambient cooled equipment.. ........................ Supplementally cooled equipment. .................. Total ESS program ................................. Documentation ................................. .... Individual tests .................................. Examination of product. ........................ .. Initial operational test .......................... Environmental Screening. .......................... Fixed duration pre defect-free (PDF) screening. ... Vibration ......................................... Thermal cycling ................................... Defect-free (DF) screening ........................ Final functional operational tefit................. 6. ~ 6.1 Intended use ...................................... 6.2 Subject term (keyword) listing ................... 1. Screen Development Process. ....................... 2. Environmental Stress Screening Constituents. ...... 3. Random Vibration Spectrum. ........................ PAGE 13 13 13 13 14 14 14 14 14 14 15 17 17 18 19 19 19 20 20 20 20 21 21 21 21 21 22 22 22 22 22 2 8 15 iv Downloaded from http://www.everyspec.com on 2010-06-06T6:29:04. 4 A-1 A-I. A-II. c-I. A B c MIL-HDBK-2164A . CONTE~S Temperature Cycling Profile for Ambient Cooled and Supplementary Cooled Equipment. ................... ESS Characteristics Curve ......................... Values of PA for Various a and TPDF = TDF. ......... Probability of Rejections Due to Random Failure fOr VariOus Values Of El~.......................... ESSBenefits to Management ........................ ESS screening duration, reduced screening and sampling .......................................... ESS troubleshooting plan. ......................... Navy program management guidance. :.. .............. PAGE 16 25 28 28 35 23 30 32 v Downloaded from http://www.everyspec.com on 2010-06-06T6:29:04. ..—.— —___ MIL-HDBK-2164A 1. SCOPE 1.1 OlzQcEe. This handbook provides guidelines for Environmental Stress Screening (ESS) of electronic equipment, including environmental screening conditions, durations of exposure, procedures, equipment operation, actions taken upon detection of defects, and screening documentation. These guidelines provide for a uniform ESS process that may be utilized for effectively disclosing manufacturing defects in electronic equipment caused by poor workmanship and faulty or marginal parts. It will also identify design problems if the design is inherently fragile or if qualification and reliability growth tests were too benign or not accomplished. The most common stimuli used in ESS are temperature cycling and random vibration. A viable ESS prcgram” must be dynamic; the screening program must be actively managed, and tailored to the particular characteristics of the equipment being screened. It should be noted that there are no universal screens applicable to all equipment. ESS is part of a viable engineering development, manufacturing corrective action and overhaul process rather than a test in the normal accept/reject 8ense. Guidance in developing a screen can be found in figure 1. Those participating in the effort, including the contractor should never be led to believe that a “failure” is bad and’would be held against them. ESS is intended to stimulate defects, not to simulate the operating environment, and therefore, factory failures are encouraged. The root causea of ESS failures need to be found and corrected before there is a complete process. This handbook cannot be cited as a requirement. If it ia, the contractor does not have to comply. 1.2 The process described herein msy be aPPlied to electronic assemblies, eqUiPment and systems, in six broad categories as distinguished according to their field service application: 1 2 3 3A 3B 4 5 6 Fixed ground equipment Mobile ground vehicle equipment Shipboard equipment l Sheltered l Exposed Jet aircraft equipment Turbo-propeller and rotary-wing aircraft Equipment Air launched weapons and assembled external stores 1 Downloaded from http://www.everyspec.com on 2010-06-06T6:29:04. .- .— .-. . . . ..-— -— ——. MIL-HDBK-2164A “ FEEDBACK START r I I t I @li=l-i=l-@’l B& REBUILDOR RUN SCREEN INCREASE NEW MULTIPLE SCREEN PRODUCT TIMES SEVERITY 1.2.1 when applying these guidelines to large, heavy items, the following should be considered: . Potential fatigue of the item l Adequate environmental inputs . Availability of suitable environmental generation facilities . Technical validity of screening at lower assembly levels, i.e. , drawers, chassis 1.2.2 Navy-approved detailed screening procedures are used to verify contractual requirements 2 Downloaded from http://www.everyspec.com on 2010-06-06T6:29:04. . . . . . . . MIL-HDBK-2164A I Acquisition authorities are cautioned from advising contractors on how to obtain desired results. They should confine the contractual requirements to performance requirements, rather than dictating the manufacturing method. Appendix A contains guidance concerning screening duration, reduced screening and sampling. Appendix B covers some considerations useful in formulating a troubleshooting plan to address ESS failures, while Appendix C contains guidance. that will assist the Navy program manager in understanding Environmental Stress Screening, including the Department of the Navy Single Process Initiative, and provides guidance in the preparation of contractual acquisition documentation. 2. APPLICABLE DOCUNSNTS 2.1 General. The documents listed below are not necessarily all of the documents referenced hexein, but are the ones needed in order to fully understand the informat ion provided by this handbook. 2 .2.1 and The f01lowing standard and handbook form a part of this document to the extent’ specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto. STANDARD DEPARTMENT OF DEFENSE klIL-STD-1235 - Single- and Multi-Level Continuous Sampling Procedures and Tables for Inspection by Attributea Functional Curves of the Continuous Sampling Plans HANDBOOK DEPARTMENT OF DEFBNSE MIL-H32BK-781 - Reliability Test Methods, Plans, and Environments for Engineering Development, Qualification, and Product ion (Unless otherwise indicated, copies of federal and military specifications, standards, and handbooks are available from the Standardization Documents Order Desk, Bldg. 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094. ) 3 Downloaded from http://www.everyspec.com on 2010-06-06T6:29:04. MIL-HDBK-2164A 2 .2.2 Qtb.er GOV~ . and The following other Government documents, drawings, and publications form a part of this document to the extent specified herein. TRI-SERVICE TECHNICAL BRIEF 002-93-08 - Environmental Stress Screening Guidelines (Application for copies should be addressed to The Office of the Assistant Secretary of the Navy (Research, Development, and Acquisition) Product Integrity, 2211 Jefferson Davis Highway, Arlington, VA 22244. ) 2.3 ~. The following document (s) form a part of this document to the extent E.pecified herein. Unless otherwise specified, the issues of the documents which are DoD adopted are those listed in the issue of the DoDISS, and supplement thereto. AMERICAN NATIONAL STANDARDS INSTITUTE ANSI/NCSL Z540-1 - General Requirements for Calibration Laboratories and Measuring Test Equipment (Application for copies should be addressed to the Institute of Electrical and Electronics Engineers, Inc. , 445 Hoes Lane, P.O. Box 1331, Piscataway, NJ 08855-1331. ) .,. s,.LUIE ur ILL. vuw,.mm.iau =GLm. w7,a i.c.a, Environmental Stress Screening Guidelines, 1981 Environmental Stress Screening Guidelines for Assemblies, March 1990 Environmental Stress Screening Guidelines for Parts, September 1985 (ADDlication for couies should be addressed to the Institute of . . Environmental Sciences, 940 East Northwest Highway, Mt. Prospect, IL 60056- 3444) 2.4 ~. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, eupersedee aPPliC?dIle lawS and regulations unless a specific exemption has been obtained. 3. DEFINITIONS AND ACRONYMS 3.1 ~. Definitions appl cable to this handbook are: 4 Downloaded from http://www.everyspec.com on 2010-06-06T6:29:04. .,. MIL-HDBK-2164A Assembly/Module - Chamber Defect Environmental - Stress Screening ESS failure A number of parts joined together to perform a specific function and capable of disassembly, e.g. , a printed circuit board. Cabinet in which hardware is placed in order to apply stress to it. The causative element that results in a failure. ESS of a product is a process which involves the application of one or more specific types of environmental stresses for the purpose of precipitating to hard failure, latent, intermittent, or incipient defects or flaws which would otherwise cause product failure in the use environment. The stress may be applied either in combination or in sequence on an accelerated basis, but within product design capabilities. Failures occurring in the defect-free screening that cannot be classified as non-ESS failures as defined below. ESS failurea include those due to defective manufacturing processes and defective components. Nfyr.E: In the event that several component parts of the same type fail during the screening, each one sliould be considered a separate ESS failure, unless it can be shown Latent Defect that one failure caused one or more of the others. k inherent or induced weakness, not detectable by ordinary mesns, which will either be precipitated to early failure under environmental stress screening conditions or eventually fail in the intended use environment. Levels of product Definitions relating to levels of product are as specified: a. h item which can be removed and replaced within the end item, such as a weapon replaceable assembly (NRA) or line replaceable unit (LRU) b. Sy,aLQU. A ‘group of electronic LiIIits, interconnected, which provide a specific funct ion, for example, a radar system or navigation system. Non-ESS failure - The following failures are non-ESS failures: Downloaded from http://www.everyspec.com on 2010-06-06T6:29:04. — .. ,! Part Thermal Survey - Vibration Survey a. b. c. d. e. f. 9. MIL-HDBK-2164A . Failures directly attributable to improper installation in the screening facility. Failures of screening instrumentation or monitoring eguipment (other than the Built In Test (BIT) function) , except where it is part of the delivered item. Failures resulting from operator error in setting up, or in screening the equipment. Failures attributable to an error in, or interpretation of, the screening procedures. Dependent failures. Failures occurring during repair. Failures clearly attributable to the environmental generation screening equipment overstress condition. One piece, or two or more pieces joined tngether which are not normally subject to disassembly without destruction of designed use. Parts, components, and devices are synonymous The measurement of thermal response characteristics at points of interest within an equipment when temperature extremes are applied to the equipment. The measurement of vibration response characteristics at points of interest within an ecluiPment when vibration excitation is applied to the equipment. 3.2 a. b. c. d. e. f. 9. h. 1. j. k. 1. ARI BIT COTS ESS FAR FRACAS IRIG LRu MTBF NDI PDF SPC Acquisition Reform Initiatives Built In Test Commercial-Off -The-Shelf Environmental Stress Screening Federal Acquisition Regulations Failure Reporting and Corrective Action System Inter-Range Instrument Group Line Replaceable Unit Mean Time Between Failure Nondevelopmental Item Pre Defect-Free Statistical Process Control . . 6 Downloaded from http://www.everyspec.com on 2010-06-06T6:29:04. .—. .— . ..-____ _— MIL-HDBK-2164A m. WRA Weapon Replaceable Assembly 4. GENERAL GUIDELINES 4.1 Qencral. ESS screenings are usually accomplished with the guidelines of MIL-WDBK-781 to ensure that hardware in accordance is free of manufacturing defects Design and manufacturing practice calls for the application of environmental stress screening to, l All material acquisitions that include electrical, electronic, electro-optical, electromechanical or electro-chemical component in program definition and risk reduction, engineering and manuf act uring development, and production, fielding/deployment, and operational phaSeB l Reprocurements and to the procurement of spare and repair parts where the cost of ESS implementation can be amortized economically . Depot overhaul programs where opportunities exiBt for substantial cost Bavings . Nondevelopmental items such as commercial-off-the-shelf (NDI- COTS) snd domestic or foreign military (NDI-Military) items only to the extent ESS was implemented and documented during the previous product ion . Systems, equipment, and spares that have been specifically designed to receive ESS 4.2 The following conditions should be required for all ESS : a. ESS may be applied at any manufacturing level, from piece parts to end items. It is intended to screen defectB in a manner that is not harmful to properly manufactured material. Hardware proven to be too fragile may be excluded because screening environments may be too harmful, but rationale for exclusion should be included in appropriate documental ion -- such as a stress screening plan. b. All screening should be accomplished in accordance with the applicable guidelines specified herein. c. There should be evidence of quality control acceptance of all reguired inspection or test activity prior to the start of any contractual environmental stress screening, and at each time maintenance is performed. d. All testing should be completed prior to packaging the equipment. -1 Downloaded from http://www.everyspec.com on 2010-06-06T6:29:04. -— .- . ..- -, .--— —- . . . . . . . .. . . . ——— . . . . . MIL-HOBK-2164A e. The conditions specified should be applied in the sequence indicated in figure 2. FfNN. INDIVIDUALTESTS ENVIRONMENTALSTRESSSCREENS OPERATIONAL lTiSTS (p=’) (p=’) ‘~?!g%~) (-’ 5.2.2.2) Dercd-Fme m. (pF’) Ikmninalio. Mid Rondo. Themal Tlmmml REndom Find ofF70d”ct op@iOn@J vibration cycling Cydiig Vibmdon Opcmliomd II PmOefti-Fme -1 Oefed-Fmz ~ 40Hours ~ Fmm 40Hounto80How & 40HoumA II I------===l ‘rhR’mnlcycling––––––- / f. Equipment should be installed initially in the environmental chamber and then operated to ensure satisfactory performance