smt 常用术语

SMT術語培訓教材1空焊零件腳或引線腳錫錫墊間沒有錫或其他因素造成沒有接合floatsolderingSparepartsfeetorleadhastinorotherefactorswithtinmattoresultintohascoalescence.2假焊假焊之現象與空焊類似,但其錫墊之錫量太少,低與接合面標準.falsesolderingThephenomenonofthefalsesolderwithemptysoldersimilar,butthetindealofitstinmatistoolittle,bottomandcoalescencestandard.3冷焊錫或錫膏在回風爐氣化後,在錫墊上仍有目模湖的粒狀附著物coldsolderingSolderorsolderpastestillhavethemistyaformattachmentonthethinmatafterreturningreflowovenvaporization.4橋接有腳零件在腳與腳之間被多與之焊錫所連接短路,另一種現象則因檢驗人員使用鑷子等操作不當而導致腳輿腳碰觸短路,亦或刮CHIPS腳造成殘餘錫渣使腳輿腳短路bridgingThereisfeetsparepartsinthefeetandthefeetwarstouchedthesportcircuitbythefeetthatsolderingconnectshortcircuit,anotherphenomenonthenbecauseofexaminingpersounelusagetheforceps,operationnotappropriatebutcausefeetwithofthesurplus,orpareoffthefeetchipsresultinremainingtinsplashmakesleadandleadshortcircuit.5錯件零件放置之規格或種類與作業規定或BOM,ECN不符者,即為錯件.errormaterialThesparepartsplacesitsspecificationorcategoriesoutofaccordancewithhomeworkprovisionorBOM,ECN,namelyforthepieceofmistake6缺件應放置之零件位址,因不正常之緣故而產生空缺lackcomponentShouldplacetheaddressofthespareparts,becauseoffalselyoftenitcausebutthecreationgetsemptytolack7極性反向極性方位與加工工程樣品裝配不一樣,即為極性錯誤.polarityinversionThepoledirectionaccuracyisdifferentfromprocesstheengineeringsampleassemble,namelyforpolemistake.8零件倒置smt至零件不得倒置,另cr因底部全白無規格表示,雖無極性也不可倒置.thesparepartssetsupsidedownThesparepartofthecannotsetupsidedown,anothertheCrchasnospecificationtomeanbecauseofthebottmwholewhite,althoughthelimitlessalsocan'tdumptoplace.9零件偏移smt所有零件表面接著焊點與pad位偏移不可超過１／２面積thesparepartsispartialtoSMTallsparepartssurfaceimmediatelyafterthesolderedjointispartialtowithofPADtomovecan'tover1/2area10錫墊損傷pad在正常制程中,經過回焊爐熔接時,不能損傷錫墊,一般錫墊損傷之原因,為修補時使用烙鐵不當導致錫墊被破壞輕者可修復判定出貨,嚴重者列入次級品,或移植報廢不當導致錫墊被破壞,輕者可修復正常出貨,嚴重者列入次級品判定,亦或移植報廢thesolderdishhurtsThePADpassesbybackinnormalmanufacturingprocesswhenthereflowsolder,can’thurtthePAD,generalthereasonofthePADharn,forrepairtheusagehotironsthenotappropriatecausingtinbolsterbroken,lightcanrepairthenormalshipment,seriousbeincludedeinthetimeclassarticlejudge,orthetransplantationdiscards.11污染不潔smt加工作業不良,造成機板面不潔或chips腳與腳之間附有異物,或chips修補不良,有點膠,防焊點沾漆均視為不良品,但修補品可視情節列入次級品判定.沾漆均視為不合格品.但修補品可視情形列入次級品判定.apprearancedefectTheSMTprocessestheoperationbad,resultintheplankdonotsweeporthefeetofchipsandfeetafisheyeforeignbody,orthechipsrepairsbad,havealittlethegumanddefendthesolderordertobestainedwiththepainttoallseeasunqualified,butmaintainthearticlecanseethefeelingroworcolumntojudgeintothetimeclass.12smt爆板pc板在經過回焊爐高溫時,引板子本身材質不良或回焊爐溫度異常,造成板子銅箔起泡或白斑現象屬不良品explodetheboardThePCBatpassesbytoreturntotheheadofreflowbecauseofplanksononeselfthemeterialisbadorreturntothetempertureofthereflowabnormality,resultintheplanksonrisesbubbleorwhitespotphenomenonsbelongtoinferiorgoods13包焊焊點焊錫過多,看不到零件腳或其輪廓者excessivesolderThesolderingordersthesolderingexcessive,can'tseesparepartsleadoritsoutlines.14錫球,錫渣PCB板表面附著多余的焊錫球,錫渣,一律拒收.solderballs,soldersplashThemachineplanksurfaceattachesthesurplussolderballs,solderspashrefusingtoacceptall15異物殘腳.鐵屑.訂書針等粘附板面上或卡在零件腳間,一律拒收foreignbody16污染pollution嚴重之不潔,如零件焊錫污染氧化,板面殘余松香未清除,清洗不注意使CHIPS污染氧化及清洗不潔.(例如SLOT槽不潔,SIMM不潔,板面CHIP或SLOT旁不潔,SLOT內側上附有許多微小錫粒,PC板表面水紋…等)現象,則不予允收17蹺皮輿零件腳相關之接墊不得有超過10%以上之裂隙,無關之接墊輿銅箔線路不得有超過25%以上keypresspartoxidation之裂隙HavenothingtodowithrelatedPADinfectinsparepartscannotoverabovecracking10%,withPADandcoppercircuitcannotover25%abovecrack18板彎變形板子彎曲變形超過板子對角長度0.5%以上者,則判定拒收themachineplanktransformsTheplanksubflectiontransformstoexceedtheplanksuboppositeanglelength0.5%isabove,thenjudgetorefusetoaccept19撞角,板傷不正常緣故產生之板子損傷,若修復良好可以以合格品允收,否則列入次級品判定20dip爆板PC板在經過DIP高溫時,因PC板本身材質不良或錫爐焊點溫度過高,造成PC板離层起泡或白斑現象則屬不良品21跪腳CACHERAM,K/BB10S…等零件PIN打折形成跪腳bentthelead22浮件float零件依規定須插到底(平貼)或定位孔,浮件判定標准為SLOT,SIMM浮高不得超過0.5mm,傳統零件以不超過1.59mm為宜ThecomponentmustbeeventostickaccordingtotheprovisionthePCBfloatsthehightjudgingthestandardSLOT,SIMMcannotover0.5mm.othercomponentcannotover1.59mm23刮傷scoring注意PC板堆積防護不當或重工防護不當產生刮傷問題24PCB異色因回流焊造成板子顏色變暗或因烘烤不當變黃,變黑均不予以允收.但視情形可列入次級品判定pcbchangecountenance允收25修補不良修补線路未平貼基板或修补線路未作防焊處理,依或有焊點殘餘松香未清理者repairfailure26實體object看到的或可以想到的事物Anythingperceivableorconceivable27過程process將輸入转化為輸出的一組彼此相關的資料和活動.systemofactivities,whitchuseresourcestotransforminputsintooutputs28程序procedure為進行某項活動所規定的途徑.在許多情況下,程序可行成文件,或者可為文件書.(如:質量體系程序).程序形成文件時,通常成之為"書面程序"或"文件化程序".書面或文件化程序中通常包括活動的目的和範圍.即:5W2HSpecifiedwaytoperformanactivity;Inmanycases,proceduresaredocumentedE.Gqualitymanagementsystemprocedures;Whenaprocedureisdocumented,theterm"writtenprocedure"or"documentedprocedure"isfrequentiyused;Awrittenordocumentproceduretypicallycontainsthepurposesandscopeofanactivity.29檢驗inspection通過觀察和判斷必要時結合測量試驗或估計所進行的符合性評价conformityevalutionbyobservationandjudgementaccompaniedasappropriatebymeasurement,testingorgauging.30合格conformity滿足規定的要求fulfilmentofarequirement31不合格沒有滿足規定的要求nonconformitynonfulfilmentofarequirement32缺陷defect沒有滿足某個預期的使用要求或合理的期望nonfulfilmentofarequirementrelatedtoanintendedusage33質量要求對需要表述或需要轉化為一組針對實體特性的定量或定性的規定要求,以使其實現並進行考核qualityrequirementa.質量要求應全面反映顧客明確和隱含的需要b."要求"包括市場, 合同 劳动合同范本免费下载装修合同范本免费下载租赁合同免费下载房屋买卖合同下载劳务合同范本下载 和組織內部的要求34自檢selftest由工作的完成者依據規定的規則對該工作進行的檢驗35服務service為滿足顧客的需要,供方和顧客之間接觸的活動以及供方內部活動產生的結果