IPC-A-610G EN Acceptability of Electronic Assemblies

1General......................................................................1-11.1Scope......................................................................1-21.2Purpose...................................................................1-31.3Classification.........................................................1-31.4MeasurementUnitsandApplications.................1-31.4.1VerificationofDimensions......................................1-31.5DefinitionofRequirements..................................1-31.5.1AcceptanceCriteria..........................................1-41.5.1.1TargetCondition..............................................1-41.5.1.2AcceptableCondition.......................................1-41.5.1.3DefectCondition..............................................1-41.5.1.3.1Disposition.......................................................1-41.5.1.4ProcessIndicatorCondition.............................1-41.5.1.5CombinedConditions......................................1-41.5.1.6ConditionsNotSpecified.................................1-41.5.1.7SpecializedDesigns.........................................1-51.6ProcessControlMethodologies...........................1-51.7OrderofPrecedence.............................................1-51.7.1ClauseReferences...........................................1-51.7.2Appendices......................................................1-51.8TermsandDefinitions...........................................1-51.8.1BoardOrientation.............................................1-51.8.1.1*PrimarySide....................................................1-51.8.1.2*SecondarySide...............................................1-51.8.1.3SolderSourceSide..........................................1-51.8.1.4SolderDestinationSide....................................1-51.8.2*ColdSolderConnection...................................1-61.8.3Diameter..........................................................1-61.8.4ElectricalClearance..........................................1-61.8.5FOD(ForeignObjectDebris)............................1-61.8.6HighVoltage....................................................1-61.8.7IntrusiveSolder................................................1-61.8.8LockingMechanism.........................................1-61.8.9Meniscus(Component)....................................1-61.8.10*NonfunctionalLand..........................................1-61.8.11Pin-in-Paste.....................................................1-61.8.12SolderBalls......................................................1-61.8.13*StressRelief.....................................................1-61.8.14WireOverlap....................................................1-61.8.15WireOverwrap.................................................1-61.9RequirementsFlowdown......................................1-61.10PersonnelProficiency.........................................1-71.11AcceptanceRequirements.................................1-71.12InspectionMethodology.....................................1-71.12.1Lighting............................................................1-71.12.2MagnificationAids............................................1-72ApplicableDocuments.............................................2-12.1IPCDocuments......................................................2-12.2JointIndustryDocuments....................................2-12.3ElectrostaticAssociationDocuments.................2-22.4JEDEC.....................................................................2-22.5InternationalElectrotechnicalCommissionDocuments.............................................................2-22.6ASTM......................................................................2-22.7MilitaryStandards.................................................2-23HandlingElectronicAssemblies.............................3-13.1EOS/ESDPrevention.............................................3-23.1.1ElectricalOverstress(EOS)..................................3-33.1.2ElectrostaticDischarge(ESD)..............................3-43.1.3WarningLabels....................................................3-53.1.4ProtectiveMaterials.............................................3-63.2EOS/ESDSafeWorkstation/EPA..........................3-73.3HandlingConsiderations......................................3-93.3.1Guidelines............................................................3-93.3.2PhysicalDamage...............................................3-103.3.3Contamination...................................................3-103.3.4ElectronicAssemblies........................................3-113.3.5AfterSoldering...................................................3-113.3.6GlovesandFingerCots.....................................3-124Hardware...................................................................4-14.1HardwareInstallation............................................4-24.1.1ElectricalClearance...........................................4-24.1.2Interference.......................................................4-34.1.3ComponentMounting–HighPower.................4-44.1.4Heatsinks..........................................................4-64.1.4.1InsulatorsandThermalCompounds.................4-64.1.4.2Contact.............................................................4-84.1.5ThreadedFastenersandOtherThreadedHardware..........................................4-94.1.5.1Torque............................................................4-114.1.5.2Wires...............................................................4-13TableofContentsviiIPC-A-610GOctober20174.2JackpostMounting..............................................4-154.3ConnectorPins....................................................4-164.3.1EdgeConnectorPins......................................4-164.3.2PressFitPins..................................................4-174.3.2.1Soldering.........................................................4-204.4WireBundleSecuring.........................................4-234.4.1General...........................................................4-234.4.2Lacing.............................................................4-264.4.2.1Damage..........................................................4-274.5Routing–WiresandWireBundles....................4-284.5.1WireCrossover...............................................4-284.5.2BendRadius...................................................4-294.5.3CoaxialCable..................................................4-304.5.4UnusedWireTermination................................4-314.5.5TiesoverSplicesandFerrules........................4-325Soldering...................................................................5-15.1SolderingAcceptabilityRequirements................5-35.2SolderingAnomalies.............................................5-45.2.1ExposedBasisMetal.........................................5-45.2.2PinHoles/BlowHoles........................................5-65.2.3ReflowofSolderPaste......................................5-75.2.4Nonwetting........................................................5-85.2.5Cold/RosinConnection.....................................5-95.2.6Dewetting..........................................................5-95.2.7ExcessSolder.................................................5-105.2.7.1SolderBalls.....................................................5-115.2.7.2Bridging...........................................................5-125.2.7.3SolderWebbing/Splashes...............................5-135.2.8DisturbedSolder.............................................5-145.2.9FracturedSolder.............................................5-155.2.10SolderProjections...........................................5-165.2.11Lead-FreeFilletLift..........................................5-175.2.12Lead-FreeHotTear/ShrinkHole.....................5-185.2.13ProbeMarksandOtherSimilarSurfaceConditionsinSolderJoints.............................5-195.2.14PartiallyVisibleorHiddenSolderConnections....................................................5-206TerminalConnections..............................................6-16.1SwagedHardware.................................................6-36.1.1Terminals...........................................................6-36.1.1.1TerminalBasetoLandSeparation....................6-36.1.1.2Turret................................................................6-56.1.1.3Bifurcated..........................................................6-66.1.2RolledFlange....................................................6-76.1.3FlaredFlange....................................................6-86.1.4ControlledSplit..................................................6-96.1.5Solder.............................................................6-106.2Insulation..............................................................6-126.2.1Damage..........................................................6-126.2.1.1Presolder.........................................................6-126.2.1.2Post-Solder.....................................................6-146.2.2Clearance........................................................6-156.2.3Insulation.........................................................6-176.2.3.1Placement.......................................................6-176.2.3.2Damage..........................................................6-196.3Conductor............................................................6-206.3.1Deformation....................................................6-206.3.2Damage..........................................................6-216.3.2.1StrandedWire.................................................6-216.3.2.2SolidWire........................................................6-226.3.3StrandSeparation(Birdcaging)–Presolder.........................................................6-226.3.4StrandSeparation(Birdcaging)–Post-Solder.....................................................6-236.3.5Tinning............................................................6-246.4ServiceLoops......................................................6-266.5StressRelief........................................................6-276.5.1Bundle.............................................................6-276.5.2Lead/WireBend..............................................6-286.6Lead/WirePlacement–GeneralRequirements......................................................6-306.7Solder–GeneralRequirements.........................6-316.8TurretsandStraightPins...................................6-336.8.1Lead/WirePlacement......................................6-336.8.2Solder.............................................................6-356.9Bifurcated............................................................6-366.9.1Lead/WirePlacement–SideRouteAttachments....................................................6-366.9.2Lead/WirePlacement–StakedWires.............6-396.9.3Lead/WirePlacement–BottomandTopRouteAttachments.........................................6-406.9.4Solder.............................................................6-416.10Slotted................................................................6-446.10.1Lead/WirePlacement......................................6-446.10.2Solder.............................................................6-45TableofContents(cont.)viiiIPC-A-610GOctober20176.11Pierced/Perforated............................................6-466.11.1Lead/WirePlacement......................................6-466.11.2Solder.............................................................6-486.12Hook....................................................................6-496.12.1Lead/WirePlacement......................................6-496.12.2Solder.............................................................6-516.13SolderCups.......................................................6-526.13.1Lead/WirePlacement......................................6-526.13.2Solder.............................................................6-546.14AWG30andSmallerDiameterWires–Lead/WirePlacement.......................................6-566.15SeriesConnected..............................................6-576.16EdgeClip–Position..........................................6-587Through-HoleTechnology.......................................7-17.1ComponentMounting...........................................7-27.1.1Orientation.......................................................7-27.1.1.1Orientation–Horizontal....................................7-37.1.1.2Orientation–Vertical........................................7-57.1.2LeadForming...................................................7-67.1.2.1BendRadius....................................................7-67.1.2.2SpacebetweenSeal/WeldandBend..............7-77.1.2.3StressRelief.....................................................7-87.1.2.4Damage.........................................................7-107.1.3LeadsCrossingConductors..........................7-117.1.4HoleObstruction............................................7-127.1.5DIP/SIPDevicesandSockets........................7-137.1.6RadialLeads–Vertical...................................7-157.1.6.1Spacers.........................................................7-167.1.7RadialLeads–Horizontal..............................7-187.1.8Connectors....................................................7-197.1.8.1RightAngle....................................................7-217.1.8.2VerticalShroudedPinHeadersandVerticalReceptacleConnectors.................................7-227.1.9ConductiveCases..........................................7-237.2ComponentSecuring..........................................7-237.2.1MountingClips...............................................7-237.2.2AdhesiveBonding..........................................7-257.2.2.1AdhesiveBonding–NonelevatedComponents..................................................7-267.2.2.2AdhesiveBonding–ElevatedComponents..................................................7-297.2.3OtherDevices................................................7-307.3SupportedHoles..................................................7-317.3.1AxialLeaded–Horizontal..............................7-317.3.2AxialLeaded–Vertical...................................7-337.3.3Wire/LeadProtrusion.....................................7-357.3.4Wire/LeadClinches........................................7-367.3.5Solder............................................................7-387.3.5.1VerticalFill(A).................................................7-417.3.5.2SolderDestinationSide–LeadtoBarrel(B)........................................................7-437.3.5.3SolderDestinationSide–LandAreaCoverage(C)..................................................7-457.3.5.4SolderSourceSide–LeadtoBarrel(D)........7-467.3.5.5SolderSourceSide–LandAreaCoverage(E)..................................................7-477.3.5.6SolderConditions–SolderinLeadBend......7-487.3.5.7SolderConditions–TouchingThrough-HoleComponentBody..........................................7-497.3.5.8SolderConditions–MeniscusinSolder........7-507.3.5.9LeadCuttingafterSoldering..........................7-527.3.5.10CoatedWireInsulationinSolder....................7-537.3.5.11InterfacialConnectionwithoutLead–Vias....7-547.3.5.12BoardinBoard..............................................7-557.4UnsupportedHoles..............................................7-587.4.1AxialLeads–Horizontal.................................7-587.4.2AxialLeads–Vertical.....................................7-597.4.3Wire/LeadProtrusion.....................................7-607.4.4Wire/LeadClinches........................................7-617.4.5Solder............................................................7-637.4.6LeadCuttingafterSoldering..........................7-657.5JumperWires.......................................................7-667.5.1WireSelection................................................7-667.5.2WireRouting..................................................7-677.5.3WireStaking..................................................7-697.5.4SupportedHoles............................................7-717.5.4.1SupportedHoles–LeadinHole....................7-717.5.5WrappedAttachment.....................................7-727.5.6LapSoldered.................................................7-738SurfaceMountAssemblies....................................8-18.1StakingAdhesive...................................................8-38.1.1ComponentBonding.........................................8-38.1.2MechanicalStrength.........................................8-48.2SMTLeads.................................................................8-68.2.1PlasticComponents..........................................8-68.2.2Damage............................................................8-68.2.3Flattening..........................................................8-7TableofContents(cont.)ixIPC-A-610GOctober20178.3SMTConnections..................................................8-78.3.1ChipComponents–BottomOnlyTerminations.......................................................8-88.3.1.1SideOverhang(A)............................................8-98.3.1.2EndOverhang(B)..........................................8-108.3.1.3EndJointWidth(C)........................................8-118.3.1.4SideJointLength(D).....................................8-128.3.1.5MaximumFilletHeight(E)...............................8-138.3.1.6MinimumFilletHeight(F)................................8-138.3.1.7SolderThickness(G)......................................8-148.3.1.8EndOverlap(J)..............................................8-148.3.2RectangularorSquareEndChipComponents–1,2,3or5SideTermination(s)...................................................8-158.3.2.1SideOverhang(A).......................................8-168.3.2.2EndOverhang(B)........................................8-188.3.2.3EndJointWidth(C).....................................8-198.3.2.4SideJointLength(D)...................................8-218.3.2.5MaximumFilletHeight(E)............................8-228.3.2.6MinimumFilletHeight(F).............................8-238.3.2.7SolderThickness(G)...................................8-248.3.2.8EndOverlap(J)............................................8-258.3.2.9TerminationVariations.................................8-268.3.2.9.1MountingonSide(Billboarding)...................8-268.3.2.9.2MountingUpsideDown...............................8-288.3.2.9.3Stacking......................................................8-298.3.2.9.4Tombstoning...............................................8-308.3.2.10CenterTerminations....................................8-318.3.2.10.1SolderWidthofSideTermination................8-318.3.2.10.2MinimumFilletHeightofSideTermination...8-328.3.3CylindricalEndCapTerminations..................8-338.3.3.1SideOverhang(A).......................................8-348.3.3.2EndOverhang(B)........................................8-358.3.3.3EndJointWidth(C).....................................8-368.3.3.4SideJointLength(D)...................................8-378.3.3.5MaximumFilletHeight(E)............................8-388.3.3.6MinimumFilletHeight(F).............................8-398.3.3.7SolderThickness(G)...................................8-408.3.3.8EndOverlap(J)............................................8-418.3.4CastellatedTerminations................................8-428.3.4.1SideOverhang(A).......................................8-438.3.4.2EndOverhang(B)........................................8-448.3.4.3MinimumEndJointWidth(C)......................8-448.3.4.4MinimumSideJointLength(D)....................8-458.3.4.5MaximumFilletHeight(E)............................8-458.3.4.6MinimumFilletHeight(F)............