mc34064

© Semiconductor Components Industries, LLC, 2005 October, 2005 − Rev. 16 1 Publication Order Number: MC34064/D MC34064, MC33064, NCV33064 Undervoltage Sensing Circuit The MC34064 is an undervoltage sensing circuit specifically designed for use as a reset controller in microprocessor−based systems. It offers the designer an economical solution for low voltage detection with a single external resistor. The MC34064 features a trimmed−in−package bandgap reference, and a comparator with precise thresholds and built-in hysteresis to prevent erratic reset operation. The open collector reset output is capable of sinking in excess of 10 mA, and operation is guaranteed down to 1.0 V input with low standby current. The MC devices are packaged in 3−pin TO-92, micro size TSOP−5, 8−pin SOIC−8 and Micro8� surface mount packages. The NCV device is packaged in SOIC−8 and TO−92. Applications include direct monitoring of the 5.0 V MPU/logic power supply used in appliance, automotive, consumer and industrial equipment. Features • Trimmed−In−Package Temperature Compensated Reference • Comparator Threshold of 4.6 V at 25°C • Precise Comparator Thresholds Guaranteed Over Temperature • Comparator Hysteresis Prevents Erratic Reset • Reset Output Capable of Sinking in Excess of 10 mA • Internal Clamp Diode for Discharging Delay Capacitor • Guaranteed Reset Operation with 1.0 V Input • Low Standby Current • Economical TO−92, TSOP−5, SOIC−8 and Micro8 Surface Mount Packages • Pb−Free Packages are Available • NCV Prefix for Automotive and Other Applications Requiring Site and Control Changes 1.2 Vref Reset GND Input = Sink Only Positive True Logic This device contains 21 active transistors. Figure 1. Representative Block Diagram http://onsemi.com 1 2 3 Pin 1. Reset 2. Input 3. Ground TO−92 P SUFFIX CASE 29 8 1 (Top View) 3 1 N.C. Ground N.C. N.C. 2 4 8 7 6 5 N.C. N.C. Input Reset 8 1 PIN CONNECTIONS ORDERING INFORMATION SOIC−8 D SUFFIX CASE 751 Micro8 DM SUFFIX CASE 846A TSOP−5 SN SUFFIX CASE 4831 5 Pin 1. Ground 2. Input 3. Reset 4. NC 5. NC See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. See general marking information in the device marking section on page 7 of this data sheet. DEVICE MARKING INFORMATION MC34064, MC33064, NCV33064 http://onsemi.com 2 MAXIMUM RATINGS Rating Symbol Value Unit Power Input Supply Voltage Vin −1.0 to 10 V Reset Output Voltage VO 10 V Reset Output Sink Current (Note 2) ISink Internally Limited mA Clamp Diode Forward Current, Reset to Input Pin (Note 2) IF 100 mA Power Dissipation and Thermal Characteristics P Suffix, Plastic Package Maximum Power Dissipation @ TA = 25°C Thermal Resistance, Junction−to−Air D Suffix, Plastic Package Maximum Power Dissipation @ TA = 25°C Thermal Resistance, Junction−to−Air DM Suffix, Plastic Package Maximum Power Dissipation @ TA = 25°C Thermal Resistance, Junction−to−Air PD R�JA PD R�JA PD R�JA 625 200 625 200 520 240 mW °C/W mW °C/W mW °C/W Operating Junction Temperature TJ +150 °C Operating Ambient Temperature MC34064 MC33064 NCV33064 TA 0 to +70 −40 to +85 −40 to +125 °C Storage Temperature Range Tstg −65 to +150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. ESD data available upon request. ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TA is the operating ambient temperature range that applies [Notes 3 and 4] unless otherwise noted.) Characteristics Symbol Min Typ Max Unit COMPARATOR Threshold Voltage High State Output (Vin Increasing) Low State Output (Vin Decreasing) Hysteresis VIH VIL VH 4.5 4.5 0.01 4.61 4.59 0.02 4.7 4.7 0.05 V RESET OUTPUT Output Sink Saturation (Vin = 4.0 V, ISink = 8.0 mA)(Vin = 4.0 V, ISink = 2.0 mA)(Vin = 1.0 V, ISink = 0.1 mA) VOL − − − 0.46 0.15 − 1.0 0.4 0.1 V Output Sink Current (Vin, Reset = 4.0 V) ISink 10 27 60 mA Output Off-State Leakage (Vin, Reset = 5.0 V) IOH − 0.02 0.5 �A Clamp Diode Forward Voltage, Reset to Input Pin (IF = 10 mA) VF 0.6 0.9 1.2 V TOTAL DEVICE Operating Input Voltage Range Vin 1.0 to 6.5 − − V Quiescent Input Current (Vin = 5.0 V) Iin − 390 500 �A 2. Maximum package power dissipation limits must be observed. 3. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible. 4. Tlow = 0°C for MC34064 Thigh = +70°C for MC34064 −40°C for MC33064 +85°C for MC33064 −40°C for NCV33064 +125°C for NCV33064 5. NCV prefix is for automotive and other applications requiring site and change control. MC34064, MC33064, NCV33064 http://onsemi.com 3 V O , O U T P U T V O LT A G E ( V ) V O , O U T P U T V O LT A G E ( V ) Figure 2. Reset Output Voltage versus Input Voltage Figure 3. Reset Output Voltage versus Input Voltage Figure 4. Comparator Threshold Voltage versus Temperature Figure 5. Input Current versus Input Voltage Figure 6. Reset Output Saturation versus Sink Current Figure 7. Reset Delay Time Vin, INPUT VOLTAGE (V) 10 8.0 6.0 4.0 2.0 0 0 2.0 4.0 6.0 8.0 10 RL = 10 k to Vin TA = 25°C Vin, INPUT VOLTAGE (V) 5.0 4.0 3.0 2.0 1.0 0 4.560 4.580 4.600 4.620 4.640 RL = 10 k to Vin TA = 25°C TA, AMBIENT TEMPERATURE (°C) th , T H R E S H O LD V O LT A G E ( V ) 4.630 4.620 4.610 4.600 4.590 4.580 4.570 −55 −25 0 25 50 75 100 125 V RL = 10 k to Vin Upper Threshold High State Output Lower Threshold Low State Output Vin, INPUT VOLTAGE (V) in , IN P U T C U R R E N T ( m A ) 1.0 0.8 0.6 0.4 0.2 0 0 2.0 4.0 6.0 8.0 10 I TA = +25°C −40°C TA = +25°C +85°C −40°C V O L, O U T P U T S A T U R A T IO N ( V ) ISink, SINK CURRENT (mA) 2.0 1.5 1.0 0.5 0 0 10 20 30 40 Vin = 4.0 V TA = 85°C TA = 25°C TA = −40°C 90% 5.0 V − 4.0 V − 10% +85°C Reset Vin 5.0V 4.0V REF 10k 200 ns/DIV Reset Vin Vin = 5.0 V to 4.0 V RL = 10 k TA = 25°C MC34064, MC33064, NCV33064 http://onsemi.com 4 Figure 8. Clamp Diode Forward Current versus Voltage Figure 9. Low Voltage Microprocessor Reset Figure 10. Low Voltage Microprocessor Reset with Additional Hysteresis 80 60 40 20 0 0 0.4 0.8 1.2 1.6 VF� , FORWARD VOLTAGE (V) , F O R W A R D C U R R E N T ( m A ) FI Vin = 0 V TA = 25°C A time delayed reset can be accomplished with the addition of CDLY. For systems with extremely fast power supply rise times (<500 ns) it is recommended that the RCDLY time constant be greater than 5.0 �s. Vth(MPU) is the microprocessor reset input threshold. tDLY = RCDLY In 1 1 − Vth(MPU) Power Supply + − Input R Reset CDLY Microprocessor Circuit 1.2 Vref GND − + Power Supply + − Input RL Reset Microprocessor Circuit 1.2Vref GND − + VH ≈ 4.6 RH + 0.02 �Vth(lower) ≈ 340 RH x 10 −6 Where:�RH ≤ 150 � Where:�RL ≥ 1.5 �, ≤ 10 k� Comparator hysteresis can be increased with the addition of resistor RH. The hysteresis equation has been simplified and does not account for the change of input current Iin as VCC crosses the comparator threshold (Figure 4). An increase of the lower threshold �Vth(lower) will be observed due to Iin which is typically 340 �A at 4.59�V. The equations are accurate to ±10% with RH less than 150 � and RL between 1.5 k� and 10 k�� Iin RH Vin RL TEST DATA VH (mV) �Vth (mV) RH (�) RL (k�) 20 51 40 81 71 112 100 164 190 327 276 480 0 3.4 6.8 6.8 10 10 16 16 34 34 51 51 0 10 20 20 30 30 47 47 100 100 150 150 0 1.5 4.7 1.5 2.7 1.5 2.7 1.5 2.7 1.5 2.7 1.5 Figure 11. Voltage Monitor Figure 12. Solar Powered Battery Charger Figure 13. Low Power Switching Regulator Figure 14. MOSFET Low Voltage Gate Drive Protection Overheating of the logic level power MOSFET due to insufficient gate voltage can be prevented with the above circuit. When the input signal is below the 4.6 V threshold of the MC34064, its output grounds the gate of the L2 MOSFET. 270 4.6V VCC RL MTP3055EL Input Reset GND − + 1.2Vref Input GND − + 1.2Vref Power Supply + − 1.0k Input Reset GND − + 1.2Vref + − Solar Cells Input Reset GND − + 1.2Vref Vin = 11.5 to 14.5V 470 + MPSW51A 25�H VO = 5.0 V IO = 50 mA470 + 68022 + 1N5819 1.2k 330 1N756 4.7k Reset MC34064, MC33064, NCV33064 http://onsemi.com 5 Test Conditions Results Line Regulation Vin = 11.5 V to 14.5 V, IO = 50 mA 35 mV Load Regulation Vin = 12.6 V, IO = 0 mA to 50 mA 12 mV Output Ripple Vin = 12.6 V, IO = 50 mA 60 mVpp Efficiency Vin = 12.6 V, IO = 50 mA 77% MC34064, MC33064, NCV33064 http://onsemi.com 6 ORDERING INFORMATION Device Operating Temperature Range Package Shipping† MC34064D−005 TA = 0°C to +70°C SOIC−8 98 Units / Rail MC34064D−005G SOIC−8 (Pb−Free) MC34064D−5R2 SOIC−8 2500 Units/ Tape & Reel MC34064D−5R2G SOIC−8 (Pb−Free) MC34064DM−5R2 Micro8 4000 Units / Tape & Reel MC34064DM−5R2G Micro8 (Pb−Free) MC34064P−005 TO−92 2000 Units / Bag MC34064P−005G TO−92 (Pb−Free) MC34064P−5RA TO−92 2000 Units / Tape & Reel MC34064P−5RAG TO−92 (Pb−Free) MC34064P−5RP TO−92 2000 Units / Ammo Pack MC34064P−5RPG TO−92 (Pb−Free) MC34064P−5RM TO−92 MC34064P−5RMG TO−92 (Pb−Free) MC34064SN−5T1 TSOP−5 3000 Units / Tape & Reel MC34064SN−5T1G TSOP−5 (Pb−Free) MC33064D−005 TJ = −40°C to +85°C SOIC−8 98 Units / Rail MC33064D−005G SOIC−8 (Pb−Free) MC33064D−5R2 SOIC−8 2500 Units / Tape & Reel MC33064D−5R2G SOIC−8 (Pb−Free) MC33064DM−5R2 Micro8 4000 Units / Tape & Reel MC33064DM−5R2G Micro8 (Pb−Free) MC33064P−005 TO−92 2000 Units / Bag MC33064P−005G TO−92 (Pb−Free) MC33064P−5RA TO−92 2000 Units / Tape & Reel MC33064P−5RAG TO−92 (Pb−Free) MC33064P−5RP TO−92 2000 Units / Ammo Pack MC33064P−5RPG TO−92 (Pb−Free) MC33064SN−5T1 TSOP−5 3000 Units / Tape & Reel MC33064SN−5T1G TSOP−5 (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV33064: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change control. MC34064, MC33064, NCV33064 http://onsemi.com 7 ORDERING INFORMATION Device Shipping†PackageOperating Temperature Range NCV33064D−5R2* TA = −40°C to +125°C SOIC−8 2500 Units / Tape & Reel NCV33064D−5R2G* SOIC−8 (Pb−Free) NCV33064P−5RA* TO−92 2000 Units / Tape & Reel NCV33064P−5RAG* TO−92 (Pb−Free) NCV33064P−5RP* TO−92 2000 Units / Ammo Pack NCV33064P−5RPG* TO−92 (Pb−Free) NCV33064DM−5R2* Micro8 4000 Units / Tape & Reel NCV33064DM−5R2G* Micro8 (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV33064: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change control. V3064 ALYW5 � SOIC−8 D SUFFIX CASE 751 x = 3 or 4 y = C or I A = Assembly Location L = Wafer Lot Y = Year W, WW = Work Week � = Pb−Free Package MARKING DIAGRAMS Micro8 DM SUFFIX CASE 846A 1 8 TO−92 P SUFFIX CASE 29 1 2 3 TSOP−5 SN SUFFIX CASE 483 1 5 SRB AYW� � MC3x0 64P−5 ALYWW � � 1 2 3 NCV30 64P−5 ALYWW � � (Note: Microdot may be in either location) 1 5 SSN AYW� � MC34064 MC33064 1 8 3x064 ALYW5 � 1 8 Ly50 AYW� � 1 8 VI50 AYW� � MC34064, MC33064, NCV33064 http://onsemi.com 8 PACKAGE DIMENSIONS SOIC−8 D SUFFIX PLASTIC PACKAGE CASE 751−07 ISSUE AG SEATING PLANE 1 4 58 N J X 45� K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A B S DH C 0.10 (0.004) DIM A MIN MAX MIN MAX INCHES 4.80 5.00 0.189 0.197 MILLIMETERS B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.053 0.069 D 0.33 0.51 0.013 0.020 G 1.27 BSC 0.050 BSC H 0.10 0.25 0.004 0.010 J 0.19 0.25 0.007 0.010 K 0.40 1.27 0.016 0.050 M 0 8 0 8 N 0.25 0.50 0.010 0.020 S 5.80 6.20 0.228 0.244 −X− −Y− G MYM0.25 (0.010) −Z− YM0.25 (0.010) Z S X S M � � � � 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155 � mm inches �SCALE 6:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* MC34064, MC33064, NCV33064 http://onsemi.com 9 PACKAGE DIMENSIONS SBM0.08 (0.003) A ST DIM MIN MAX MIN MAX INCHESMILLIMETERS A 2.90 3.10 0.114 0.122 B 2.90 3.10 0.114 0.122 C −−− 1.10 −−− 0.043 D 0.25 0.40 0.010 0.016 G 0.65 BSC 0.026 BSC H 0.05 0.15 0.002 0.006 J 0.13 0.23 0.005 0.009 K 4.75 5.05 0.187 0.199 L 0.40 0.70 0.016 0.028 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. 846A−01 OBSOLETE, NEW STANDARD 846A−02. −B− −A− D K GPIN 1 ID 8 PL 0.038 (0.0015) −T− SEATING PLANE C H J L Micro8 DM SUFFIX PLASTIC PACKAGE CASE 846A−02 ISSUE F 8X 8X 6X � mm inches �SCALE 8:1 1.04 0.041 0.38 0.015 5.28 0.208 4.24 0.167 3.20 0.126 0.65 0.0256 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* MC34064, MC33064, NCV33064 http://onsemi.com 10 PACKAGE DIMENSIONS TSOP−5 SN SUFFIX PLASTIC PACKAGE CASE 483−02 ISSUE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. A AND B DIMENSIONS DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM MIN MAX MIN MAX INCHESMILLIMETERS A 2.90 3.10 0.1142 0.1220 B 1.30 1.70 0.0512 0.0669 C 0.90 1.10 0.0354 0.0433 D 0.25 0.50 0.0098 0.0197 G 0.85 1.05 0.0335 0.0413 H 0.013 0.100 0.0005 0.0040 J 0.10 0.26 0.0040 0.0102 K 0.20 0.60 0.0079 0.0236 L 1.25 1.55 0.0493 0.0610 M 0 10 0 10 S 2.50 3.00 0.0985 0.1181 0.05 (0.002) 1 2 3 5 4S A G L B D H C K M J � � � � 0.7 0.028 1.0 0.039 � mm inches �SCALE 10:1 0.95 0.037 2.4 0.094 1.9 0.074 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* MC34064, MC33064, NCV33064 http://onsemi.com 11 PACKAGE DIMENSIONS TO−92 P SUFFIX PLASTIC PACKAGE CASE 29−11 ISSUE AL NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. R A P J L B K G H SECTION X−X CV D N N X X SEATING PLANE DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.175 0.205 4.45 5.20 B 0.170 0.210 4.32 5.33 C 0.125 0.165 3.18 4.19 D 0.016 0.021 0.407 0.533 G 0.045 0.055 1.15 1.39 H 0.095 0.105 2.42 2.66 J 0.015 0.020 0.39 0.50 K 0.500 −−− 12.70 −−− L 0.250 −−− 6.35 −−− N 0.080 0.105 2.04 2.66 P −−− 0.100 −−− 2.54 R 0.115 −−− 2.93 −−− V 0.135 −−− 3.43 −−− 1 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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