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LM386 Low Voltage Audio Power Amplifier General Description The LM386 is a power amplifier designed for use in low volt- age consumer applications. The gain is internally set to 20 to keep external part count low, but the addition of an external resistor and capacitor between pins 1 and 8 will increase the gain to any value up to 200. The inputs are ground referenced while the output is auto- matically biased to one half the supply voltage. The quies- cent power drain is only 24 milliwatts when operating from a 6 volt supply, making the LM386 ideal for battery operation. Features n Battery operation n Minimum external parts n Wide supply voltage range: 4V–12V or 5V–18V n Low quiescent current drain: 4 mA n Voltage gains from 20 to 200 n Ground referenced input n Self-centering output quiescent voltage n Low distortion n Available in 8 pin MSOP package Applications n AM-FM radio amplifiers n Portable tape player amplifiers n Intercoms n TV sound systems n Line drivers n Ultrasonic drivers n Small servo drivers n Power converters Equivalent Schematic and Connection Diagrams DS006976-1 Small Outline, Molded Mini Small Outline, and Dual-In-Line Packages DS006976-2 Top View Order Number LM386M-1, LM386MM-1, LM386N-1, LM386N-3 or LM386N-4 See NS Package Number M08A, MUA08A or N08E January 2000 LM 386 Low V oltage Audio Pow erAm plifier © 2000 National Semiconductor Corporation DS006976 www.national.com Absolute Maximum Ratings (Note 2) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (LM386N-1, -3, LM386M-1) 15V Supply Voltage (LM386N-4) 22V Package Dissipation (Note 3) (LM386N) 1.25W (LM386M) 0.73W (LM386MM-1) 0.595W Input Voltage ±0.4V Storage Temperature −65˚C to +150˚C Operating Temperature 0˚C to +70˚C Junction Temperature +150˚C Soldering Information Dual-In-Line Package Soldering (10 sec) +260˚C Small Outline Package (SOIC and MSOP) Vapor Phase (60 sec) +215˚C Infrared (15 sec) +220˚C See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices. Thermal Resistance θJC (DIP) 37˚C/W θJA (DIP) 107˚C/W θJC (SO Package) 35˚C/W θJA (SO Package) 172˚C/W θJA (MSOP) 210˚C/W θJC (MSOP) 56˚C/W Electrical Characteristics (Notes 1, 2) TA = 25˚C Parameter Conditions Min Typ Max Units Operating Supply Voltage (VS) LM386N-1, -3, LM386M-1, LM386MM-1 4 12 V LM386N-4 5 18 V Quiescent Current (IQ) VS = 6V, VIN = 0 4 8 mA Output Power (POUT) LM386N-1, LM386M-1, LM386MM-1 VS = 6V, RL = 8Ω, THD = 10% 250 325 mW LM386N-3 VS = 9V, RL = 8Ω, THD = 10% 500 700 mW LM386N-4 VS = 16V, RL = 32Ω, THD = 10% 700 1000 mW Voltage Gain (AV) VS = 6V, f = 1 kHz 26 dB 10 µF from Pin 1 to 8 46 dB Bandwidth (BW) VS = 6V, Pins 1 and 8 Open 300 kHz Total Harmonic Distortion (THD) VS = 6V, RL = 8Ω, POUT = 125 mW 0.2 % f = 1 kHz, Pins 1 and 8 Open Power Supply Rejection Ratio (PSRR) VS = 6V, f = 1 kHz, CBYPASS = 10 µF 50 dB Pins 1 and 8 Open, Referred to Output Input Resistance (RIN) 50 kΩ Input Bias Current (IBIAS) VS = 6V, Pins 2 and 3 Open 250 nA Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified. Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is func- tional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guar- antee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is given, however, the typical value is a good indication of device performance. Note 3: For operation in ambient temperatures above 25˚C, the device must be derated based on a 150˚C maximum junction temperature and 1) a thermal resis- tance of 107˚C/W junction to ambient for the dual-in-line package and 2) a thermal resistance of 170˚C/W for the small outline package. LM 38 6 www.national.com 2 Application Hints GAIN CONTROL To make the LM386 a more versatile amplifier, two pins (1 and 8) are provided for gain control. With pins 1 and 8 open the 1.35 kΩ resistor sets the gain at 20 (26 dB). If a capacitor is put from pin 1 to 8, bypassing the 1.35 kΩ resistor, the gain will go up to 200 (46 dB). If a resistor is placed in series with the capacitor, the gain can be set to any value from 20 to 200. Gain control can also be done by capacitively cou- pling a resistor (or FET) from pin 1 to ground. Additional external components can be placed in parallel with the internal feedback resistors to tailor the gain and fre- quency response for individual applications. For example, we can compensate poor speaker bass response by fre- quency shaping the feedback path. This is done with a series RC from pin 1 to 5 (paralleling the internal 15 kΩ resistor). For 6 dB effective bass boost: R ≅ 15 kΩ, the lowest value for good stable operation is R = 10 kΩ if pin 8 is open. If pins 1 and 8 are bypassed then R as low as 2 kΩ can be used. This restriction is because the amplifier is only compensated for closed-loop gains greater than 9. INPUT BIASING The schematic shows that both inputs are biased to ground with a 50 kΩ resistor. The base current of the input transis- tors is about 250 nA, so the inputs are at about 12.5 mV when left open. If the dc source resistance driving the LM386 is higher than 250 kΩ it will contribute very little additional offset (about 2.5 mV at the input, 50 mV at the output). If the dc source resistance is less than 10 kΩ, then shorting the unused input to ground will keep the offset low (about 2.5 mV at the input, 50 mV at the output). For dc source resistances between these values we can eliminate excess offset by put- ting a resistor from the unused input to ground, equal in value to the dc source resistance. Of course all offset prob- lems are eliminated if the input is capacitively coupled. When using the LM386 with higher gains (bypassing the 1.35 kΩ resistor between pins 1 and 8) it is necessary to by- pass the unused input, preventing degradation of gain and possible instabilities. This is done with a 0.1 µF capacitor or a short to ground depending on the dc source resistance on the driven input. LM 386 www.national.com3 Typical Performance Characteristics Quiescent Supply Current vs Supply Voltage DS006976-5 Power Supply Rejection Ratio (Referred to the Output) vs Frequency DS006976-12 Peak-to-Peak Output Voltage Swing vs Supply Voltage DS006976-13 Voltage Gain vs Frequency DS006976-14 Distortion vs Frequency DS006976-15 Distortion vs Output Power DS006976-16 Device Dissipation vs Output Power — 4Ω Load DS006976-17 Device Dissipation vs Output Power — 8Ω Load DS006976-18 Device Dissipation vs Output Power — 16Ω Load DS006976-19 LM 38 6 www.national.com 4 Typical Applications Amplifier with Gain = 20 Minimum Parts DS006976-3 Amplifier with Gain = 200 DS006976-4 Amplifier with Gain = 50 DS006976-6 Low Distortion Power Wienbridge Oscillator DS006976-7 Amplifier with Bass Boost DS006976-8 Square Wave Oscillator DS006976-9 LM 386 www.national.com5 Typical Applications (Continued) Note 4: Twist Supply lead and supply ground very tightly. Note 5: Twist speaker lead and ground very tightly. Note 6: Ferrite bead in Ferroxcube K5-001-001/3B with 3 turns of wire. Note 7: R1C1 band limits input signals. Note 8: All components must be spaced very closely to IC. Frequency Response with Bass Boost DS006976-10 AM Radio Power Amplifier DS006976-11 LM 38 6 www.national.com 6 Physical Dimensions inches (millimeters) unless otherwise noted SO Package (M) Order Number LM386M-1 NS Package Number M08A LM 386 www.national.com7 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 8-Lead (0.118” Wide) Molded Mini Small Outline Package Order Number LM386MM-1 NS Package Number MUA08A LM 38 6 www.national.com 8 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 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