TDA7050

DATASHEETProductspecificationFileunderIntegratedCircuits,IC01June1989INTEGRATEDCIRCUITSTDA7050Lowvoltagemono/stereopoweramplifierJune19892PhilipsSemiconductorsProductspecificationLowvoltagemono/stereopoweramplifierTDA7050GENERALDESCRIPTIONTheTDA7050isalowvoltageaudioamplifierforsmallradioswithheadphones(suchaswatch,penandpocketradios)inmono(bridge-tiedload)orstereoapplications.Features•Limitedtobatterysupplyapplicationonly(typ.3and4V)•Operateswithsupplyvoltagedownto1,6V•Noexternalcomponentsrequired•Verylowquiescentcurrent•Fixedintegratedgainof26dB,floatingdifferentialinput•Flexibilityinuse−monoBTLaswellasstereo•Smalldimensionofencapsulation(seepackagedesignexample)QUICKREFERENCEDATAPACKAGEOUTLINE8-leadDIL;plastic(SOT97);SOT97-1;1996July23.SupplyvoltagerangeVP1,6to6,0VTotalquiescentcurrent(atVP=3V)Itottyp.3,2mABridgetiedloadapplication(BTL)OutputpoweratRL=32ΩVP=3V;dtot=10%Potyp.140mWD.C.outputoffsetvoltagebetweentheoutputs|∆V|max.70mVNoiseoutputvoltage(r.m.s.value)atf=1kHz;RS=5kΩVno(rms)typ.140µVStereoapplicationOutputpoweratRL=32Ωdtot=10%;VP=3VPotyp.35mWdtot=10%;VP=4,5VPotyp.75mWChannelseparationatRS=0Ω;f=1kHzαtyp.40dBNoiseoutputvoltage(r.m.s.value)atf=1kHz;RS=5kΩVno(rms)typ.100µVJune19893PhilipsSemiconductorsProductspecificationLowvoltagemono/stereopoweramplifierTDA7050RATINGSLimitingvaluesinaccordancewiththeAbsoluteMaximumSystem(IEC134)THERMALRESISTANCESupplyvoltageVPmax.6VPeakoutputcurrentIOMmax.150mATotalpowerdissipationseederatingcurveFig.1StoragetemperaturerangeTstg−55to+150°CCrystaltemperatureTcmax.100°CA.C.andd.c.short-circuitdurationatVP=3,0V(duringmishandling)tscmax.5sFromjunctiontoambientRthj-a=110K/WFig.1Powerderatingcurve.June19894PhilipsSemiconductorsProductspecificationLowvoltagemono/stereopoweramplifierTDA7050CHARACTERISTICSVP=3V;f=1kHz;RL=32Ω;Tamb=25°C;unlessotherwisespecifiedNote1.OutputpowerismeasureddirectlyattheoutputpinsoftheIC.ItisshownasafunctionofthesupplyvoltageinFig.2(BTLapplication)andFig.3(stereoapplication).PARAMETERSYMBOLMIN.TYP.MAX.UNITSupplySupplyvoltageVP1,6−6,0VTotalquiescentcurrentItot−3,24mABridge-tiedloadapplication(BTL);seeFig.4Outputpower;note1VP=3,0V;dtot=10%Po−140−mWVP=4,5V;dtot=10%(RL=64Ω)Po−150−mWVoltagegainGv−32−dBNoiseoutputvoltage(r.m.s.value)RS=5kΩ;f=1kHzVno(rms)−140−µVRS=0Ω;f=500kHz;B=5kHzVno(rms)−tbf−µVD.C.outputoffsetvoltage(atRS=5kΩ)|∆V|−−70mVInputimpedance(atRS=∞)|Zi|1−−MΩInputbiascurrentIi−40−nAStereoapplication;seeFig.5Outputpower;note1VP=3,0V;dtot=10%Po−35−mWVP=4,5V;dtot=10%Po−75−mWVoltagegainGv24.52627.5dBNoiseoutputvoltage(r.m.s.value)RS=5kΩ;f=1kHzVno(rms)−100−µVRS=0Ω;f=500kHz;B=5kHzVno(rms)−tbf−µVChannelseparationRS=0Ω;f=1kHzα3040−dBInputimpedance(atRS=∞)|Zi|2−−MΩInputbiascurrentIi−20−nAJune19895PhilipsSemiconductorsProductspecificationLowvoltagemono/stereopoweramplifierTDA7050Fig.2Outputpoweracrosstheloadimpedance(RL)asafunctionofsupplyvoltage(VP)inBTLapplication.Measurementsweremadeatf=1kHz;dtot=10%;Tamb=25°C.Fig.3Outputpoweracrosstheloadimpedance(RL)asafunctionofsupplyvoltage(VP)instereoapplication.Measurementsweremadeatf=1kHz;dtot=10%;Tamb=25°C.June19896PhilipsSemiconductorsProductspecificationLowvoltagemono/stereopoweramplifierTDA7050APPLICATIONINFORMATIONFig.4Applicationdiagram(BTL);alsousedastestcircuit.Fig.5Applicationdiagram(stereo);alsousedastestcircuit.June19897PhilipsSemiconductorsProductspecificationLowvoltagemono/stereopoweramplifierTDA7050PACKAGEOUTLINEREFERENCESOUTLINEVERSIONEUROPEANPROJECTIONISSUEDATEIECJEDECEIAJSOT97-192-11-1795-02-04UNITAmax.12b1(1)(1)(1)b2cDEeMZHLmmDIMENSIONS(inchdimensionsarederivedfromtheoriginalmmdimensions)Amin.Amax.bmax.wMEe11.731.140.530.380.360.239.89.26.486.203.603.050.2542.547.628.257.8010.08.31.154.20.513.2inches0.0680.0450.0210.0150.0140.0091.070.890.0420.0350.390.360.260.240.140.120.010.100.300.320.310.390.330.0450.170.0200.13b2050G01MO-001ANMHc(e)1MEALseatingplaneA1wMb1eDA2Z8154bE0510mmscaleNote1.Plasticormetalprotrusionsof0.25mmmaximumpersidearenotincluded.pin1indexDIP8:plasticdualin-linepackage;8leads(300mil)SOT97-1June19898PhilipsSemiconductorsProductspecificationLowvoltagemono/stereopoweramplifierTDA7050SOLDERINGIntroductionThereisnosolderingmethodthatisidealforallICpackages.Wavesolderingisoftenpreferredwhenthrough-holeandsurfacemountedcomponentsaremixedononeprinted-circuitboard.However,wavesolderingisnotalwayssuitableforsurfacemountedICs,orforprinted-circuitswithhighpopulationdensities.Inthesesituationsreflowsolderingisoftenused.Thistextgivesaverybriefinsighttoacomplextechnology.Amorein-depthaccountofsolderingICscanbefoundinour“ICPackageDatabook”(ordercode939865290011).SolderingbydippingorbywaveThemaximumpermissibletemperatureofthesolderis260°C;solderatthistemperaturemustnotbeincontactwiththejointformorethan5seconds.Thetotalcontacttimeofsuccessivesolderwavesmustnotexceed5seconds.Thedevicemaybemounteduptotheseatingplane,butthetemperatureoftheplasticbodymustnotexceedthespecifiedmaximumstoragetemperature(Tstgmax).Iftheprinted-circuitboardhasbeenpre-heated,forcedcoolingmaybenecessaryimmediatelyaftersolderingtokeepthetemperaturewithinthepermissiblelimit.RepairingsolderedjointsApplyalowvoltagesolderingiron(lessthan24V)tothelead(s)ofthepackage,belowtheseatingplaneornotmorethan2mmaboveit.Ifthetemperatureofthesolderingironbitislessthan300°Citmayremainincontactforupto10seconds.Ifthebittemperatureisbetween300and400°C,contactmaybeupto5seconds.DEFINITIONSLIFESUPPORTAPPLICATIONSTheseproductsarenotdesignedforuseinlifesupportappliances,devices,orsystemswheremalfunctionoftheseproductscanreasonablybeexpectedtoresultinpersonalinjury.PhilipscustomersusingorsellingtheseproductsforuseinsuchapplicationsdosoattheirownriskandagreetofullyindemnifyPhilipsforanydamagesresultingfromsuchimproperuseorsale.DatasheetstatusObjectivespecificationThisdatasheetcontainstargetorgoalspecificationsforproductdevelopment.PreliminaryspecificationThisdatasheetcontainspreliminarydata;supplementarydatamaybepublishedlater.ProductspecificationThisdatasheetcontainsfinalproductspecifications.LimitingvaluesLimitingvaluesgivenareinaccordancewiththeAbsoluteMaximumRatingSystem(IEC134).Stressaboveoneormoreofthelimitingvaluesmaycausepermanentdamagetothedevice.ThesearestressratingsonlyandoperationofthedeviceattheseoratanyotherconditionsabovethosegivenintheCharacteristicssectionsofthespecificationisnotimplied.Exposuretolimitingvaluesforextendedperiodsmayaffectdevicereliability.ApplicationinformationWhereapplicationinformationisgiven,itisadvisoryanddoesnotformpartofthespecification. GENERALDESCRIPTION QUICKREFERENCEDATA PACKAGEOUTLINE RATINGS THERMALRESISTANCE CHARACTERISTICS APPLICATIONINFORMATION PACKAGEOUTLINE SOT97-1 SOLDERING DEFINITIONS