PCB English word

PCB缺陷中英文对照表FQCAppearancecheckingitems1板面凹痕dent41漏印字符skip1粉红圈Pinkring2内层白斑I/Lwhitespot42金粗Autoobig2焊盘崩缺Brokenannularring3线路缺口circuitnick43金簿Autoothin3蚀刻不净Underetching4蚀刻不净underingetching44金手指缺口G/Fvoids/nickonG/F4焊盘脱落Padpeeloff5绿油剥离S/Mpeeloff45金手指发黑G/Ftooblack5绿油上焊盘S/Monpad6显影不净underdeveloping46字符印反inverseC/M6绿油图形移位Patternmis-registration7基材白点laminatemeasling47金手指针孔G/Fpinholes7绿油露线Exposetrace8铜面氧化copperoxide48标志不清symbolunclear8油薄UnevenS/Mthickness9绿油上焊盘s/monpad49标志错symbolwrong9入孔S/Minhole10白字上焊盘c/monpad50绿油鬼影ghostinS/M10绿油冲板不良S/Munderdevelop11阻焊不良poorS/M51手指印fingerprint11漏塞孔S/Munplugged12线路擦花trackscratch52补线不良poorlinerepairing12IC栏不良PoorICbarrier13锡上线snoncircuit53锡高exessivesolder13绿油脱落S/Mpeeloff14聚锡snmass54孔小holeundersize14塞孔不满IncompleteS/Mplugging15锡灰sngray55字符错wrongC/M15多开绿油窗Extraopening16焊盘露铜cuexposedonpad56字符印偏C/Mmisalignment16溶剂测试失败Failinsolventtest17锡上金手指snonG/F57字符入孔C/Minhole17漏印Skipprinting18金手指凹痕G/Fdent58字符重影C/Mdoubloeimage18水印Watermark19金手指擦花G/Fscratch59漏镀金手指missingplatingG/F19断绿油桥S/MBridgebroken20金手指粗糙G/Froughness60金手指发白G/Fgray20绿油下氧化Oxidationundersoldermask21v-cut不良poorV-cut61焊盘脱落padbreakoff/padpeeloff21返工不良Poorrework22倒边不良poormilling62焊盘露铜padexposecu22错油WrongInk23针床压伤ETdent63断绿油桥missingS/Mbridge23漏印字符Missinglegendink24拖锡不良poortouchup64塞孔blockhole24字符入孔LegendinHole25补金不良poorrepairingAu65水迹waterprint25字符脱落Legendpeeloff26补油不良poorrepairings/m66锡珠solderball26字符上焊盘Legendonpad27针孔pinhole67砂孔pitting27字符不清Illegiblelegend28胶渍pasterstain68油薄28日期不清Illegibledatecode29k孔内毛刺burrsinhole69聚油excesssoldermask29锣坑次品MillingDefects30锡珠入孔solderinhole70锡粗Sntoothick30啤板方向错Wrongpunchdirection31露铜exposeCu71线路上锡Snoverlapscratch31漏锣Missingrouting32露镍exposeNi72绿油下杂物contaminationunderS/M32漏斜切Missingchamfering33绿油起泡soldermaskblister73焊盘损坏landdamage33斜边过度Overchamfefing34绿油起皱soldermaskwinbles74焊盘翘起liftedland34错外形尺寸Wrongoutlinedimension35金手指氧化G/Foxiding75偏位misregistration35倒边不良Bevellingdefect36金颜色不良Audiscoloration76漏钻孔missinghole36金手指脱落Goldfingerpeeloff37金面凸起Ausurfaceblister77焊盘缺口nickonpad37露镍、铜Ni/Cuexposure38绿油入孔soldermaskinhole78线路缺口nickontrack38缺口Nick(G/F)39爆板boardangledamafe39涂层不良PoorENTEK40翘板warp40锡上金手指SolderonG/F1开路opencircuit46焊盘翘起liftedland41上锡不良Dewetting2短路shortcircuit47漏钻孔missinghole42不上锡Nonwetting线路狗牙circuitwist48露布纹weaveexposure43锡珠、锡堆Solderball/lump3线路缺口circuitnick49钻偏孔holemisregistratiion44锡上线Solderontrace4线路凹痕circuitdent50孔损害holedamage45针痕Pinmark5渗镀platingBloody51基材分层delamination46阻抗超出要求Impedanceoutofrequirement6焊盘缺口padnick52蚀刻过度overetching47 工程 路基工程安全技术交底工程项目施工成本控制工程量增项单年度零星工程技术标正投影法基本原理 试验Evaluation7内层白斑I/Lwhitespot53多孔holetoomuch48微切片（出货）Microsection(outgoing)8黑化不良poorB.O54残铜remainCu49微切片（工程试验用）Microsection(engineering)9爆板measling55孔内露基材laminateexposureinhole10粉红圈pinkingring56焊盘脱落padbreakoff11层压起泡pressblister57焊盘凹痕paddent12错位misregistation58焊盘凸起padbulge13偏位shift59焊盘损坏paddamaged14孔内无铜noCuonPth60焊盘缺口padnick15孔内毛刺holeburrs61焊盘露铜padexposeCu16NPTH有铜CuonNPTH30修理不良poorrepairing17铜面露基材exposedlaminate31铜薄coppertoothin18铜面凹痕dentonCusurface32内层擦花I/Lscratch19胶渍gumresidue33内层偏位I/Lmisregistation20夹膜D/Fnip34内层杂物I/Linclusions21蚀刻不尽underetching35掉膜filmoff22线幼linetoothin36干膜碎D/Fmeaking23孔大holeoversize37退锡不尽poorSnstripping24孔小holeundersize38间隙小spacetoomarrow25偏孔holemisregistration39板薄boardtoothin26铜面瘤粒Cunodule40板厚boardtoothickness27显影不尽underdeveloping41针孔pinhole28铜面刮伤scratchonCusurface42崩孔breakout29塞孔holeplugged43侧蚀undrcut45亚色dullcolour44镀层粗糙platinglayerroughness内层开路Inneropen板过厚Overthickness内层断路Innershort白点（压板）Measling(Pressing)外层开路Outeropen白点（喷锡）Measling(HSAL)外层断路Outershort板曲Warpage内层蚀刻过度Inneroverecthing板焦黄Burnt外层蚀刻过度Outeroverecthing起皱Wrinkle内层树脂气泡Resinvoid起泡（压板）Blistering(Pressing)内层杂物Foreignmaterial镀层起泡Blistering(Cuplating)内层图形移位Innerpatternmis-registration喷锡起泡Blistering(HSAL)层与层移位Layertolayermis-registration板面凹痕DENT(PressingprofillingG/F)打孔不良Impropertargeting白斑Crazing内层蚀刻不净Innerunderetching胶渣Gumresidue露布纹Weavetexture/exposure板损坏Damagedboard檫花（氧化膜面）Scratch(Oxidesurface)分层（物料）Delamination(Rawmaterial)缺口Nick　/　voidonpad内层不配套Excessiveinnercore曝光过度Over-exposure多孔Extrahole曝光不良Underexposure偏孔Holeshift显影不足Underdevelop孔径大Holeoversize干膜脱落D/FPeeloff孔径小Holeundersize干膜碎D/FRdsidue少孔MissingHole干膜移位D/FMis-registration塞孔Blockhole标志不清（曝光）Illegiblemarking(exposure)崩孔Holebreakout错菲林WrongA/W孔粗糙(镀铜）Holeroughness（Cuplating)非镀铜孔有铜CopperinNPTH孔粗糙（机械钻孔）Holeroughness(mechanicaldrill)镀铜孔内无铜NocopperinPTH崩线、线路缺口Nick　/　voidontrace渗镀Nickelsmear孔未穿Incompletedrilling电镀粗糙Roughplating披锋Burr孔壁缺口Holevoid(Cu)金手指颜色不良GoldFingerdiscoloration铜碎Copperresidue金面颜色不良Golddiscoloration黑孔BlackHole金面阴阳色Twotonecolourongoldsurface镀层白渍Platinghaze铜、镍脱落Copper/Nickelpeeloff金手指凸出Protrusion(G/F)铜镀层厚度超要求Copperthicknessoutofrequirement板污Boardcontamination漏镀（金手指等）Skipplating(G/FENIGCu)手指套Glovemark金面污点Stainongoldsurface褪锡不良ImproperTinstripping电镀针孔Platingpits(Cu)微短路Microshort镀锡缺点Tinplatingdefect