SMT制程一课

SMT制程一课SDcardsocketSOPBGAQFNConnecterCrystalDSC-MainboardMaincomponent--BGAchipsetDSC-FPCboardOpticalcomponent--CCDSMTIntroductionAutomaticSMTline:71linesLocation:Cbuild-Floor2~42Dbuild-Floor3,42Ebuild-Floor2,3,4Linechange：30minsProductionEfficiency：99.5%Throughrate:88%DefectPPM:50PPMLostrate:0.4%PCBAaverageoutput:400K/monthControlbyKPISMTprocessPCBAFlowChartPCBPartsPrinterMountReflowSMTS.M.T:SurfaceMountTechnologyWhatisSMT:GoodPrint,andMountGood!!DIPSONYSIP-950SONYSIP-300SONYSVP-2000TypeStencilsize(mm)PrintdirectionWipePCBsize(mm)PCBThickness(mm)Printprecision(μm)SVP-2000650*550*30Y-dir.Automatic(Wet,Dry&Vacuum)(W)50*(D)50~(W)250*(D)3300.3~1.6±25SIP-950650*550*30X-dir.Automatic(Wet,Dry&Vacuum)(W)50*(D)70~(W)460*(D)3600.3~2.5±12SIP-300650*550*30Y-dir.Automatic(Wet,Dry&Vacuum)(W)50*(D)50~(W)460*(D)5100.4~3.0±20SMTEquipment–Printer(SONY)Solderpastevendor(Lead-freetype)PhotoSuppliersSenjuSenjuTypeM705-GRN360-K2-VL23-BLT5-T7FPowderalloySn96.5/Ag3.0/Cu0.5Sn42/Ag1.0/Bi57Meltpoint217℃138~204℃Powdersize25-36µm25-36µmFluxcontent10.5-12.5%10.0%Viscosity(pa.s)200200StencildesignruleTypePrecision(mm)Speed(sec)ComponentsizeComponentheight(mm)MinPitch(mm)AnglePCBsize(mm)PCBheight(mm)E-1000/11000.060.17Chip0402-□12m㎡1~60.30--360º50*50-460*3600.5-2.6F-1300.060.139Chip0201-□12m㎡1~60.30--360º50*50-460*3600.5-2.6SMT-Mounter(SONY)SMT實裝設備中高速機(SONY)SMT實裝設備汎用機(SONY)TypePrecision(mm)Speed(sec)ComponentsizeComponentheight(mm)MinPitch(mm)AnglePCBsize(mm)PCBheight(mm)E-2000/21000.04Moved:0.6Fixed:1.4Chip2012-□32m㎡<250.30--360º50*50-460*3600.5-2.6F-2090.04Moved:0.49Fixed:1.4Chip2012-□32m㎡<250.30--360º50*50-460*3600.5-2.6SMT-Mounter(SONY)MounterfunctionX-YDATA  CAM350editGerberfileCombinationX-YDataandGerberfilebyCPSNozzleTypenumberAF06021(E&F)AF06042(E&F)AF10071(E&F)AF12082(E&F)AF25200(E&F)Outsidesize0.6mm0.6mm1.0mm1.4mm2.5mmInsidesize0.2mm0.4mm0.7mm1.0mm2.0mmComponent01005,0201RLCchip0402RLCchip0603RLCchip0805RLCchip1208RLCchipTypenumberArticle：Lead-FreeN2ReflowType：NIS-311TR/NIS-2082C/N30-122-RLFCharacteristic：1.TheconsistencyofN2islow-reduce，UsingN2byPSAtocontroloutputandcost2.PPMcontrolsystemtocontroltheconsistencyofO2in500PPM3.UniformheatconvectionmakeBGAandCSPheatcompletely.4.Moreheatingzonecouldofferbettertemperatureprofile(8zonesand12zones)SMT-Reflow(ETC)Method-Reflowprofile(example:Leadfree)25~150℃150~217℃Over217℃Over230℃below217℃Rampup:6℃/sec(max)Rampdown:6℃/sec(max)25℃150℃217℃230℃Pre-heatSoakingReflowCoolingPeaktemp=235~255℃TempTimeSMTprofile–Pre-heatzoneThisheatingzonecausetheuniform-temperatureinallpartofPCBA,thatcanreducePCBwarped,andavoidsolder-pasteheatingdisproportionallytocausesplashdowntogetanotherfailurePre-heatzonetemperaturesetting:(generallysetting,actuallyconstantfollowvendor’sdataspecification)Lead-free–25(roomtemp)~150℃:SMTprofile–SoakingzoneSolder-pasteincludesolderalloyandFlux.Commonly,FluxcontentincludeRosin,Activation,Solvent,andRchologicaladdition.Flux-heatingcancausethecontentofFluxdeoxidizesoldertoraisethesolderingofthejoint.Soakingzonetemperaturesetting:(generallysetting,actuallyconstantfollowvendor’sdataspecificationLead-free–150℃~220℃:SMTprofile–ReflowzoneIntheReflowzone,solder-jointcomesintobeingInterface-alloy,thatbecausemostofmetalbecomesbeingmelting.Peaktemperatureisinthiszone,thatisthehighesttemperatureintheprofile.Generally,inthiszone(230℃topeaktemp)meanssolderalloyisinthemeltingstatesanddifferentmetalsarebecominginterface-alloy.Sometimes,wecanraisetheofthiszonetoreducevoidoccurratio.Reflowzonetemperaturesetting:(generallysetting,actuallyconstantfollowvendor’sdataspecification)Lead-free–Over220℃Peaktemp:235~255℃InIPC610-D,solder-jointmusttobebright,shineandsmooth.Wheninterface-alloycoagulated,therampdownratio(coolingrate)ismorefast,thatcausealloyatomicbondbecomesmoretightly,thatcausesoldersurfaceismoreshineandsmooth.Coolingzonetemperaturesetting:(generallysetting,actuallyconstantfollowvendor’sdataspecification)Lead-free–Rampdownratio:≦6℃/secSMTprofile–CoolingzoneProfilelimitSolder-PasteMpt:217~220℃Reflowpeaktemp:235~255℃Reflowzone(over220℃):60~90secTemperatureprofileboardSixmeasurepoint(foractualPCBstates)Temppoint:criticalpartsExp:BGA,IC,SDConnectorConnectthethermalcoupletomeasureprofileProfilemeasurement(forDataPAQ)勇于开始，才能找到成功的路ReflowprofileAutomaticOpticInspection(AOI)Separationratio：12μm(framesize10X12mm)Separationratio：19μm(framesize15X19mm)Separationratio：15.5μm(framesize19.3X15.5mm)Separationratio：15μm(framesize19.3X15mm)Scanningspeed：0.22sec/aframeScanningspeed：0.30sec/aframeScanningspeed：0.23sec/aframeScanningspeed：0.22sec/aframeInspectiontype：Afterprinting，AfterReflowInspectiontype：AfterprintingInspectiontype：AfterReflowInspectiontype：Afterprinting，AfterReflowCPC-1000CPC-500XCPC-1500Cyclone系列Sampleimageinspectimage1.Adopt2DAOIinspecttechnique；2.InspectionItem：Missingparts/Polarity/Reverse/missingsolder/Bridge/Shift/etc;3.Inspecttheminimumpart：Angularchips0201；AutomaticInspectionCCCsystemFunction：ByRegionalnetwork,controlproductionlineandfeedbacktheNGphenomenonfromAOImachineinfactoryatonce.REPAIRsystemFunction：1.RecordtheNGdataforAOI.2.MarktheNGlocation.3.UsingthestatisticdatatocalculatetheNGratebySPC.OnproductionAOIinlinerecordAOI-CCC/Repairsystem