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PG TU-742 076 http://www.tuc.com.tw Taiwan Union Technology Corp. PG TU-742 076 ConfidentialConfidential Processing GuidelineProcessing Guideline TU-742 / TU-74PTU-742 / TU-74P HalogenHalogen--Free Laminate and PrepregFree Laminate and Prepreg ƒ Halogen, ...

PG TU-742 076
http://www.tuc.com.tw Taiwan Union Technology Corp. PG TU-742 076 ConfidentialConfidential Processing GuidelineProcessing Guideline TU-742 / TU-74PTU-742 / TU-74P HalogenHalogen--Free Laminate and PrepregFree Laminate and Prepreg ƒ Halogen, antimony, and red phosphorous free ƒ Environmental friendly materials ƒ Compatible processing characteristics ƒ Low coefficient of thermal expansion. ƒ Low moisture absorption ƒ Excellent anti-CAF capability TU-742/TU-74P Halogen Free Laminate & Prepreg PG TU-742 076 ConfidentialConfidential TUTU--742 / TU742 / TU--74P Product Range74P Product Range f Laminate 0.002"~0.059" f C/F 1/3 to 5 oz HTE H,1,2 oz MLS f P/P 106,1080,2113,2116,1506, 7628, etc. f CCL size 36"x48",40"x48", 42"x48",42"x40" TU-742/TU-74P Halogen Free Laminate & Prepreg PG TU-742 076 ConfidentialConfidential Recommended Process ConditionsRecommended Process Conditions Note: The following general recommendation of process guidelines are provided to assist laminate and prepreg users for successful processing during PWB fabrication. They are for general review purposes only and process adjustments may be required to achieve optimum results in your specific. 0 40 80 120 160 200 240 0 20 40 60 80 100 120 140 160 180 200 Cycle Time (min) T e m p e r a t u r e ( ° C ) 0 10 20 30 40 50 60 P r e s s u r e ( K g f / c m 2 ) Hot Plate Temperature Pressure Recommended Hot Press Cycle TU-742/TU-74P Halogen Free Laminate & Prepreg PG TU-742 076 ConfidentialConfidential Recommended Process ConditionsRecommended Process Conditions Press Cycle Parameters: Note: The following general recommendation of process guidelines are provided to assist laminate and prepreg users for successful processing during PWB fabrication. They are for general review purposes only and process adjustments may be required to achieve optimum results in your specific. Item Recommendations Vacuum Vacuum lower than 20mmHg before applying heat and pressure Heat up rate 1.5~2.0ºC/min (measured product temperature form 80ºC~140ºC) Pressure Kiss pressure: 8~10kgf/cm2 Full pressure: 20~25kgf/cm2 (Ramp to full pressure when product temperature is between 70~90ºC) Cure time 75min, @180ºC – product temperature Cool down rate <3ºC/min TU-742/TU-74P Halogen Free Laminate & Prepreg PG TU-742 076 ConfidentialConfidential Recommended Process ConditionsRecommended Process Conditions Note: The following general recommendation of process guidelines are provided to assist laminate and prepreg users for successful processing during PWB fabrication. They are for general review purposes only and process adjustments may be required to achieve optimum results in your specific. Oxide Treatment Process: Process Status Black oxide with DMAB reduction treatment Available Black oxide with controlled dissolution of post treatment Available Oxide replacement process Available User friendly material of TU-742, it can make with the same laminate pre-cleaning process, inner layer preparation ,oxide treatment and AOI parameters as std. FR-4. TU-742/TU-74P Halogen Free Laminate & Prepreg PG TU-742 076 ConfidentialConfidential Recommended Process ConditionsRecommended Process Conditions Drilling Parameters:Drilling Parameters: Note: The following general recommendation of process guidelines are provided to assist laminate and prepreg users for successful processing during PWB fabrication. They are for general review purposes only and process adjustments may be required to achieve optimum results in your specific. Diameter (mm) 0.25 0.3 0.4 0.5 1.0 Spindle Speed (Krpm) 120 100 85 80 60 Infeed (mm/s) 20 24 30 38 44 Retract Feed (mm/s) 423 423 423 423 423 Drill bit type UC UC ST ST ST Maximum hit count:1500 hits (use new drills or 1 time re-sharp drills) Board thickness: below 2.5mm (peak drilling for board thickness >2.5mm) Entry board: 0.2mm aluminum sheet Backup board: 1.5mm phenolic board We recommend to add post-baking treatment after drilling Post-baking condition:(170ºC, 1hr) TU-742/TU-74P Halogen Free Laminate & Prepreg PG TU-742 076 ConfidentialConfidential Recommended Process ConditionsRecommended Process Conditions Note: The following general recommendation of process guidelines are provided to assist laminate and prepreg users for successful processing during PWB fabrication. They are for general review purposes only and process adjustments may be required to achieve optimum results in your specific. DesmearDesmear Parameters:Parameters: Solvent conditioning process Process Chemical Type Conditions Sweller Glycol ester based 70~75°C/ 6~8min Permanganate Alkaline Permanganate Oxidizer KMnO4 or NaMnO4 70~75°C/ 12~15min TU-742/TU-74P Halogen Free Laminate & Prepreg PG TU-742 076 ConfidentialConfidential Storage for Prepreg Storage for Prepreg f 3 months shelf-life at 23°C/50% R.H. follows IPC recommendation f Store at lower temp. for extended shelf-life f Avoid high humidity environment as it causes the deterioration of properties f Open packaging prior to application and repack unused materials to minimize water absorption TU-742/TU-74P Halogen Free Laminate & Prepreg PG TU-742 076 ConfidentialConfidential Storage for LaminateStorage for Laminate f Minimum 2 years shelf-life from manufacturing date f Store flat, avoid bending and scratching f Prevent unnecessary exposure to atmosphere f Avoid direct exposure to sunlight and high moisture storage TU-742 / TU-74P Storage for Prepreg
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