IPC-7095C新版本技术变化

IPC-7095CDesignandAssemblyProcessImplementationForBGAs1OverviewWiththeintroductionofBGAcomponents,thingshadtochange:• Newdesign• Newassemblyprocess• Newrepairprocess• Newinspectiontechniques2AllinformationinthispresentationisadaptedfromtheIPC-7095CdocumentScope• CoversthechallengesforimplementingalltypesofBGAcomponents• Informationindocumentfocusesoninspection,repairandreliabilitywithBGAcomponents3Purpose• ToprovidepracticalandusefulinformationtousersofBGAcomponents• Targetaudienceismanagers,designandprocessengineers,operatorsandtechnicians4Intent• ThisdocumentidentifiesmanyoftheissuesinvolvedwhichwillinfluencetheimplementationofarobustBGAassemblyprocess• Theaccept/rejectcriteriaisfoundinJ-STD-001andIPC-A-6105ApplicableDocumentsThereisalistof• 27IPCDocuments• 16JEDECDocuments6WhyBGAComponents• Peripheraldeviceswith1.00mmpitchhavebecomecommonplace,howeverthesepackagescannotaccommodatemorethan84pins.• Largerpincountdevicesrequireleadpitcheson0.65mm,0.5mmor0.3mm• Thereforeatthesepitchesleadsareveryfragileandsusceptibletodamage.• TheBGAeliminatedleadandcoplanarityproblems7BGAPackageManufacturingProcess8Infrastructure• LandPatternsandcircuitboardconsiderations.• Technologycomparison9ConductorsBetweenBGAConnections• ThisgetsintothesizeoftheBGAandthenumberoftraceswhichcanbeusedbetweentheballsoftheBGAcomponent10ConductorWidthtoPitchRelationship11Infrastructure• AssemblyEquipmentImpact• StencilRequirements• InspectionRequirements• Test12LimitationsandIssues• Visualinspection• Moisturesensitivity• Rework• Cost• Availability• VoidsinBGA• Openjoints• Head-on-Pillowphenomenon• Standardsandtheiradoption• Reliabilityconcerns13LimitationsandIssues3.5.8PadCratering–definedasaseparationofthepadfromthePCBresin/weavecompositeorwithinthecompositeimmediatelyadjacenttothepad,alsoknowas“laminatecrack”14LimitationsandIssues15ComponentConsideration4.1SemiconductorPackagingComparisonandDrivers4.2DieMountingintheBGAPackage16BGAStandards4.3.1IndustryStandard• BGAPackage• FinePitchBGAPackage• DieSize• BallPitch• LandPatternApproximation• BGApackageoutline• Ballsizerelationships• PackageonPackage• Coplanarity17ComponentConsideration4.4ComponentPackagingStyleConsideration• BaseMaterial• SolderballAlloy• Ballattachmentprocess• CeramicBGA,ColumnGridArray• MultipleDiepackaging18ComponentConsideration• 4.5BGAcomponentandSockets• 4.6ConstructionMaterials• 4.7PackageDesign• 4.8AcceptanceCriteriaandshippingFormat19BoardsandOtherMountingStructuresSection5.0covers:• Laminatesormountingstructures• Laminateproperties• SurfaceFinishes• SolderableCoatings2021BoardsandOtherMountingStructures5.4SolderMask• WetandDryFilmmask• Photoimageablesoldermask• ViaProtection22FinePitchBGAMicroviaInPadStrategies23PCBAssemblyDesignConsiderations6.4ImpactofWaveSolderonTopSidedBGAs6.5Testabilityandtestpoints6.6OtherdesignforMfgissues6.7ThermalManagement6.8DocumentationandelectronicDataTransfer24AssemblyofBGAtothePCB-Section7• Solderpaste• Stencils• PowderSize• Pastevolume• ComponentPlacementandInsp• Reflowandprofile25TimeandTempProfiles26TimeandTempProfiles27AssemblyofBGAtothePCB-Section7PostSMTProcess:• Conformalcoatings• Underfills• Corneradhesives• Inspections• X-ray• Visual/Optical28AssemblyofBGAtothePCB-Section7ReworkandRepair• RemovalandReplacement• Flux• Paste• Hotairsystemandprofiles29ReliabilityandDefectAnalysis• Sections8discussedtheapplicationofthedeviceanditsreliabilityduringitsfunctionallife.• Thebasicthesisbeingthereliabilityofthesolderjointswhenexposedtotheoperationlife,thermalcyclingandvibrationcycling30ReliabilityandDefectAnalysisSection9,defectandfailureanalysis3132ThankYouQuestions?3233FurtherInformationForquestionsregardingthiswebinar,pleasecontactLeoLambertatleo@eptac.comorcallat800-643-7822ext215ForinformationonanyofEPTAC’sorIPC’sCertificationCourses,pleasevisitourwebsiteathttp://www.eptac.com33