附:156*156多晶硅片规格书材料特性Materialproperties特性Property规格Specification参考
标准
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ReferencedStandard生长方式CrystalGrowthMethodDSS导电型号/掺杂剂ConductivityType/DopantP/BoronASTMF42氧含量OxygenConcentration≤1.0×1018atoms/cm3ASTMF1188碳含量CarbonConcentration≤8.0×1017atoms/cm3ASTMF1391电学特性Electricalproperties电阻率Resistivity1~3Ω.cmASTMF43,ASTMF84少子寿命BlockLifetime≥2μsASTMF28几何尺寸Geometry宽度Width156±0.5mm方正度Rectangularangle90±0.3°对角线Diagonal219.2±0.5mm厚度Thickness200±20μmASTMF533TTV≤ASTMF533,F657线痕Sawmarks≤20μm崩边EdgeChip崩边深度≤0.3mm,长度≤0.5mm;最多2个/片Depth≤0.3mm,Length≤0.5mm,lessthantwochips缺口Breakage无Notallowed翘曲度Warpage≤50μmASTMF657微晶Micrograin单个微晶面积<3×3mm2;整个微晶区域面积<3×3cm2SingleMicrograinArea<3×3mm2.TotalMicrograinArea<3×3cm2隐裂Microcrack无Notallowed孔洞Hole无Notallowed表面质量Surfacequality表面无损伤,无污点、无水渍、无污渍Nosurfacedamage,stains,watermarks,orcontaminationallowed包装和标识Package&Labels包装PackageGCL标准包装,100片/包,300片/盒,碎片率≤0.3%GCLstandardpackage,100pcs/batch,300pcs/box,breakagerate≤0.3%标识Labels订单号、批号、硅片数量、规格尺寸等SalesorderNo.,LotNo.,WaferQuantity,Sizeetc.