TDA1521中文资料

DATA SHEET Product specification File under Integrated Circuits, IC01 July 1994 INTEGRATED CIRCUITS TDA1521 TDA1521Q 2 x 12 W hi-fi audio power amplifier 元器件交易网www.cecb2b.com July 1994 2 Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifier TDA1521TDA1521Q GENERAL DESCRIPTION The TDA1521/TDA1521Q is a dual hi-fi audio power amplifier encapsulated in a 9-lead plastic power package. The device is especially designed for mains fed applications (e.g. stereo tv sound and stereo radio). Features • Requires very few external components • Input muted during power-on and off (no switch-on or switch-off clicks) • Low offset voltage between output and ground • Excellent gain balance between channels • Hi-fi according to IEC 268 and DIN 45500 • Short-circuit-proof • Thermally protected QUICK REFERENCE DATA PACKAGE OUTLINES TDA1521: 9 leads in-line; plastic power (SOT131); SOT131-1; 1996 August 20. TDA1521Q: 9 leads SIL-bent-to-DIL; plastic power (SOT157); SOT157-2; 1996 August 20. Stereo applications Supply voltage range VP ± 7,5 to ± 21,0 V Output power at THD = 0,5%, VP = ± 16 V PO typ. 12 W Voltage gain Gv typ. 30 dB Gain balance between channels ∆Gv typ. 0,2 dB Ripple rejection SVRR typ. 60 dB Channel separation α typ. 70 dB Noise output voltage Vno(rms) typ. 70 µV 元器件交易网www.cecb2b.com July 1994 3 Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifier TDA1521TDA1521Q Fig.1 Block diagram. PINNING 1 −INV1 non-inverting input 1 2 INV1 inverting input 1 3 GND ground (symmetrical) 1⁄2 VP (asymmetrical) 4 OUT1 output 1 5 −VP negative supply (symmetrical) ground (asymmetrical) 6 OUT2 output 2 7 +VP positive supply 8 INV2 inverting input 2 9 −INV2 non-inverting input 2 元器件交易网www.cecb2b.com July 1994 4 Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifier TDA1521TDA1521Q FUNCTIONAL DESCRIPTION This hi-fi stereo power amplifier is designed for mains fed applications. The circuit is designed for both symmetrical and asymmetrical power supply systems. An output power of 2 × 12 watts (THD = 0,5%) can be delivered into an 8 Ω load with a symmetrical power supply of ± 16 V. The gain is fixed internally at 30 dB. Internal gain fixing gives low gain spread and very good balance between the amplifiers (0,2 dB). A special feature of this device is a mute circuit which suppresses unwanted input signals during switching on and off. Referring to Fig.13, the 100 µF capacitor creates a time delay when the voltage at pin 3 is lower than an internally fixed reference voltage. During the delay the amplifiers remain in their DC operating mode but are isolated from the non-inverting inputs on pins 1 and 9. Two thermal protection circuits are provided, one monitors the average junction temperature and the other the instantaneous temperature of the power transistors. Both protection circuits activate at 150 °C allowing safe operation to a maximum junction temperature of 150°C without added distortion. RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Note For asymmetrical power supplies (at short circuiting of the load) the maximum supply voltage is limited to VP = 28 V. If the total internal resistance of the supply (Ri) > 4 Ω, the maximum unloaded supply voltage is increased to 32 V. PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT Supply voltage pin 7 VP = V7-3 − +21 V pin 5 −VP = V5-3 − −21 V Non-repetitive peak output current pins 4 and 6 IOSM − 4 A Total power dissipation see Fig.2 Ptot Storage temperature range Tstg −55 +150 °C Junction temperature Tj − 150 °C Short-circuit time: see note outputs short-circuited to ground symmetrical (full signal drive) power supply tsc − 1 hour asymmetrical power supply; VP < 32 V (unloaded); Ri ≥ 4 Ω tsc − 1 hour 元器件交易网www.cecb2b.com July 1994 5 Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifier TDA1521TDA1521Q Fig.2 Power derating curve. THERMAL RESISTANCE HEATSINK DESIGN EXAMPLE With derating of 2,5 K/W, the value of heatsink thermal resistance is calculated as follows: given RL = 8 Ω and VP = ±16 V, the measured maximum dissipation is 14,6 W; then, for a maximum ambient temperature of 65 °C, the required thermal resistance of the heatsink is Note: The internal metal block (heatsink) has the same potential as pin 5 (−VP). From junction to case Rth j-c = 2,5 K/W Rth h a– 150 65– 14 6,---------------------- 2 5 3 3 K W⁄,=,–= 元器件交易网www.cecb2b.com July 1994 6 Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifier TDA1521TDA1521Q CHARACTERISTICS PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply voltage range operating mode VP ± 7,5 ± 16,0 ± 21,0 V input mute mode VP ± 2,0 − ± 5,8 V Repetitive peak output current IORM 2,2 − − A Operating mode: symmetrical power supply; test circuit as per Fig.12; VP = ± 16 V; RL = 8 Ω; Tamb = 25 °C; f = 1 kHz Total quiescent current without RL Itot 18 40 70 mA Output power THD = 0,5% PO 10 12 − W THD = 10% PO 12 15 − W Total harmonic distortion PO = 6 W THD − 0,15 0,2 % Power bandwidth THD = 0,5% note 1 B 20 to 20k Hz Voltage gain GV 29 30 31 dB Gain balance ∆GV − 0,2 1,0 dB Noise output voltage (r.m.s, value); unweighted (20 Hz to 20 kHz) RS = 2 kΩ Vno(rms) − 70 140 µV Input impedance |Zi 14 20 26 kΩ Ripple rejection note 2 SVRR 40 60 − dB Channel separation RS = 0 Ω α 46 70 − dB Input bias current Iib − 0,3 − µA DC output offset with respect voltage to ground VOFF − 30 200 mV Input mute mode: symmetrical power supply; test circuit as per Fig.12; VP = ± 4V; RL = 8 Ω; Tamb = 25 °C; f = 1 kHz Total quiescent current without RL Itot 9 30 40 mA Output voltage Vi = 600 mV Vout − 0,6 1,8 mV Noise output voltage (r.m.s. value); unweighted (20 Hz to 20 kHz) RS = 2 kΩ Vno(rms) − 70 140 µV Ripple rejection note 2 SVRR 35 55 − dB DC output offset with respect voltage to ground VOFF − 40 200 mV 元器件交易网www.cecb2b.com July 1994 7 Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifier TDA1521TDA1521Q Notes 1. Power bandwidth at Po max −3 dB. 2. Ripple rejection at RS = 0 Ω, f = 100 Hz to 20 kHz; ripple voltage = 200 mV (r.m.s. value) applied to positive or negative supply rail. Operating mode: asymmetrical power supply; test circuit as per Fig.13; VS = 24 V; RL = 8 Ω; Tamb = 25 °C; f = 1 kHz Total quiescent current Itot 18 40 70 mA Output power THD = 0,5% Po 5 6 − W THD = 10% Po 6,5 8 − W Total harmonic distortion PO = 4 W THD − 0,13 0,2 % Power bandwidth THD = 0,5% 40 to note 1 B 20k Hz Voltage gain GV 29 30 31 dB Gain balance ∆GV − 0,2 1 dB Noise output voltage (r.m.s. value); unweighted (20 Hz to 20 kHz) RS = 2 kΩ Vno(rms) − 70 140 µV Input impedance Zi 14 20 26 kΩ Ripple rejection SVRR 35 44 − dB Channel separation RS = 0 Ω α − 45 − dB PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT 元器件交易网www.cecb2b.com July 1994 8 Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifier TDA1521TDA1521Q APPLICATION INFORMATION Input mute circuit The input mute circuit operates only during switching on and off of the supply voltage. The circuit compares the 1/2 supply voltage (at pin 3) with an internally fixed reference voltage (Vref), derived directly from the supply voltage. When the voltage at pin 3 is lower than Vref the non-inverting inputs (pins 1 and 9) are disconnected from the amplifier. The voltage at pin 3 is determined by an internal voltage divider and the external 100 µF capacitor. During switching on, a time delay is created between the reference voltage and the voltage at pin 3, during which the input terminal is disconnected, (as illustrated in Fig.3). Fig.3 Input mute circuit; time delay. 元器件交易网www.cecb2b.com July 1994 9 Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifier TDA1521TDA1521Q Fig.4 Output power as a function of supply voltage; symmetrical supply; RL = 8 Ω; f = 1 kHz. Fig.5 Distortion as a function of frequency; symmetrical supply; VP = ± 16 V; RL = 8 Ω; Po = 6 W. Fig.6 Supply voltage ripple rejection; symmetrical supply; VP = ± 16 V; VRR = 200 mV. Fig.7 Power dissipation as a function of output power; symmetrical supply; VP = ± 16 V; RL = 8 Ω; f = 1 kHz. 元器件交易网www.cecb2b.com July 1994 10 Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifier TDA1521TDA1521Q Fig.8 Output power as a function of supply voltage; asymmetrical supply; RL = 8 Ω; f = 1 kHz. Fig.9 Distortion as a function of frequency; asymmetrical supply; VS = 24 V; RL = 8 Ω; Po = 4 W. Fig.10 Supply voltage ripple rejection; asymmetrical supply; VS = 24 V; VRR = 200 mV. Fig.11 Output power as a function of supply voltage; asymmetrical supply; RL = 4 Ω; f = 1 kHz. 元器件交易网www.cecb2b.com July 1994 11 Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifier TDA1521TDA1521Q Fig.12 Test and application circuit; symmetrical power supply. (1) To be connected as close as possible to the IC Fig.13 Test and application circuit; asymmetrical power supply. (1) To be connected as close as possible to the IC 元器件交易网www.cecb2b.com July 1994 12 Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifier TDA1521TDA1521Q PACKAGE OUTLINES UNIT A bmax. bp2 c D (1) E(1) Z (1)d eDh Lj REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 4.64.2 1.1 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 2.54 12.2 11.8 3.4 3.1 A max. 1 2.0 Eh 6 2.001.45 2.1 1.8 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 17.2 16.5 SOT131-2 92-11-1795-03-11 0 5 10 mm scale Q 0.25 w 0.03 x D L A E c A2 Qw M bp d D Z e x h 1 9 Eh non-concave se a tin g pl an e 1 b j SIL9P: plastic single in-line power package; 9 leads SOT131-2 view B: mounting base side B 元器件交易网www.cecb2b.com July 1994 13 Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifier TDA1521TDA1521Q UNIT A A e 12 bp c D(1) E(1) Z(1)d eDh L L3 m REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 17.015.5 4.6 4.2 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 5.08 12.2 11.8 2.54 e 2 5.08 2.41.6 Eh 6 2.001.450.8 3.4 3.1 4.3 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 12.4 11.0 SOT157-2 0 5 10 mm scale v 2.1 1.8 Qj 0.25 w 0.03 x D L E A c A2 L3 Q w M bp 1 d D Z e e x h 1 9 j Eh non-concave 92-10-12 95-03-11 DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm) SOT157-2 B view B: mounting base side m 2e v M 元器件交易网www.cecb2b.com July 1994 14 Philips Semiconductors Product specification 2 x 12 W hi-fi audio power amplifier TDA1521TDA1521Q SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. DEFINITIONS LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 元器件交易网www.cecb2b.com