中國銀聯智能SD卡座規範

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D e s c rip tio n P in A s s ig nm e nt Reel Carton A 1000 8000 Packing Quality 6 Carton Paper 5 Connector Other 4 Label Paper 3 Reel PS 2 Carrier Tape PS 1 Cover Tape PE Numbers Name Material Rev.A Sheet Of 81 GCONN Connector (Shenzhen) Co., Ltd. PRODUCT SPECIFICATION Title : Micro-SD Memory Card Connector. H = 1.5mm Normal Push Type Part Number : MSPT10-A0-4000 Spec. No. : P-MSPT10 Revision : A Revisions Control` Rev. ECN Number Originator Approval Issue Date A Initial Release KEN 2008/09/01 Product Specification Origination Originator: Checked By: Approved By: PRODUCT SPECIFICATION P-MSPT10 Rev.A Sheet Of 82 Micro-SD Memory Card Connector. (H = 1.5 mm Normal Push Type) 1. SCOPE This specification defines the detailed requirements for the Micro-SD Memory Card Connector. (H = 1.5 mm Normal Push Type) 2. APPLICABLE DOCUMENTS The following documents form a part of this specification to the extent specified herein. In the event of conflict between the requirements of this specification and the product drawing, the product drawing shall take precedence. In the event of conflict between the requirements of this specification and the referenced documents, this specification shall take precedence. 2.1 COMMERCIAL STANDARDS AND SPECIFICATION: IEC-512 Test methods for electrical connectors. MIL-STD-202/1344 Test methods for electrical connectors. EIA 364-09 Test methods for electrical connectors. 3. REQUIREMENTS 3.1 DESIGN AND CONSTRUCTION Product shall be of the design, construction and physical dimensions specified on the applicable product drawing. 3.2 MATERIALS A .Housing & Slide & Holder: High temperature thermoplastic, UL94V-0 Housing Color : Black烊Slide Color :Ivory烊Holder Color : Black B .Terminal & CD Pin烉Copper Alloy. Finish : (a) Contact Area : Gold plated over Nickel (b) Solder Tail : Tin plated over Nickel (c) Under plated : 50ȝ˷Nickel plated over all C. Lock Pin & Spring & Hook : Stainless D .Cover: Stainless Finish : (a) Solder Tail : Gold plated over Nickel (b) Under plated : 50ȫ˷Nickel plated over all 3.3 RATINGS Operating Current Rating : 0.5A Voltage Rating : 5 V Operating Temperature : -40ɗ to 85ɗ Storage Temperature : -40ɗ to 85ɗ Humidity : 95% max. (non condensing) PRODUCT SPECIFICATION P-MSPT10 Rev.A Sheet Of 83 3.4 TEST REQUIREMENTS AND PROCEDURES SUMMARY TEST DESCRIPTION REQUIREMENT PROCEDURED Examination of Product Meets requirements of product Drawing. Visual inspection No physical damage ELECTRICAL Contact resistance Contact Resistance shall not exceed. Initial:100mȍ Max. After Test :100mȍ Max. between adjacent contact to contact. IEC 512-2-2a, Open voltage 20mV,Test current 100mA Insulation resistance Initial: 1000Mȍ Min. After Test : 100Mȍ Min. between adjacent contact to contact. IEC 512-2-3a, Measure within 1 minute after applying 500VDC. Dielectric Withstanding Voltage resistance 500VACrms between adjacent contact to contact. IEC 512-2-4a, (a) No shorting or other damages when 500Vrms AC is applied for 1 minute. (b) Current leakage 1mA maximum. MECHANICAL Insertion/Extraction force Insertion Force : 30N Max. Extraction Force : 1.0N Min.~30N Max. Lock Extraction Force : 1N Min. Insertion and Extraction at speed of 25 mm/minute. Except influence of the force for eject and module lock mechanism. Static mechanism strength for card correct insertion (1) No mechanical damage will occur on the part . (2) Be parallel to card insertion direction. (1)Force to push the mating card for 20 seconds. (2) Warranty strength:2Kg force. Static mechanism strength for card reversed insertion (1) No mechanical damage will occur on the part. (2) Be parallel to card insertion direction. (1)Force to push card by reversed insertion for 20 seconds. (2) Warranty strength:2Kg force. Durability for card reversed insertion (1) No mechanical damage will occur on the part. (2) Warranty cycles:40 cycles. (1)One cycle as defined to parallel to card insertion direction,to push card to the end. (2)Reversed insertion of 1Kg force , and then remove card. Operating / Non-Operation Random vibration (1) No mechanical damage will occur on parts. (2) Criteria: Duringtest,signal discontinuity is never more than 1ȝsec. Sample quantity烉4+4pcs 1.Oprating烉 3 axes,30 minutes per axes,1.67Grms Frequency (Hz) A.S.D.(GƳ/Hz) 10~200 0.01 200~500 0.003 Mated connectors shall be subjected during test. Sample quantity烉4 pcs PRODUCT SPECIFICATION P-MSPT10 Rev.A Sheet Of 84 No mechanical damage will occur on parts. 2.Non-operating烉 3 axes,10 minutes per axes,6.06Grms Frequency (Hz) A.S.D.(GƳ/Hz) 20 0.0098 80 0.04 350 0.04 2000 0.0069 Sample quantity烉4 pcs Operating sine vibration (1) No mechanical damage will occur on parts. (2)Criteria:Duringtest,signal discontinuity is never more than 1ȝsec. Sweep reate:0.5 octave/minute 3 axe,3 sweeps per axis Frequency (Hz) amplitude 5~9 6.6mm(p-p) 9~200 1.0G 200~500 1.5G Mated connectors shall be subjected during test. (1) No mechanical damage will occur on parts. (2)Criteria:Duringtest,signal discontinuity is never more than 1ȝsec. Sample quantity烉10+10pcs 1.Oprating烉 (1)mate a card (2)half-sine wave shock (3)acceleration烉50G (4)duration time烉11ms (5)3 shocks per axis,total 18 shocks (6) Sample quantity烉10 pcs Operating / Non-Operation Shock resistance No mechanical damage will occur on parts. 2.Non-operating烉 (1)half-sine wave shock (2)acceleration烉500G (3)duration time烉2ms (4)3 shocks per axis,total 18 shocks (5) Sample quantity烉10 pcs Insertion/Extraction durability (1) No physical damage. (2) Insertion/Extraction 10,000 Cycles. (3) Check point:1000 cycles (4) 5 pcs by automation and 5 pcs by manpower . EIA 364-09. Mate and unmated connectors for 500Ʋ50 cycles per hour. One cycle as defined to insert card into the socked,and then push to release latch to extract card Right Oblique Insertion Resistance No mechanical damage will occur on parts (1)Insert the Max./Min. size card along right deflection,then push to remove card,10pcs for each size. (2)20 times for each sample Left Oblique Insertion Resistance No mechanical damage will occur on parts (1)Insert the Max./Min. size card along left deflection,then push to remove card,10pcs for each size. (2)20 times for each sample PRODUCT SPECIFICATION P-MSPT10 Rev.A Sheet Of 85 Right Oblique Insertion Resistance (1) No mechanical damage will occur on the part . (2) Sample quantity烉10+10pcs 1. Insert the maximum size card along right deflection (tilt 20°) as figure, then push to remove card. Perform this action for 100 time for each sample. Totally for 10 samples. 2. Also perform action as above for minimum size card and totally for 10 samples. Left Oblique Insertion Resistance (1) No mechanical damage will occur on the part . (2) Sample quantity烉10+10pcs 1. Insert the maximum size card along right deflection (tilt 20°) as figure, then push to remove card. Perform this action for 100 time for each sample. Totally for 10 samples. 2. Also perform action as above for minimum size card and totally for 10 samples. Static Mechanism Strength for Card Life Oblique Reversed Insertion (1) No mechanical damage will occur on the part . (2) Sample quantity烉4 pcs 1. Be left oblique to card insertion direction, force to push the maximum size card for 20 seconds. 2. Warranty strength : 2 kg force. Static Mechanism Strength for Card Right Oblique Reversed Insertion (1) No mechanical damage will occur on the part . (2) Sample quantity烉4 pcs 1. Be right oblique to card insertion direction, force to push the maximum size card for 20 seconds. 2. Warranty strength : 2 kg force. ENVIRONMENTAL Operating / Non-Operation thermal shock (1)No physical damage. (2)Contact resistance \ Insulation Resistance shall not exceed Final value.(mate a card) Sample quantity烉10+10pcs Test condition:-40ć/30 minutes to +85ć 30 minutes. Warranty Cycle:32cycles (1cycle=1hour) Humidity-Temperature cycling (1)No physical damage . (2)Contact Resistance\Insulation Resistance shall not exceed Final Value. IEC 512-6-11m With all kind of cards mated connectors to 10 Cycles (240 hours) between -10ć and 65ć at 80~98% relative humidity(1 cycle/day). Operating / Non-Operation heat resistance (1)No physical damage . (2)Contact Resistance\Insulation Resistance shall not exceed Finel Value. Sample quantity烉4+4pcs Mated connectors shall be subjected during test. Temperature:85ć Duration:240 hours Operating / Non-Operation cold resistance (1)No physical damage . (2)Contact Resistance\Insulation Resistance shall not exceed Final Value. Sample quantity烉4+4pcs Mated connectors shall be subjected during test. Temperature:-40ć Duration:240 hours Operating / Non-Operation Temperatureand Humidity Contact resistance \ Insulation Resistance shall not exceed Final value. Sample quantity烉4+4pcs Mate connectors shall be subjected during test. Steady State 70+/-2ć, 95% RH 240 hours. PRODUCT SPECIFICATION P-MSPT10 Rev.A Sheet Of 86 Salt spray No harmful corrosion MIL-STD-202F, method101D Temperature:35 ±2ć ć Concentration: 5% Period:48 hours. H2S Corrosion Resistance No harmful corrosion Temperature:40 ±2ć ć Gas concentration烉3±1ppm. Humidity烉75%RH to 80%RH Duration times烉24 hours PHYSICAL Solderability Solder Tail shall be covered more than 95% of immersed area with flash solder. MIL-STD-202F, method 208 Solder temperature : 245 ±5ć ć Period : 5±0.5sec. MIL-STD-202F,method 208 Resistance to Reflow Soldering Heat No physical damage shall occur. Pre Heat烉160~190 , ć 60~120sec. Reflow time: above 220 Min,30~90sec. Peak Temp.烉250+0/-5 , ć 5~10sec. Duration烉2 cycles(see figure3) Figure 1 PRODUCT SPECIFICATION P-MSPT10 Rev.A Sheet Of 87 3.5 PRODUCT QUALIFICATION AND REQUALIFICATION TEST SEQUENCE Test or Examination Test Group Test Sequence (a) A B C D E F G H I J K L M N O P Q R S T Resistance to Reflow Soldering Heat 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Examination of Product 2 2,6 2,6 2,6 2,6 2,6 2,6 2,8 2,8 2,10 2,6 2,6 2,10 2,6 1,3 2,6 2,6 2,6 2,6 2,6 Contact Resistance 3,5 3,5 3,5 3,5 3,5 3,5 3,7 3,7 3,9 3,5 3,5 3,9 3,5 3,5 3,5 3,5 3,5 3,5 Insulation Resistance 4,6 4,8 4,8 Dielectric Withstanding Voltage Resistance 5,7 5,7 Insertion and pulling force 3 4,6 Static mechanism strength for card correct insertion 4 Static mechanism strength for card reversed insertion 4 Durability for card reversed insertion 4 Operating / Non-Operation Random vibration 4 Operating sine vibration 4 Operating / Non-Operation Shock resistance 4 Insertion/Extraction durability 5 Operating / Non-Operation thermal shock 5 Humidity-Temperature cycling 6 Operating / Non-Operation heat resistance 4 Operating / Non-Operation cold resistance 4 Operating / Non-Operation Temperatureand Humidity 6 Salt spray 4 Solderability 2 H2S Corrosion Resistance 4 Right Oblique Insertion Resistance 4 Left Oblique Insertion Resistance 4 Static Mechanism Strength for Card Life Oblique Reversed Insertion 4 Static Mechanism Strength for Card Right Oblique Reversed Insertion 4 Sample Quantity(pcs) 4 4 4 10 8 4 20 10 20 4 8 8 8 4 4 4 20 20 4 4 Figure 2 NOTE:(a) The numbers indicate sequence in which tests were performed . (b) The test samples were randomly selected from normal current production lots . (c) The test Group “O” doesn’t have to be test in IR reflow . 3.5 RECOMMENDED IR REFLOW CONDITION PRODUCT SPECIFICATION P-MSPT10 Rev.A Sheet Of 88 Figure 3 .Temperature Condition graph (Lead free) Rev. A Sheet Of 101 GCONN Connector (Shenzhen) Co., Ltd. TEST REPORT Title : Micro-SD Memory Card Connector H=1.5mm Normal Push Type Part Number : MSPT10-A0-4000 Spec. No. : T-MSPT10 Revision : A Revisions Control Rev. ECN Number Originator Approval Issue Date A Initial Release KEN 2008/11/10 Test Report Origination Originator: Checked By: Approved By: TEST REPORT T-MSPT10 Rev.A Sheet Of 10 2 Micro SD Memory Card Connector (H=1.5mm Normal Push Type) 1. INTRODUCTION 1.1. Purpose The primary purpose of the test was performed on the Micro-SD Memory Card Connector (H=1.5mm Normal Push Type)to determine its conformance to the requirements of project specification. 1.2. Scope This report includes the electrical, mechanical, and environmental performance of Micro-SD Memory Card Connector (H=1.5mm Normal Push Type). 1.3. Conclusion Micro-SD Memory Card Connector (H=1.5mm Normal Push Type) meets the electrical, mechanical, and environmental performance requirements of product specification. 1.4. Product Description The Micro-SD Memory Card Connector (H=1.5mm Normal Push Type)applied at printed circuit board. The contacts are made from copper alloy with gold plating on the contact interface and Tin only plating on the soldertail , Nickel under plating over all. The housing material is UL94V-0 High Temperature Thermoplastic insulating polymer. 1.5. Test Samples The test sample following Project Specification sequence in which tests were performed. Test Group Quantity Part Number Description A,B,C,D,E,F,G,H,I,J,K,L,M,N ,O follow Spec MSPT10-A0-4000 Micro-SD Memory Card Connector P,Q,R,S,T,U,V (H=1.5mm Normal Push Type) DR DATE APVD DATE TEST REPORT T-MSPT10 Rev.A Sheet Of 10 3 1.6. Qualification Test Sequence Test Group A B C D E F G H I J K L M N O P Q R S T U VTest or Examination Test Sequence(a) Resistance to Reflow Physical Surface Heat 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Examination of Product 2 2,6 2,6 2,6 2,6 2,6 2,6 2,8 2,8 2,10 2,6 2,6 2,10 2,6 1,3 2,8 2,8 2,6 2,6 2,6 2,6 2,6 Contact Resistance 3,5 3,5 3,5 3,5 3,5 3,5 3,7 3,7 3,9 3,5 3,5 3,9 3,5 3,7 3,7 3,5 3,5 3,5 3,5 3,5 Insulation Resistance 4,6 4,8 4,8 DWV 5,7 5,7 Extraction and Insertion Force 3 4,6 4,6 4,6 Static mechanism strength for card Correct insertion 4 Static mechanism strength for card Reversed insertion 4 Durability for card reversed insertion 4 Operating Random Vibration 4 Operating Sine Vibration 4 Operating Shock Resistance 4 Insertion/Extraction Durability Cycle 5 Operation Thermal Shock 5 Humidity-Temperature cycling 6 Operating heat resistance 4 Operating cold resistance 4 Humidity 6 Salt Spray 4 Solderability