工程部专用术语-英文

工程 路基工程安全技术交底工程项目施工成本控制工程量增项单年度零星工程技术标正投影法基本原理 術語專用表訂單內容PartNo.零件編號Generalinformation普遍信息Questions問題Contact聯絡Technical技術性的TEL:電話Orderinformation訂單信息Revisionlevel修訂版本Vendor賣方,供方Typeoforder訂單類型Vendorstatus賣方情況Quantity數量Priceeach單價Present介紹、表示Filename文件名/檔案名出貨要求Deliveryinformation交貨資料Attachwithdelivery出貨附加E-testreport電測報告Microseetionreport微切片報告Finalinspectionreport出貨檢驗報告Otherrequirement其它要求Impedancetestreport阻抗測試報告Cross-section切片Soldersample焊錫樣板Inoictesting離子污染度測試板材Layercount層數Laminatetype板材類型Basecopperfoil基材銅厚Layupsetup壓合疊構設計Dielectricsspecified介質層規格Combination粘結物(PP)Core板芯Polttetrafluoroethylene(PTFE)鐵氟龍Glasstransitiontemperature(Tg)玻璃態轉換溫度TgratingTg點等級Coppercladepoxyglasslaminate玻璃樹脂覆銅板Layup疊合Geltime凝膠時間Staggerdots(板邊)阻流塊Tg:(glasstransitiontemperature玻璃轉化溫度點Td:(Timperaturedecomposition)板材固化溫度點Material(FR-4,CEM-1,CEM-3,FR-1)板材Halogenfreematerials無鹵素板材Dielectriclayer介質層Insulator介質層、絕緣層Lengthwisedimension徑向板材Crosswisedimension緯向Thincore薄基板Toflon鐵氟龍Prepreg膠片,樹脂片Copperfoil銅箔/銅皮Laminate基板,積層板鑽孔電鍍Plating電鍍Countersinks錐形孔Platedthronghholecopperthickness孔壁銅厚Sencondarydrill二次鑽孔Drillchart鑽孔表/分孔圖Fabricationdrawing制造圖Holecount孔數Smallestholesize最小孔徑Drillfile鑽孔文件/鑽孔檔Holelocations孔位置Counterboad沉頭孔Countersink錐形孔Hole孔Drilling鑽孔Componenthole零件孔Slot/Slotting槽口,開槽Indexinghole基率孔/參考孔內、外層制作Outerlayer外層Innerlayer內層Top-only頂層C/(Companeitside)Bottom-only底層S/(Solderside)Netlisttestingrequired網絡測試要求Inpedancecontrol阻抗控制OHM(電阻單位)ΩMinimumlinewidth最小線寬Minimumspacing最小間距Topcircuit頂層線路Conductorwidth導線寬度Differentialresistart差動(阻抗)Surroundbyland環繞接地Signal信號Plane平面、大地Mintrace最小線寬Surface表面Thieving電鍍干擾塊Singelend單端Etch蝕銅Copperborder板邊設計Tent蓋孔Fiducialuark光學點內、外層制作Time-domainrefelectometry(TDR)時域反射器(測阻抗用)Signalline訊號線Referanceplane參考層Groundplane接地層Tab接點,金手指Non-Circularland非圓形孔環焊墊Leadpitch腳距Lagout布線,布局Fineline細線Transmissionline傳輸線Pitch跨距,腳距,墊(線)距Finepitch密(腳,線,墊)距Film底片防焊文字Soldermask阻焊Plugged(filled)soldermaskinviahole導通孔塞孔Viaholetreatment導通孔處理Legend文字Doubleside雙面Color顏色Green綠色Red紅色Blue藍色Black黑色White白色Matte霧面Light亮面Gloss半光面Dryfilmgloss干膜綠漆Onsoldside在焊接面Oncompside在零件面Plugviaholes導通孔塞孔Soldermasksides防焊層Soldermaskcolor防焊顏色Soldermasktype防焊類型WKYR(WWYY)週週年年WKYR(YYWW)年年週週W(Week)周Silkscreen絲網印刷(文字)Vendorlogoandul賣方(制造商)logo和UL標識Photimageable液態感光油Solderresist焊錫保護層(阻焊)Y(Year)年Month月Datecode周期Date日期Tapetest撕膠帶試驗表面處理Surfacefinish成品表面處理Hasl熱風整平/(噴錫)Flashgold水金/(全面金)Immersiongold沉金/(化金)OSP抗氧化Immersiontin沉錫/(化錫)Immersionsilver沉銀/(化銀)Hasl＆goldfinger(噴錫)/熱風整平+鍍金手指Smobcwithhasl噴錫板Carbon碳油Peelablemask可剝膠ToppasteC面錫膏Solderpaste錫膏Hotairsolderlevelled噴錫Leadfree無鉛噴錫Silverpaste銀膏成型外觀Overallboardthickness總的板厚度Measureafterplatingandsoldermask電鍍、阻焊後測量Finishthickness成品板厚Bevelangle斜邊角度Goldfingerbevel金手指斜邊Beveldepth斜邊深度Boardorunitsize大板或單PCS尺寸Arraysize(排版)連片尺寸Scoringangle切割角度FinishedWebThickness殘厚FinishType成品類型Outline外形BreakAway折斷邊Tolerance公差BoardSize板的尺寸DimensionalTolerance尺寸公差Rectangle矩形FabricablePCB成型的PCBProbe探針OpticalInspection光學檢驗VisualInspection目視檢查Flatness平坦度Insulation絕緣電阻Hipottest高壓電測Yield良品率,產率Short短路Punch沖切Omegameter離子污染檢測儀Contactresistance接觸電阻其它項Measure測量其它項Format(周期)格式AsOriginalGeberFile同原始GEBER文件一樣None無Mark標記、標識DateCode日期Detail詳解,放大圖TestStamp測試印章(ET章)SeeSpecNote看規范要求AcceptanceSpecification接收標准Thedrawingtakesprecedent圖紙依前例Reference提及、關於Connection聯結Between兩者之間Data數據Where哪裡May可以Use使用Any一些WithIn在…以內Or或者Modify修改Meet達到Requirements要求Prior預先,提前Notify注意事項Approval批准Fabrication制造、裝配Generalspecification一般規格Notmorethan不超過Rating等級Flammability易燃能力Metal金屬L.P.IBoarddimension板子長、寬、高(體積)Liston列在…上Accordance按照Locatedwithin設計在…以內Monday星期一Tuesday星期二Wednesday星期三Thursday星期四Friday星期五Saturday星期六Sunday星期日BOW板彎TWIST板翹其它項Reflow熔焊DirtyForeignMaterials異物、雜質Data數據AssembledInUsa美國裝配Mulitilayer多層板SolderFloating漂錫試驗VCC(Voctage)電壓Phototool底片Packaging封裝Matherboard主機板Deviation偏差Template模板Silkscreen絲網印刷Nickelgoldimmersion化鎳金