tda2822音频功率放大电路

TDA2822 March 1995 DUAL POWER AMPLIFIER .SUPPLY VOLTAGE DOWN TO 3 V .LOW CROSSOVER DISTORSION .LOW QUIESCENT CURRENT .BRIDGE OR STEREO CONFIGURATION DESCRIPTION The TDA2822 is a monolithic integrated circuit in 12+2+2 powerdip, intended for use as dual audio power amplifier in portable radios and TS sets. POWERDIP (Plastic 12+2+2) ORDERING NUMBER : TDA2822 TYPICAL APPLICATION CIRCUIT (STEREO) 1/11 SCHEMATIC DIAGRAM ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit Vs Supply Voltage 15 V Io Output Peak Current 1.5 A Ptot Total Power Dissipation at Tamb = 50 °C at Tcase = 70 °C 1.25 4 W W Tstg, Tj Storage and Junction Temperature – 40 to 150 °C PIN CONNECTION (top view) TDA2822 2/11 THERMAL DATA Symbol Parameter Value Unit Rth j-amb Rth j-case Thermal Resistance Junction-ambient Thermal Resistance Junction-pins Max Max 80 20 °C/W °C/W ELECTRICAL CHARACTERISTICS (Vs = 6 V, Tamb = 25 °C, unless otherwise specified) STEREO (test circuit of fig. 1) Symbol Parameter Test Condition Min. Typ. Max. Unit Vs Supply Voltage 3 15 V Vc Quiescent Output Voltage Vs = 9 V Vs = 6 V 4 2.7 V V Id Quiescent Drain Current 6 12 mA Ib Input Bias Current 100 nA Po Output Power (each channel) d = 10 % f = 1 kHz Vs = 9 V RL = 4 Ω Vs = 6 V RL = 4 Ω Vs = 4.5 V RL = 4 Ω 1.3 0.45 1.7 0.65 0.32 W W W Gv Closed Loop Voltage Gain f = 1 kHz 36 39 41 dB Ri Input Resistance f = 1 kHz 100 kΩ eN Total Input Noise Rs = 10 kΩ B = 22 Hz to 22 kHz Curve A 2.5 2 µV µV SVR Supply Voltage Rejection f = 100 Hz 24 30 dB CS Channel Separation Rg = 10 kΩ f = 1 kHz 50 dB BRIDGE (test circuit of fig. 2) Vs Supply Voltage 3 15 V Id Quiescent Drain Current RL = ∞ 6 12 mA Vos Output Offset Voltage RL = 8 Ω 10 60 mV Ib Input Bias Current 100 nA Po Output Power d = 10 % f = 1 kHz Vs = 9 V RL = 8 Ω Vs = 6 V RL = 8 Ω Vs = 4.5 V RL = 4 Ω 2.7 0.9 3.2 1.35 1 W W W d Distortion (f = 1 kHz) RL = 8 Ω Po = 0.5 W 0.2 % Gv Closed Loop Voltage Gain f = 1 kHz 39 dB Ri Input Resistance f = 1 kHz 100 kΩ eN Total Input Noise Rs = 10 kΩ B = 22 Hz to 22 kHz Curve A 3 2.5 µV µV SVR Supply Voltage Rejection f = 100 Hz 40 dB TDA2822 3/11 Figure 1 : Test Circuit (stereo). Figure 2 : P.C. Board and Components Layout of the Circuit of Figure 1 (1:1 scale). TDA2822 4/11 Figure 3 : Test Circuit (bridge). Figure 4 : P.C. Board and Components Layout of the Circuit of Figure 3 (1:1 scale). TDA2822 5/11 Figure 5 : Output Power vs. Supply Voltage (Stereo). Figure 6 : Output Power vs. Supply Voltage (Bridge). Figure 7 : Distorsion vs. Output Power (Bridge). Figure 8 : Distorsion vs. Output Power (Bridge). Figure 9 : Supply Voltage Rejection vs. Frequency. Figure 10 : Quiescent Current vs. Supply Voltage. TDA2822 6/11 Figure 11 : Total Power Dissipation vs. Output Power (Stereo). Figure 12 : Total Power Dissipation vs. Output Power (Bridge). Figure 13 : Total Power Dissipation vs. Output Power (Bridge). TDA2822 7/11 Figure 14 : Application Circuit for Portable Radios. MOUNTING INSTRUCTION TheRth j-amb of the TDA2822 can be reducedby sol- dering the GND pins toa suitable copperarea of the printed circuit board (Figure 15) or to an external heatsink (Figure 16). The diagram of Figure 17 shows the maximum dis- sipable power Ptot and the Rth j-amb as a functionof theside ”∂” oftwoequalsquarecopperareashaving a thickness of 35 µ (1.4 mils). During soldering the pins temperature must not ex- ceed 260 °C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. Figure 15 : Example of P.C. Board Copper Area which is used as Heatsink. Figure 16 : External Heatsink Mounting Example. TDA2822 8/11 Figure 6 : Maximum Dissipable Power and Junction to Ambient Thermal Resistance vs. Side ”∂”. Figure 7 : Maximum Allowable Power Dissipation vs. Ambient Temperature. TDA2822 9/11 POWERDIP 16 PACKAGE MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. a1 0.51 0.020 B 0.85 1.40 0.033 0.055 b 0.50 0.020 b1 0.38 0.50 0.015 0.020 D 20.0 0.787 E 8.80 0.346 e 2.54 0.100 e3 17.78 0.700 F 7.10 0.280 I 5.10 0.201 L 3.30 0.130 Z 1.27 0.050 TDA2822 10/11 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifica- tions mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information pre- viously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics.  1995 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thaliand - United Kingdom - U.S.A. TDA2822 11/11