信赖性基本知识-讲师版 (2)

1-1.)Environmentinfluence環境對產品的影響:1.可靠度觀念篇1-2.)Reliabilityderive可靠度的起源:Nineteencentury十九世紀開始研究WorldwarII二次世界大戰Militarysystem軍事系統Aviationsystem航太系統Commercial商用1.可靠度觀念篇1-3.Marketdemandforreliability市場對可靠度需求:Notonlypredictdatabutalsotestdada要求証實資料而不是預估可靠度Standard標準的定訂?Betterandbetter科技不斷變化，可靠度要維持/更好Lowrecallrate回修率越低越好1.可靠度觀念篇1-4.)Challenge面臨挑戰:Tech.Changequickly技術快速變化Highreliabilityproduct高可靠度產品Utilizationwidely使用範圍廣Shortmarketlife產品市場壽命短Shorttimetomarket快速上市時間traditionaltestmethod傳統測試方法?newaccelerationtestmethod創新加速測試!1.可靠度觀念篇1-5.)Howtowin如何脫穎而出?:Highreliabilityassurance提出高可靠度的保證Reliabilitysystem公司可靠度制度Experience公司經驗Reliabilityplan產品可靠度計劃Reliabilitytestdata產品可靠度測試記錄TQM1.可靠度觀念篇1-6.)Traditionalandnew傳統與現代:Traditional傳統思考：reliabilityistheresponsibilityofRApersonnel可靠度是品保或可靠度工程人員的職責New現代思考：reliabilityisteam-workresult可靠度是Team-work的成果，公司其他成員如設計、製程、製造工程師，必須在其職責中，考慮如何提昇可靠度1.可靠度觀念篇1-7.)Reliabilityengineering可靠度工程:DesignforReliability(Design-in,Build-in)可靠度設計ReliabilityTestandDataAnalysis可靠度測試與資料分析FailureAnalysis失效分析1.可靠度觀念篇DesignforReliability可靠度設計:Reliabilitypredict可靠度預估FMEA(失效模式效果分析)FTA(失效樹分析)Margin預估DesignGuideline制定設計審核(DesignReview)1.可靠度觀念篇產品在規定的使用環境中，能於規定的期間內毫無故障的發揮其特定功能的機率(某信心水準下)Qualityovertime1-8.)Reliabilitydefinition可靠度的定義:1.可靠度觀念篇1-9.)Nounintroduction可靠度常用名詞:MTTF:meantimetofailure平均失效時間MTBF:meantimebetweenfailure平均失效間隔Burn-in:催熟(將earlyfailure產品去除)FIT:failureintime單位時間失效,10^91.可靠度觀念篇1.可靠度觀念篇2-1.)Purpose可靠度測試目的:2.可靠度測試與失效機制findoutpotentialfailuremechanism發現潛在的失效機制evaluatefailurerate評估產品的失效率makesurewearoutmechanismsdonotoperateinproductlifeperiod確保於老化階段之失效機制不會出現在產品正常的壽命階段2-2.)Environmentandreliabilitytest環境與可靠度測試:2.可靠度測試與失效機制ReliabilityLab.capabilitySPILConfidentialTestItemJEDECMILorotherMoisturesensitivity/PreconditionJ-STD-020,JESD22-A113~TemperaturecyclingJESD22-A104MIL-STD-883Method1010.7ThermalshockJESD22-A106MIL-STD-883Method1011.9PressureCookerJESD22-A102~HighTemperatureStorageJESD22-A103MIL-STD-883Method1008HighTemperatureoperatinglifeJESD22-A108~TemperatureandHumidityBiased/unbiasedJESD22-B101EIAJ-IC-121HASTBiased/unbiasedJESD22-A110,A118~SolderJoint~kkkkkIPC-9701BumpElectromigrationJESD63~SolderabilityJESD22-B102MIL-STD-883Method2003.7LeadfatigueJESD22-B105MIL-STD-883Method2004MarkpermanencyJESD22-B107MIL-STD-883Method2015.112-3.)濕敏感度測試(Moisturesensitivitytest/Precondition):Reference參考規範:J-STD-020,JEDC-22-A113Purpose目的:simulateSMTprocess模擬元件上板製程Failuremode常見電性失效:斷路(open),功能失效(functionalfail)Failuremechanism常見失效機制:脫層(Delamination),爆米花(Popcorn),晶片斷裂(diecrack),金球脫(balllifted),金線斷(2ndbondbroken)..等2.可靠度測試與失效機制2.可靠度測試與失效機制主機板(motherboard)黏著於主機板後(afterSMT)2-3.)濕敏感度測試(Moisturesensitivitytest/Precondition):爆米花(Popcorn)金線斷(2ndbondbroken)2.可靠度測試與失效機制2-3.)濕敏感度測試(Moisturesensitivitytest/Precondition):脫層(Delamination)2.可靠度測試與失效機制濕敏感度分類(J-STD-020Moisturesensitivitylevel):2.可靠度測試與失效機制2-3.)濕敏感度測試(Moisturesensitivitytest/Precondition):流程:(1) Electricaltesting電性測試 (2)  SATinspection超音波檢驗 (3)  Temperaturecycling,5cycles,-65~150C（option）溫度循環,5cycles--(選擇) (4)  Hightemperaturebake,24hours@125C高溫烘烤,24小時,125C (5)  Moisturesoak吸濕(level1:85C/85%R.H168h,level2:85C/60%R.H168h,level2A:60C/60%RH120h,level3:30C/60%R.H192h) (6)  SMTsimulation,3cyclesIRreflow225C/240C/250C上板模擬,流焊3次 (7)  Electricaltesting電性測試(8)SATinspection超音波檢驗 2.可靠度測試與失效機制2.可靠度測試與失效機制Delamination脫層PackageCrack膠體破裂DieCrack晶片破裂Void氣洞Tilt傾斜SAT可檢出不良:2.可靠度測試與失效機制超音波遇到脫層(空氣)時波的相位會反轉180度2.可靠度測試與失效機制DieCrack晶片破裂PKGCrack膠體破裂Throughscan脫層2.可靠度測試與失效機制SAT規格(SATcriteria,RA-0501):IR/ConvectionreflowOvenTemp.andhumiditychamber2.可靠度測試與失效機制有鉛流銲溫度曲線Sn/Pbreflowprofile2.可靠度測試與失效機制無鉛流銲溫度曲線Leadfreereflowprofile2-4.)高壓蒸煮試驗PressureCookerTest（PCT）:Reference參考規範:JESD22-A102Purpose目的:Todetectmoisturerelateddefect偵測與濕相關之不良Condition常用條件:121C/100%RH/2ATM,168HFailuremode常見電性失效:短路(short),漏電(leakage),斷路(open)Failuremechanism常見失效機制:金屬離子遷移(ironmigration/dendrite),脫層(Delamination),金屬層剝離(metalpeeling),腐蝕(corrosion)…等2-4.)高壓蒸煮試驗PressureCookerTest（PCT）:金屬離子遷移(ironmigration/dendrite)2.可靠度測試與失效機制2-4.)高壓蒸煮試驗PressureCookerTest（PCT）:金屬層剝離(metalpeeling)2.可靠度測試與失效機制TemperaturecyclingchamberCcondition:-65~150CBcondition:-55~125CGcondition:-40~125CThermalshockchamberDcondition:-65~150CCcondition:-55~125COthers2-5.)溫度循環試驗TemperatureCycleTest（TCT,airtoair）:Reference參考規範:MIL-STD-883EMethod1010.7,JESD22-A104Purpose目的:Todetectthedefectthatrelatedtopackagingstructure,material,process偵測與封裝結構,材料,製程相關之不良Condition常用條件:-65C~150C(C條件),-55~125C(B條件),1000CYCFailuremode常見電性失效:斷路(open),功能失效(functionalfail)Failuremechanism常見失效機制:晶片斷裂(diecrack),金球脫,金線斷,脫層(Delamination),導孔斷裂(viaholecrack),線路斷裂(tracebroken),掉球(ballmissing)…等2.可靠度測試與失效機制2.可靠度測試與失效機制線路斷裂(tracebroken)掉球(ballmissing)2.可靠度測試與失效機制導孔斷裂(viaholecrack)2-6.)冷熱衝擊試驗ThermalShockTest（TST,liquidtoliquid）:Reference參考規範:MIL-STD-883EMethod1011.9,JESD22-A106Purpose目的:Todetectthedefectthatrelatedtopackagingstructure,material,process偵測與封裝結構,材料,製程相關之不良Condition常用條件:-65C~150C(D條件),-55~125C(C條件),500CYCFailuremode常見電性失效:斷路(open),功能失效(functionalfail)Failuremechanism常見失效機制:晶片斷裂(diecrack),金球脫,金線斷,脫層(Delamination),導孔斷裂(viaholecrack),線路斷裂(tracebroken),掉球(ballmissing)…等2.可靠度測試與失效機制TCTTSTTCTandTST比較2-7.).溫濕度偏壓壽命試驗TemperatureHumidityBias（THB）:Reference參考規範:EIA/JESD22-A101Purpose目的:Todetectmoisturerelateddefect偵測與濕相關之不良Condition常用條件:85C/85%RH,Bias,1000HFailuremode常見電性失效:短路(short),漏電(leakage)Failuremechanism常見失效機制:金屬離子遷移(ironmigration/dendrite),過大電流(electricaloverstress),腐蝕(corrosion)…等2-7.).溫濕度偏壓壽命試驗TemperatureHumidityBias（THB）:2.可靠度測試與失效機制過大電流(electricaloverstress)2-8.)高溫儲存試驗HightemperatureStoragelife(HTSL):Reference參考規範:JESD22-A103Purpose目的:Toacceleratethediffusionofinter-metallic(Au/Al,Sn/Au),andconfirmwhethertocauseopenfailure加速合金(金/鋁,錫/金IMC)之擴散並確認其是否因而造成開路Condition常用條件:150C,1000HFailuremode常見電性失效:斷路(open),功能失效(functionalfail)Failuremechanism常見失效機制:金球脫(紫斑效應),掉球(ballmissing),過大電流(electricaloverstress)…等2.可靠度測試與失效機制0HRIMC175C/24HIMC150C/1000HIMCcrack2.可靠度測試與失效機制Purpleplague:AuAl2Blackdeath:Au,Al,SiBestIMC:Au4Al2.可靠度測試與失效機制Kirkendallvoid:longtime,hightemp.anddifferentdiffusionratebetweenAu-Al(2.5X)resultinvoid.長時間高溫下IMC快速成長,再加上Au-Al之間擴散速率相差2.5倍而形成void2-9.)超加速壽命試驗Highacceleratedstresstest(HAST):Reference參考規範:JESD22-A110Purpose目的:Toevaluateonthedeviceresistancetohighhumidityandtemperature(withpressure)underspecifiedbiascondition.評價產品在高溫、高濕(壓力)及偏壓條件下之耐久性Condition常用條件:130C,85%RH,96H/100H,Biasorun-biasFailuremode常見電性失效:短路(short),漏電(leakage)Failuremechanism常見失效機制:金屬離子遷移(ironmigration/dendrite),過大電流(electricaloverstress),腐蝕(corrosion)…等2-9.)超加速壽命試驗Highacceleratedstresstest(HAST):2.可靠度測試與失效機制錫鉛離子遷移(Sn/Pbdendrite)2-9.)超加速壽命試驗Highacceleratedstresstest(HAST):2.可靠度測試與失效機制鋁墊腐蝕(Alpadcorrosion)2-10.)沾錫附著性試驗Solderability:Reference參考規範:EIA/JESD22-B102Purpose目的:toprovideameansofdeterminingofthesolderabilityofdevicepackageterminationsthatareintendedtobejointedtoanothersurfaceusingsolderorattachment測試成品接腳或其他型式的終端在使用時，經過浸錫的過程中能否產生合乎標準的沾錫Condition常用條件:蒸氣老化93C,8H(steamaging)浸入錫鑪245C,5sec(Sn63/Pb37有鉛,Sn96.5/Ag3/Cu0.5無鉛)Failuremechanism常見失效機制:不覆錫(Non-wetting),覆錫不均(de-wetting),針孔麻面(pinhole)…等2-10.)沾錫附著性試驗Solderability:2.可靠度測試與失效機制良好覆錫(goodwetting)不良覆錫(non-wetting)2-11.)印碼附著性試驗MarkingPermanency:Reference參考規範:MIL-TSD-883EMethod2015.11,JESD22-B107Purpose目的:Totesttheabilityofinkmarkingtoresistspecificsolvents測試產品印字抵抗某特定溶液的能力Condition常用條件:A,B,C溶液Failuremechanism常見失效機制:印字脫落,印字內容變淡,模糊,斷字…等2.可靠度測試與失效機制溶液2-12.)導腳疲勞試驗Leadfatigue:Reference參考規範:MIL-TSD-883EMethod2004,EIA/JESD22-B105Purpose目的:Todeterminetheresistanceoftheleadstometalfatigueunderrepeatedbending測試產品導腳抵抗重複彎曲金屬疲勞的能力Condition常用條件:8/3/1.7OZ,90Deg.Failuremechanism常見失效機制:cycle數小於3cycles或導腳與膠體間有鬆動,斷裂