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DM9000A_PCB板布线指南DM9000A_PCB板布线指南 DM9000A/ 9010 Layout Guide DM9000A / 9010 Layout Guide Version : 1.0 Technical Reference Manual By: DAVICOM Charles Tsai Davicom Semiconductor IncVersion: DM9000A/9010-LG-V10 1AUG 19 2004 DM9000A/ 9010 Layout Guide1. Placement Signal and Trac...

DM9000A_PCB板布线指南
DM9000A_PCB板布线指南 DM9000A/ 9010 Layout Guide DM9000A / 9010 Layout Guide Version : 1.0 Technical Reference Manual By: DAVICOM Charles Tsai Davicom Semiconductor IncVersion: DM9000A/9010-LG-V10 1AUG 19 2004 DM9000A/ 9010 Layout Guide1. Placement Signal and Trace Routing Place the 10/100M magnetic as close as possible to the DM9000A / 9010 no more than 20mm and to the RJ-45 connector. Place the termination resistors 50Ω as close as possible to the 10/100M magnetic and the DM9000A / 9010 RX?pins and TX?pins. The 50Ω resistors and grounding capacitors of TX? and RX? should be placed near DM9161 no more than 10mm. The 25MHz crystal should not be placed near important signal traces such as RX? receive pair and TX? transmit pair band gap resistor magnetic and board edge. Traces routed from the DM9000A / 9010 RX? pair to the 10/100M magnetic and the RJ45 connector should run symmetrically directly identically and closely no more than 2mm. The same rule is applied to traces routed from the DM9000A / 9010 TX? pair. Do not turn at right angle 90? turn 45? instead Crystal d3 d1 d1 RX RX- d2 TX RJ-45 d2 Magnetic TX- d1 d1 better d1 lt 2mm d2 gt 3mm having AGND as a shield is better d3 gt 5mm having AGND as a shield is better It’s worse to turn at right angle 90? Worse Crystal d3 d1 RX RX- d2 TX RJ-45 Magnetic TX- d1 Worse2 Version: DM9000A/ 9010-LG-V10 AUG 19 2004 DM9000A/ 9010 Layout Guide It is recommended that RX?receive and TX?transmit traces turn at 45? angle. Do not turn at right angle. B e tte r W o rs e Avoid using vias in routing the traces of RX? pair and TX? pair. The RX?pair TX?pair clock and power traces should be as short and wide as possible. Do not place the DM9000A / 9010 RX?receive pair across the TX?transmit pair. Keep the receive pair away from the transmit pair no less than 3mm. It’s better to place ground plane between these two pairs of traces. The network interface see Figure 3-1 and Figure 4 does not route any digital signal between the DM9000A / 9010 RX?and TX?pairs to the RJ-45. Keep the two pairs away from all the other active signals and the chassis ground. It should be no power or ground plane in the area under the network side of the 10/100M magnetic and the area under the RJ-45 connector. Any terminated pins of the RJ-45 connector pins 457 and 8 see Figure 1 and the magnetic see Figure 1 should be tied as closely as possible to the chassis ground through a resistor divider network 75Ω resistors no more than 2mm to the magnetic and a 0.01F/2KV bypass capacitor. The Band Gap resistor should be placed as close as possible to pins 47 and 48 BGRES BGRESG no more than 3mm. Avoid running any high-speed signal near the Band Gap resistor placement no less than 3mm from 25MHz XT1 and XT2.Version: DM9000A/9010-LG-V10 3AUG 19 2004 DM9000A/ 9010 Layout GuideDM9000A 10Base-T/100Base-TX ApplicationFigure 1-1 and 1-2 illustrate the two types of the specific magnetics interconnect and how to connect withDavicom DM9000A. These magnetics are not pin-to-pin compatible. Please must be considered when using theDM9000A in auto-MDIX mode. Figure 1-1 Figure 1-24 Version: DM9000A/ 9010-LG-V10 AUG 19 2004 DM9000A/ 9010 Layout GuideDM9010 10Base-T/100Base-TX ApplicationFigure 1-3 and 1-4 illustrate the two types of the specific magnetics interconnect and how to connect withDavicom DM9010. These magnetics are not pin-to-pin compatible. Please must be considered when using theDM9010 in auto-MDIX mode. Figure 1-3 Figure 1-4Version: DM9000A/9010-LG-V10 5AUG 19 2004 DM9000A/ 9010 Layout Guide2. Power Supply Decoupling Capacitors Place all the decoupling capacitors for all power supply pins as close as possible to the power pads of the DM9000A / 9010 no more than 2.5mm from the above mentioned pins. The recommended decoupling capacitor is 0.1F or 0.01F. The PCB layout and power supply decoupling should provide sufficient decoupling to achieve the following when measured at the device: 1 All DVDDs and AVDDs should be within 50m Vpp of each other 2 All DGNDs and AGNDs should be within 50m Vpp of each other. 3 The resultant AC noise voltage measured across each DVDD/DGND set and AVDD/AGND set should be less than 100m Vpp. The 0.1-0.01F decoupling capacitor should be connected between each DVDD/DGND set and AVDD/AGND set and be placed as close as possible to the pins of DM9000A / 9010. The conservative approach is to use two decoupling capacitors on each DVDD/DGND set and AVDD/AGND set. One 0.1F is for low frequency noise and the other 0.01F is for high frequency noise on the power supply. The AVDD connection to the transmit center tap of the magnetic has to be well decoupled to minimize common mode noise injection from the power supply into the twisted pair cable. It is recommended that a 0.01F decoupling capacitor should be placed between the center tap AVDD to AGND ground plane. This decoupling capacitor should be placed as close as possible to the center tap of the magnetic.10 uF or 47 uF Capacitor should be connected between each AVDD and AGND. Figure 26 Version: DM9000A/ 9010-LG-V10 AUG 19 2004 DM9000A/ 9010 Layout Guide3. Ground Plane Layout Place a single ground plane approach to minimize EMI. Ground plane partitioning can cause increased EMI emissions that could make the network interface card NIC not comply with specific FCC part 15 and CE regulations. Ground plane need separate analog ground domain and digital ground domain the analog ground domain and digital ground domain connected line is far away the AGND pins of DM9000A / 9010 see Figure 4-1. All AGND pins pin 5 6 46 could not directly short each other see Figure 3-3. It must be directly connected to analog ground domain see Figure 3-2. Analog ground domain area is as large as possible Figure 3-1Version: DM9000A/9010-LG-V10 7AUG 19 2004 DM9000A/ 9010 Layout Guide Analog ground domain Analog ground domain AGND AGND AGND AGND AGND AGND Good Worse AGND direct short Digital ground domain Digital ground domain Figure 3-2 Figure 3-38 Version: DM9000A/ 9010-LG-V10 AUG 19 2004 DM9000A/ 9010 Layout Guide4. Power Plane Partitioning The power planes should be approximately illustrated in Figure 4. The ferrite bead used should have an impedance 100Ω at 100MHz and 200mA above. A suitable bead is the Panasonic surface mound bead part number EXCCL4532U or an equivalent. A 10F 0.1F and 0.01F electrolytic bypass capacitors should be connected between VDD and GND at the device side of each of the ferrite bead. Should separate analog power planes from noisy logic power planes. Figure 4Version: DM9000A/9010-LG-V10 9AUG 19 2004 DM9000A/ 9010 Layout Guide5. Magnetics Selection Guide Refer to the following tables 5-1 and 5-2 for 10/100M magnetic sources and specification requirements. The magnetics which meet these requirements are available from a variety of magnetic manufacturers. Designers should test and qualify all magnetic specifications before using them in an application. The magnetics listed in the following table are electrical equivalents but may not be pin-to-pin equivalents. Manufacturer Part Number Pulse Engineering PE-68515 H1102 YCL PH163112 PH163539 Halo TG110-S050N2 TG110-LC50N2 Bel Fuse S558-5999-W2 GTS FC-618SM Table 5-1: 10/100M Magnetic Sources Parameter Values Units Test Condition Tx / RX turns ratio 1:1 CT / 1:1 - - Inductance 350 H Min - Insertion loss 1.1 dB Max 1 – 100 MHz -18 dB Min 1 –30 MHz Return loss -14 dB Min 30 – 60 MHz -12 dB Min 60 – 80 MHz Differential to common -40 dB Min 1 – 60 MHz mode rejection -30 dB Min 60 – 100 MHz Transformer isolation 1500 V - Table 5-2: Magnetic Specification Requirements10 Version: DM9000A/ 9010-LG-V10 AUG 19 2004 DM9000A/ 9010 Layout Guide6. Crystal Selection Guide A crystal can be used to generate the 25MHz reference clock instead of an oscillator. The crystal must be a fundamental type series-resonant connect to XT1 and XT2 and shunt each crystal lead to ground with a 22pF capacitor as shown in Figure 6. PARAMETER SPEC Type Fundamental series-resonant Frequency 25 MHz /- 0.01 Equivalent Series Resistance 25 max Load Capacitance 22 pF typ. Case Capacitance 7 pF max. Power Dissipation ohms 1mW max. Table 6-1: Crystal Specifications XT2 XT1 42 43 Y1 25M .
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