封装考核评估学习资料汇编doc27页本

精品文档精品文档袅肃芄艿蒈膈蕿羅蒃芀膄羁蒅羇膁肅肂蚁膄葿蚆PAGEPAGE21精品文档PAGE1、Purpose目的ThisdocumentprovidestemplatesforrecordingpackagequalificationdataforRFMDproductandinstructionsforcomplyingwithMaterialsDeclaration.提供 记录 混凝土 养护记录下载土方回填监理旁站记录免费下载集备记录下载集备记录下载集备记录下载 RFMD产品考核认证所需信息资料的模板,及遵从物质申明的说明2、Scope范围ApplytoRFMDpackagequalification适用于RFMD考核认证产品3、Instruction说明3.1MaterialsDeclaration:TheSubcontractorAssemblyhouseisrequiredtosubmitMaterialsDeclarationformslistingtherequiredbanned,bannedwithacceptablethresholdlevel,reportableorothermaterialsrequiredbyRFMDQAL-21-1028forassembliesmanufacturedforRFMD.Thesearerequiredforcurrentandnewassembliesandmustbeupdatedwhenevermaterialchangesoccurorwheneveranewsubstrateprocessdevelopmentorassemblyqualificationbegins.Thesupplierwillberequiredtoprovideproofofcompliancywithachemicalanalysis.SeeQAL-21-1028fordetailsonrequirements,reportingstructure,andreportingformat.物质申明:外包封装厂需要提交物质声明书，列明禁用材料，禁用但可接受门限的材料、需告知的或其他由RFMDQAL-21-1028文件 规定 关于下班后关闭电源的规定党章中关于入党时间的规定公务员考核规定下载规定办法文件下载宁波关于闷顶的规定 的用于RFMD封装制造产品的材料.这些规定适用于现有及未来新的封装产品,当材料变更,新基板工艺 流程 快递问题件怎么处理流程河南自建厂房流程下载关于规范招聘需求审批流程制作流程表下载邮件下载流程设计 的开发或开始封装考核认证时都要提交该声明书.供应商还需要提供化学分析作为依据.参考QAL-21-1028文件中的详细要求, 报告 软件系统测试报告下载sgs报告如何下载关于路面塌陷情况报告535n,sgs报告怎么下载竣工报告下载 的结构和格式。3.2Addlines,inserttables,embedobjectsateachapplicableprocesssteptocapturepertinentprocessdata.各工序可根据需收集的相关信息资料增加表格的行数,插入新的表格和对象3.3Compresspicturesonceallapplicableprocessinformationhasbeeninserted.Gotoviewtoolbars,selectpictures.Gotopicturestoolbarandcompresspictures,OK.完成相应的所有工序的信息资料后压缩图片.在视图工具栏中选择图片后压缩或在图片工具栏栏中压缩图片4、Reference参考CSR-CM012（PKG-21-1013）SubcontractorAssemblySpecificationforModulesCSR-CM029（QAL-21-1028）BannedSubstancesListandRFMDGreenDefinition5、QualificationData考核评估资料拟制：审核：批准：QualificationDataPartNumberQualLotNumberTraceCodePackageTypePackageSizeWaferSizeThicknessThickness(listalldie)LeadCountPONumberMSLTargetLevelAssemblyLocationBondingDiagramPartNumberBOMPartNumberBrandingDiagramPartNumberPreparedByExecutiveSummaryYieldSummaryLot#1Lot#2Lot#3TotalYieldSMTYieldLot#1Lot#2Lot#3TotalYieldAssyYieldLot#1Lot#2Lot#3TotalYieldFinalYieldDataSummaryAllLotscombinedProcessTestCriteriaSSMaxMinAvgStdCpk±SMTPasteThicknessSMTComponentShear(gramforcepereachSMDsize)SMTFluxThicknessDieAttachPlacementXDieAttachPlacementYDieAttachShear(eachdie)DieAttachRotationFlipChipShear(eachdiesize)AttachFlipChipPlacementAttachFlipChipStandoffAttachWireBondPullsDietoSubWireBondPullsDietoDieWireBondPullsSubtoSubWireBondPullsRSSBWireBondLoopHeightWireBondSpanWireBondPlacementXWireBondPlacementYWireBondBallShear>71umBPOWireBondBallShear>60<=71umBPOWireBondBallShear>52<=60umBPOWireBondSSBShear>71umBPOWireBondSSBShear>60<=71umBPOWireBondSSBShear>52<=60umBPOWireBondBallshearonsubstratePlatingThicknessPlatingCompositionBallattachBallShearBallattachBallHeightSolderBumpBumpDiameterProcessTestCriteriaSSMaxMinAvgStdCpk±SolderBumpBumpCompositionSolderBumpBumpHeightSolderBumpBumpShearSolderBumpBumpCo-planarityonwaferSolderBumpBumpCo-planarityonDieSingulationSizeXSingulationSizeYSingulationSizeZSingulationRegistrationXSingulationRegistrationYSingulationCoplanarityTrim/FormTiptoTipTrim/FormStandoffTrim/FormCoplanarityConclusionsandRecommendationsBOMQualLot#1(repeatforquallot2and3)BuildDateTracecodeWaferLotNumbersSolderBumpManf(ifapplicable)PartNumberLotNumberAlloySubstrateorLeadframeManfPartNumberLotNumberMaterialSetorAlloyFlipChipFluxManfPartNumberLotNumberSolderPasteManfPartNumberLotNumberAlloyDieAttachManfPartNumberLotNumberWireManfPartNumberLotNumberLidManfPartNumberLotNumberShieldEpoxyManfPartNumberLotNumberShieldManfPartNumberLotNumberAlloyMoldCompManfPartNumberLotNumberTabletSizeSolderBallManfPartNumberLotNumberAlloyManufactureDieDescriptionPadOpeningPadPitchDieSizeDieThicknessD1D2D3D4D5ManufactureThicknessD1D2D3D4D5FlipChipDieDescriptionPadOpeningBumpPitchDieSizeDiePassiveComponents(Useifapplicable)ManufactureDescriptionValueTypeCapacitorResistorInductorBackgrind(UseifApplicable)EquipmentMakeandModelnumberBladeTypeFeedRateSpindleSpeedWaterTypeWaterResistivityWaferSaw(UseifApplicable)EquipmentMakeandModelnumberBladeTypeFeedRateSpindleSpeedWaterTypeWaterResistivitySMT(UseifApplicable)SMTLineNumberorindividualequipmentnumbersProvideReflowProfileGraphobtainedprelotforallquallots.Providedata:TimeaboveLiquidousPeakTemperatureTimeto150°CTimeabove150°CReflowprofilenameNitrogenovenO2ppmZoneSettingsZ1Z2Z3ofZ4QuallotZ5(repeatZ6forqualificationZ7Z8lotZ92and3).Z10ProfileZ11tobeZ12TopBTMFluxPrinting(forFlipChip–useifapplicable)Attachsamplepictureforeachdie.FluxStencilParameters:StencilThicknessStencilMaterialApertureOpeningDesign–(Specialdesignand%ofsoldermaskormetalopening)FluxPrintProcessParameters:Bladetype(plastic&hardness/metal)andAngleBladeForceBladeSpeedSeparationspeed&distanceSolderStencilParameters:StencilThicknessStencilMaterialApertureOpeningDesign–(Specialdesignand%ofsoldermaskormetalopening)ForFlipChip–RecessZdepth&openingX,Ydistance(s)PastePrintProcessParameters:Bladetype(plastic&hardness/metal)andAngleBladeForceBladeSpeedSeparationspeed&distanceProvidesamplepictureofsolderpasteprint.FluxThickness(ifapplicable),(repeatforlots2and3)12345678910MinMaxAvgST1PasteThickness,(repeatforlots2and3)12345678910MinMaxAvgST10402ComponentSheargramforce,(repeatforlots2and3)12345InductorsCapacitorsResistorsMinMaxAvg0201ComponentSheargramforce,(repeatforlots2and3)12345InductorsCapacitorsResistorsMinMaxAvg01005ComponentSheargramforce,(repeatforlots2and3)12345InductorsCapacitorsResistorsMinMaxAvgAddrowsorcolumnsforanyothersize/shapesurfacemountcomponentnotlisted.samequantityofshearsandlisteddatagatheringrequirements.FlangePackages(ifapplicable)PreFlangeFlatnessMeasurement–DatapertenflangesPerformMeasurefivelocationsperflange,centerandfourcorners.FlangeFlatness,(repeatforlot2and3)12345MinMaxAvgF1F2F3F4F5F6F7F8F9F10DieAttachEquipmentMakeandModelnumberAttachMethodParametersDiePlacement,(repeatforlot2and3)12345678910MinMaxAvgD1xD1yD2xD2yD3xD3yD4xD4yD5xD5yDieShear,(repeatforlot2and3)12345678910MinMaxAvgD1D2D3D4D5DieRotationinDegrees,(repeatforlot2and3)12345678910MinMaxAvgD1D2D3D4D5FlipChipAttach(ifapplicable)EquipmentMakeandModelnumberProvideReflowProfileGraphofQuallot(repeatforqualificationlot2and3)ifdifferentfromSMTreflowprofile.Profiletobeobtainedprelotforallquallots.Providedata:TimeaboveliquidousTimeto150°CTimeabove150°CReflowprofilenameNitrogenOvenO2ppmZoneSettingsZ1Z2Z3Z4Z5Z6Z7Z8Z9Z10Z11Z12TopBTMAttachMethodParametersNeedle(perdie):Provideimageofpushuppinconfiguration.Providesamplepictureofbacksideofdie.AvgD1D2D3D4D5DieShear,(repeatforlot2and3)123456D1D2D3D4D5BumpShear,(repeatforlot2and3)123456D1D2D3D4D5Bumpwettingtosubstratepad,(repeatforlot2and3)AttachX-rayof5samplesDieAttachCureEquipmentMakeandModelnumberPeakTemperatureRampTimeupDwellTimeRampTimeDownPlasmaorUV(UseifApplicable)MakeandModelnumberPowerTimeGasMixtureWireBondMakeandModelnumber78910MinMaxAvg78910MinMaxAvgCapillaryManfPartNumberStdBondParametersDie1Die2Die31stbond2ndbond1stbond2ndbond1stbond2ndbondVelocityTimePowerForceBondSiteTempRSSBBondParametersDie1Die2Die3Bump1stbond2ndbondBump1stbond2ndbondBump1stbond2ndbondVelocityTimePowerForcePreHeatTempBondSiteTempSubstratetoSubstrateBondParameters1stbond2ndbondVelocityTimePowerForcePreHeatTempBondSiteTempAddBondingDiagram(completelayoutdrawing)WirePulls,DietoSubstrate,nonRSSB(repeatforlot2and3)12345678910MinMaxAvgD1D2D3D4D5WirePulls,DietoSubstrate,RSSB(repeatforlot2and3)12345678910MinMaxAvgD1D2D3D4D5WirePulls,DietoDie(repeatforlot2and3)12345678D1D2D3D4D5WirePulls,SubstratetoSubstrate(repeatforlot2and3)12345678D1D2D3D4D5LoopHeights,(repeatforlot2and3)12345678D1D2D3D4D5WireSpan,(repeatforlot2and3)12345678D1D2D3D4D5WirePlacement,(repeatforlot2and3)12345678D1xD1yD2xD2yD3xD3yD4xD4yD5xD5yBallShear,Measure>71umPadOpening,(repeatforlot2and3)910MinMaxAvg910MinMaxAvg910MinMaxAvg910MinMaxAvg910MinMaxAvg12345678910MinMaxAvgD1D2D3D4D5StitchStudBump(SSB)Shear,Measure>71umPadOpening,(repeatforlot2and3)12345678910MinMaxAvgD1D2D3D4D5StitchStudBump(SSB)Shear,Measure10balls>60um<=71umPadOpening,Minimum2Strips(repeatforlot2and3)12345678910MinMaxAvgD1D2D3D4D5StitchStudBump(SSB)Shear,Measure10balls>52um<=60umPadOpening,Minimum2Strips(repeatforlot2and3)12345678910MinMaxAvgD1D2D3D4D5BallShearonsubstrate,Measure10balls>52um<=60umPadOpening,Minimum2Strips(repeatforlot2and3)12345678910MinMaxAvgBSSWedgeBondShear(ifapplicable),Measure10balls>65um<=80umPadOpening,Minimum10units(repeatforlot2and3)Stage1StartPositionmm/sStage1StartPositionmm/sMoldCureTimeFlangePackages(ifapplicable)PostFlangeFlatnessMeasurement–DatapertenflangesMeasurefivelocationsperflange,centerandfourcorners.FlangeFlatness,(repeatforlot2and3)12345MinMaxAvgF1F2F3F4F5F6F7F8F9F10MoldMakeandModelofmachine:MoldCompoundTransferProgram:Positionofplungeratstart(mmPelletHeight,PS(PS=PositionStart)):Speedofplunger(mm/secfromstarttonextposition,PStoP1):Positionofplungerfornextposition(mmP1):Speedofplunger(mm/secfromP1toP2):Positionofplungerfornextposition(mmP2):Speedofplunger(mm/secfromP2toP3):Positionofplungerfornextposition(mmP3):Speedofplunger(mm/secfromP3toP4):Positionofplungeratfinalendposition(PE=PositionEnd):*CullHeightsetting&actualmm(actualismeasuredwithmicrometer):Positivecullvalue(distanceabovebottommolddie):TransferPressuresetting&actualPSI:TransferTime(timefromPStoPE):MoldTemperaturesetting&range(Max/Min):*PelletPreheatsettingandactual:LaminateorLeadframeinmoldpreheattime,settingandactualLaminateorLeadframepreheatplatetemperature,timeonplate:mm:mm/sec:mm:mm/sec:mm:mm/sec:mm:mm/sec:mm:mm:mm:mm:PSISetting:PSIActual:Sec:oCSetting:oCMax/Min:oCSetting:oCActual:SecSetting:SecActual:oC:Sec:Ton:ClampForce:Quantity:Pelletsperplungersleeve:Lengthmm:Gramweight:Pelletsize:Torr,mBar,orotherCavityvacuumdegree:*Cullheightsettingisfrommachineprogram.Actualmmisfullcullpieceheightasmeasuredfromextremetoptobottom.Pleasenoteifatopcullsettingfeatureisaddedorsubtractedfromanypositionsetting(s)–(positiveornegativecull).Cullheight是在机台程序中设定。从cull的最顶端到底端测试cull的完整高度。注意topcull的设定特性参数为正数还是负数。Moldtemperaturerange:includesallsurfacesinwhichmoldcompound&laminate/leadframecomeincontactwithmolddie.模温区域：包括所有与料饼，基板/引线框相接触的模具表面。*Pelletpreheattimeactualistobemeasuredwithstopwatch.Actualtimeisdefinedas-timewhenpellet(s)arereleasedintoplungersleeveuntilplungerrammoves.Ifpelletcrushfeatureisenabled,thentimeisdefinedaspelletreleaseinsleeveuntilP1toP2plungermove.使用秒表测量料饼的实际预热时间。预热时间是从料饼放入套筒中到顶杆开始移动的时间。如果Pelletcrush特性是激活的，预热时间为从料饼放入套筒中到顶杆开始从P1向P2运动的时间Laminate/leadframeinmoldpreheattimeactualisdefined-fromlaminate/leadframereleaseonmolduntilmoldclamp.Measurewithstopwatch.基板/引线框的预热时间定义-从基板/引线框放入模具到模具压合的时间。使用秒表进行测量。FlipChipAttach.SupplyX-ray.jpg’sof5samplesperlot(repeatforlot2and3).(Focustoballalignmentatinterconnect.)WireSweep,Top5worstCaseperlot.SupplyX-Ray.jpg’sofEachWorstCase(repeatforlot2and3)SweepPercentageWireLocationPostMoldCureEquipmentMakeandModelnumberCureTemperatureRampTimeupDwellTimeRampTimeDownPlating(UseifApplicable)MakeandModelnumberPlatingThicknessTolerancePlatingCompositionTolerancePlatingThickness,(repeatforlot2and3)12345678910MinMaxAvgPL1PlatingComposition,(repeatforlot2and3)12345678910MinMaxAvgPC1LaserMarkingMakeandModelnumberFontParameterBallAttach(UseifApplicable)MakeandModelnumberBallDiameterBallCompositionFluxType/PartNoBallShear,(repeatforlot2and3)12345678910MinMaxAvgBS1BallHeight,(repeatforlot2and3)12345678910MinMaxAvgBH1ProvideReflowProfileGraphofQuallotSolderBump(UseifApplicable)MakeandModelnumberSolderBumpDiameterSolderBumpCompositionFluxType/PartNo(IfApplicable)SolderBumpShear,(repeatforlot2and3)12345678910MinMaxAvgBS1SolderBumpHeight,(repeatforlot2and3)12345678910MinMaxAvgBH1SolderBumpCoplanarity,(repeatforlot2and3)12345678910MinMaxAvgCProvideReflowProfileGraphofQuallotSawSingulation(UseifApplicable)MakeandModelnumberBladeTypeSpindleSpeedFeedRatemm/sWaterResistivityPackageSize,(repeatforlot2and3)12345678910MinMaxAvgXYZPackageRegistration,(repeatforlot2and3)12345678910MinMaxAvgXYPackageCoplanarity,(repeatforlot2and3)12345678910MinMaxAvgCPunchSingulation(UseifApplicable)MakeandModelnumberStrokeper/minPackageSize,(repeatforlot2and3)12345678910MinMaxAvgXYZPackageRegistration,(repeatforlot2and3)12345678910MinMaxAvgXYPackageCoplanarity,(repeatforlot2and3)12345678910MinMaxAvgCTrim&Form(UseifApplicable)MakeandModelnumberStrokeper/minPackageTiptoTip,(repeatforlot2and3)12345678910MinMaxAvgTTPackageStandoff,(repeatforlot2and3)12345678910MinMaxAvgPSPackageCoplanarity,(repeatforlot2and3)12345678910MinMaxAvgCLeadIntegrity,(repeatforlot2and3)Pass/failEndofLineInspectionandYieldReportSMT(IfApplicable)DefectBreakdownQtyinQtyoutYieldDieAttachDefectBreakdownQtyinQtyoutYieldFlipChipAtachDefectBreakdownQtyinQtyoutYieldWireBondDefectBreakdownQtyinQtyoutYield3rdOpticalDefectBreakdownQtyinQtyoutYieldMoldDefectBreakdownQtyinQtyoutYieldLidAttachDefectBreakdownQtyinQtyoutYieldGross&FineLeakDefectBreakdownQtyinQtyoutYieldPlating(IfApplicable)DefectBreakdownQtyinQtyoutYieldLaserMarkingDefectBreakdownQtyinQtyoutYieldBGAAttach(IfApplicable)DefectBreakdownQtyinQtyoutYieldSawSingulate(IfApplicable)DefectBreakdownQtyinQtyoutYieldPunchSingulate(IfApplicable)DefectBreakdownQtyinQtyoutYieldTrim&Form(IfApplicable)DefectBreakdownQtyinQtyoutYield4thOpticalDefectBreakdownQtyinQtyoutYield批考试验的其他报告需求/AdditionalReportRequirementsPerQualificationLotAcceleratedMSLTesting(ModulePackageonly),followModuleAssemblyPKG-21-1013andMSLReportFormatPKG-21-1035加速MSL测试(仅模块封装产品有此需求)，参考RFMD文件PKG-21-1013和MSL报告格式PKG-21-1035Supply5X-RaysofTotalPackage所有产品提供5张X-Ray图片Supply5SolderJointCrackCrossSection,Providephotoofallcrosssections.(IfApplicable)提供5个切片检验锡膏焊接裂痕的问题，并提供切片的照片(如果需要)Supply5FlipChipSolderJointCrackCrossSection,Providephotoofallcrosssections.(IfApplicable)提供5个切片检验倒装芯片锡球焊接裂痕的问题，并提供切片的照片Supply5UnderfillBackGrind(forinspectionofunderfill(如果需要)ofSMD’sandFlipChip),Providephotosandanalysisofbackgrinds.(IfApplicable)提供研磨后的5颗产品检验元器件和倒装芯片的底部填充问题，并提供研磨后的照片和分析。Attach3pictures/lotofStitchStudonBump(SSB)tocharacterizeballcontainmentwithinbondpad.每批产品附三张SSB弧线的照片以描述金球是否控制在球焊焊盘内。Performsilicondiebondpadcrackinspectionpostwire-bondfor10pads/lot.Attach1worstcasepictureperlot.每批产品球焊完成后检验硅片的10个pad的弹坑，并附pad受损最严重的照片Supply1openfacedstripperlotasrequireinthepurchaseorder按客户订单要求每批产品中提供一条未塑封的产品ComprehensiveYieldReport综合的良率报告改善 计划 项目进度计划表范例计划下载计划下载计划下载课程教学计划下载 /CorrectiveActionPlanfortop5Rejects1.2.3.4.5.