IPC J-STD-003B 2007

JOINT INDUSTRY STANDARD Solderability Tests for Printed Boards IPC J-STD-003B March 2007 Supersedes J-STD-003A February 2003 Copyright Association Connecting Electronics Industries Provided by IHS under license with IPC Not for ResaleNo reproduction or networking permitted without license from IHS --`,,```,,,,````-`-`,,`,,`,`,,`--- //^:^^#^~^^"^~"^"^:$^~#:"#:$@:~^"$^:#*~^$^~:^#*^^:^^*\\ The Principles of Standardization In May 1995 the IPC’s Technical Activities Executive Committee (TAEC) adopted Principles of Standardization as a guiding principle of IPC’s standardization efforts. 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All rights reserved under both international and Pan-American copyright conventions. Any copying, scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States. Copyright Association Connecting Electronics Industries Provided by IHS under license with IPC Not for ResaleNo reproduction or networking permitted without license from IHS - - ` , , ` ` ` , , , , ` ` ` ` - ` - ` , , ` , , ` , ` , , ` - - - //^:^^#^~^^"^~"^"^:$^~#:"#:$@ :~^"$^:#*~^$^~:^#*^^:^^*\\ IPC J-STD-003B Solderability Tests for Printed Boards Developed by the Printed Wiring Board Solderability Specification Task Group (5-23a) of the Assembly & Joining Processes Committee (5-20) of IPC Users of this publication are encouraged to participate in the development of future revisions. Contact: IPC 3000 Lakeside Drive, Suite 309S Bannockburn, IL 60015-1249 Phone ( 847) 615-7100 Fax (847) 615-7105 Supersedes: J-STD-003A - February 2003 J-STD-003 - April 1992 IPC-S-804A - January 1987 IPC-S-803 IPC-S-801 ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES ® Copyright Association Connecting Electronics Industries Provided by IHS under license with IPC Not for ResaleNo reproduction or networking permitted without license from IHS - - ` , , ` ` ` , , , , ` ` ` ` - ` - ` , , ` , , ` , ` , , ` - - - //^ :^ ^# ^~ ^^ "^ ~" ^" ^: $^ ~# :"# :$ @ :~ ^" $^ :# *~ ^$ ^~ :^ #* ^^ :^ ^* \\ This Page Intentionally Left Blank Copyright Association Connecting Electronics Industries Provided by IHS under license with IPC Not for ResaleNo reproduction or networking permitted without license from IHS --`,,```,,,,````-`-`,,`,,`,`,,`--- //^:^^#^~^^"^~"^"^:$^~#:"#:$@ :~^"$^:#*~^$^~:^#*^^:^^*\\ Acknowledgment Any document involving a complex technology draws material from a vast number of sources. While the principal members of the Printed Wiring Board Solderability Specification Task Group (5-23a) of the Assembly & Joining Processes Commit- tee (5-20) are shown below, it is not possible to include all of those who assisted in the evolution of this Standard. To each of them, the members of IPC extend their gratitude. Assembly & Joining Processes Committee Printed Wiring Board Solderability Specification Task Group Technical Liaisons of the IPC Board of Directors Chair Leo P. Lambert EPTAC Corporation Vice Chair Renee J. Michalkiewicz Trace Laboratories - East Chair David D. Hillman Rockwell Collins Vice Chair Dennis Fritz MacDermid, Inc. Peter Bigelow IMI Inc. Sammy Yi Flextronics International Printed Wiring Board Solderability Specification Task Group Blaine Partee, ACI/EMPF Trevor Bowers, Adtran Inc. Brenda Ross, Air Products & Chemicals Lorianne Hamoline, Alcatel-Lucent Bradley Smith, Allegro MicroSystems Inc. Charles Dal Currier, Ambitech Inc. Andrew Giamis, Andrew Corporation George M. Wenger, Andrew Corporation Greg Alexander, Ascentech, LLC Kuldip Johal, Atotech USA Inc. Robert Wettermann, B E S T Inc. Mark Buechner, BAE Systems Thomas A. Carroll, Boeing Space Systems Gail Auyeung, Celestica International Inc. Jason Bragg, Celestica International Inc. Kevin Weston, Celestica International Inc. Mario Kasilag, Consultant David J. Corbett, Defense Supply Center Columbus Patrick Kyne, Defense Supply Center Columbus David E. Moore, Defense Supply Center Columbus Lowell Sherman, Defense Supply Center Columbus Jim R. Reed, Dell Inc. John H. Rohlfing, Delphi Electronics and Safety Philip W. Wittmer, Delphi Electronics and Safety Brian C. McCrory, Delsen Testing Laboratories Glenn Dody, Dody Consulting Theodore Edwards, Dynaco Corp. Peter Bratin, ECI Technology, Inc. Michael Pavlov, ECI Technology, Inc. Werner Engelmaier, Engelmaier Associates, L.C. Karl F. Wengenroth, Enthone Inc. - Cookson Electronics Yung-Herng Yau, Enthone Inc. - Cookson Electronics Benny Nilsson, Ericsson AB Michael W. Yuen, Foxconn EMS, Inc. Graham Naisbitt, Gen3 Systems Limited Brian J. Toleno, Ph.D., Henkel Corporation Jere Wittig, HFK Precision Metal Stamping Corporation Suzanne F. Nachbor, Honeywell DSES Minneapolis Chris W. Alter, Honeywell Inc. Joseph T. Slanina, Honeywell Inc. Vicka White, Honeywell Inc. Dewey Whittaker, Honeywell Inc. Whitney Aguilar, Hydro-Aire Division/Crane Co. James D. Bielick, IBM Corporation Theron L. Lewis, IBM Corporation Gary B. Long, Intel Corporation James F. Maguire, Intel Corporation Jack McCullen, Intel Corporation Mark A. Kwoka, Intersil Corporation J. Lee Parker, Ph.D., JLP Howard S. Feldmesser, Johns Hopkins University Akikazu Shibata, Ph.D., JPCA-Japan Electronics Packaging and Circuits Association Mary Carter Berrios, Kemet Electronics Corp. Richard E. Kraszewski, Kimball Electronics Group Phillip Chen, L-3 Communications Electronic Systems Steven M. Nolan, C.I.D.+, Lockheed Martin Maritime Systems Vijay Kumar, Lockheed Martin Missile & Fire Control Linda Woody, Lockheed Martin Missile & Fire Control Hue T. Green, Lockheed Martin Space Systems Company Donald P. Cullen, MacDermid, Inc. Bihari Patel, MacDermid, Inc. Srinivas Chada, Ph.D., Medtronic Microelectronics Center Randy R. Reed, Merix Corporation Francis Anglade, Metronelec March 2007 IPC J-STD-003B iii Copyright Association Connecting Electronics Industries Provided by IHS under license with IPC Not for ResaleNo reproduction or networking permitted without license from IHS - - ` , , ` ` ` , , , , ` ` ` ` - ` - ` , , ` , , ` , ` , , ` - - - //^:^^#^~^^"^~"^"^:$^~#:"#:$@:~^"$^:#*~^$^~:^#*^^:^^*\\ Russell S. Shepherd, Microtek Laboratories Edwin Bradley, Motorola Inc. John W. Porter, Multicore Solders Ltd. Christopher Hunt, Ph.D., National Physical Laboratory Keith Sweatman, Nihon Superior Co., Ltd. Kil-Won Moon, Ph.D., NIST Maureen Williams, NIST Gordon Davy, Northrop Grumman Corporation Mary Dinh, Northrop Grumman Space Systems Gerard A. O’Brien, Photocircuits Corporation Timothy M. Pitsch, Plexus Corp. Scott M. Ubl, Plexus Corp. Dennis J. Cantwell, Printed Circuits Inc. Carol A. Handwerker, Sc.D., Purdue University Steven A. Herrberg, Raytheon Company William R. Russell, Raytheon Company Jeff Seekatz, Raytheon Company Rudy Sedlak, RD Chemical Co. Connie M. Korth, Reptron Manufacturing Services/Hibbing Beverley Christian, Ph.D., Research In Motion Limited Susan S. Hott, Robisan Laboratory Inc. Chris Mahanna, Robisan Laboratory Inc. David C. Adams, Rockwell Collins Douglas O. Pauls, Rockwell Collins Keith J. Whitlaw, Rohm and Haas Company Dawn Skala, Sandia National Laboratories, Calif. Zhang Yuan, Shenzhen Huawei Technologies Harry M. Siegel, STMicroelectronics Inc. Karl A. Sauter, Sun Microsystems Inc. Frank Y. S. Bai, Taiwan Printed Circuit Association William Sepp, Technic Inc. Richard M. Edgar, Tec-Line Inc. William Lee Vroom, Thomson Consumer Electronics Renee J. Michalkiewicz, Trace Laboratories - East George Milad, UIC/Uyemura International Corp. Vincent B. Kinol, Umicore America Inc. Chris Ball, C.I.D., Valeo Inc. Donald M. Hague, W. M. Hague Company IPC J-STD-003B March 2007 ivCopyright Association Connecting Electronics Industries Provided by IHS under license with IPC Not for ResaleNo reproduction or networking permitted without license from IHS --`,,```,,,,````-`-`,,`,,`,`,,`--- //^:^^#^~^^"^~"^"^:$^~#:"#:$@:~^"$^:#*~^$^~:^#*^^:^^*\\ Table of Contents 1 GENERAL ................................................................. 1 1.1 Scope .............................................................. 1 1.2 Purpose ........................................................... 1 1.3 Objective ........................................................ 1 1.3.1 Shall or Should .............................................. 1 1.3.2 Document Hierarchy ...................................... 1 1.4 Performance Classes ...................................... 1 1.5 Method Classification .................................... 1 1.5.1 Visual Acceptance Criteria Tests ................... 1 1.5.2 Force Measurement Criteria Tests ................ 2 1.5.3 Test(s) Methodologies Under Committee Review ........................................................... 2 1.6 Test Method Selection ................................... 2 1.7 Test Specimen Requirements ........................ 2 1.8 Coating Durability ......................................... 3 1.9 Limitation ....................................................... 3 2 APPLICABLE DOCUMENTS .................................... 3 2.1 Industry .......................................................... 3 2.1.1 IPC ................................................................. 3 3 REQUIREMENTS ...................................................... 3 3.1 Terms and Definitions ................................... 3 3.2 Materials ......................................................... 3 3.2.1 Solder ............................................................. 3 3.2.2 Flux ................................................................ 4 3.2.2.1 Flux Maintenance .......................................... 4 3.2.3 Flux Removal ................................................. 4 3.3 Equipment ...................................................... 4 3.3.1 Conditioning Equipment ................................ 4 3.3.2 Solder Pot/Bath .............................................. 4 3.3.3 Optical Inspection Equipment ....................... 4 3.3.4 Dipping Equipment ........................................ 4 3.3.5 Timing Equipment ......................................... 4 3.4 Preparation for Testing .................................. 4 3.4.1 Test Specimen Preparation and Conditioning for Test ..................................... 4 3.4.2 Durability Conditioning ................................. 4 3.4.3 Baking ............................................................ 4 3.5 Solder Bath Requirements ............................. 5 3.5.1 Solder Temperatures ...................................... 5 3.5.2 Solder Contamination Control ....................... 5 4 TEST PROCEDURES ............................................... 6 4.1 Test Procedure Limitations ............................ 6 4.1.1 Application of Flux ....................................... 6 4.2 Tests with Established Accept/ Reject Criteria ................................................ 7 4.2.1 Test A – Edge Dip Test Tin/Lead Solder ...... 7 4.2.1.1 Apparatus ....................................................... 7 4.2.1.1.1 Solder Pot/Bath .............................................. 7 4.2.1.1.2 Dipping Device .............................................. 7 4.2.1.2 Test Specimen ................................................ 7 4.2.1.3 Procedure ....................................................... 7 4.2.1.4 Evaluation ...................................................... 9 4.2.1.4.1 Magnification ................................................. 9 4.2.1.4.2 Surface Evaluation – Accept/ Reject Criteria ................................................ 9 4.2.2 Test B – Rotary Dip Test Tin/Lead Solder ... 9 4.2.2.1 Apparatus ....................................................... 9 4.2.2.2 Test Specimen ................................................ 9 4.2.2.3 Procedure ....................................................... 9 4.2.2.4 Evaluation ...................................................... 9 4.2.2.4.1 Magnification ................................................. 9 4.2.2.4.2 Surface Evaluation – Accept/ Reject Criteria .............................................. 10 4.2.2.4.3 Plated-Through Hole Evaluation ................. 10 4.2.3 Test C – Solder Float Test Tin/ Lead Solder .................................................. 11 4.2.3.1 Apparatus ..................................................... 11 4.2.3.1.1 Solder Pot ..................................................... 11 4.2.3.1.2 Test Specimen Handling Tool ..................... 11 4.2.3.2 Test Specimen .............................................. 11 4.2.3.3 Procedure ...................................................... 11 4.2.3.4 Evaluation .................................................... 11 4.2.3.4.1 Magnification ............................................... 11 4.2.3.4.2 Surface Evaluation – Accept/ Reject Criteria .............................................. 11 4.2.3.4.3 Plated-Through Hole Evaluation ................. 11 4.2.4 Test D – Wave Solder Test Tin/ Lead Solder .................................................. 11 4.2.4.1 Apparatus ..................................................... 11 4.2.4.2 Test Specimen .............................................. 11 4.2.4.3 Procedure ...................................................... 11 4.2.4.4 Evaluation .................................................... 12 4.2.4.4.1 Magnification ............................................... 12 4.2.4.4.2 Surface Evaluation – Accept/ Reject Criteria .............................................. 12 4.2.4.4.3 Plated-Through Hole Evaluation ................. 12 March 2007 IPC J-STD-003B vCopyright Association Connecting Electronics Industries Provided by IHS under license with IPC Not for ResaleNo reproduction or networking permitted without license from IHS --`,,```,,,,````-`-`,,`,,`,`,,`--- //^:^^#^~^^"^~"^"^:$^~#:"#:$@ :~^"$^:#*~^$^~:^#*^^:^^*\\ 4.2.5 Test E – Surface Mount Process Simulation Test Tin/Lead Solder ................. 12 4.2.5.1 Apparatus ..................................................... 12 4.2.5.1.1 Stencil/Screen ............................................... 12 4.2.5.1.2 Paste Application Tool ................................. 12 4.2.5.2 Test Specimen .............................................. 12 4.2.5.3 Reflow Equipment ....................................... 12 4.2.5.4 Procedure ..................................................... 13 4.2.5.5 Evaluation .................................................... 13 4.2.5.5.1 Magnification ............................................... 13 4.2.5.5.2 Surface Evaluation – Accept/ Reject Criteria .............................................. 13 4.2.6 Test A1 – Edge Dip Test Lead- Free Solder ................................................... 14 4.2.6.1 Apparatus ..................................................... 14 4.2.6.1.1 Solder Pot/Bath ............................................ 14 4.2.6.1.2 Dipping Device ............................................ 14 4.2.6.2 Test Specimen .............................................. 14 4.2.6.3 Procedure ..................................................... 14 4.2.6.4 Evaluation .................................................... 14 4.2.6.4.1 Magnification ............................................... 14 4.2.6.4.2 Surface Evaluation – Accept/ Reject Criteria .............................................. 14 4.2.7 Test B1 – Rotary Dip Test Lead- Free Solder ................................................... 14 4.2.7.1 Apparatus ..................................................... 14 4.2.7.2 Test Specimen .............................................. 14 4.2.7.3 Procedure ..................................................... 14 4.2.7.4 Evaluation .................................................... 15 4.2.7.4.1 Magnification ............................................... 15 4.2.7.4.2 Surface Evaluation – Accept/ Reject Criteria .............................................. 15 4.2.7.4.3 Plated-Through Hole Evaluation ................. 15 4.2.8 Test C1 – Solder Float Test Lead- Free Solder ............................