ee7.9的新功能说明书 Mentor.Graphics.Expedition文档，学习资料

What’s New in EE2007.9 What’s New in Expeditiontm Enterprise 2007.9 Version 1.� Copyright © 2010 Mentor Graphics Corporation. The marks for the Mentor products and processes mentioned in this document are trademarks or registered trademarks of Mentor Graphics Corporation. All other trademarks mentioned in this document are trademarks or registered trademarks of their respective owners. What’s New in EE2007.9 1 Table of Contents Expedition Enterprise 2007.9 ............................................................................. 3 General Enhancements to Expedition ......................................................... 4 Library Services ......................................................................................... 4 Advanced Topologies ................................................................................. 5 Any Angle Dual Point Select ...................................................................... 6 Advanced Packaging Tuning ...................................................................... 7 Undo Auto Route ........................................................................................ 7 Side-by-Side Die Stacking.......................................................................... 8 Bond Wire Generator ................................................................................. 8 Meander Enhancements ............................................................................ 9 Hierarchical Matched Groups ..................................................................... 9 Cell Editor Enhanced Placement of Pin Text ............................................ 10 Jumpers ................................................................................................... 11 Copy Trace ............................................................................................... 11 Interactive Plow ........................................................................................ 11 Differential Pair Pad Entries ..................................................................... 12 Differential Pair Fanout ............................................................................ 12 CES ............................................................................................................... 13 Multiple Group Matching .......................................................................... 13 Complex Topology Support for Differential Pairs ..................................... 13 DMS .............................................................................................................. 14 DMS Process Flow ................................................................................... 14 Filtering Generic Padstacks ..................................................................... 15 Improved Part Request Manager ............................................................. 16 DxDesigner ................................................................................................... 18 Cursor Modes ........................................................................................... 18 Dynamic Array Spacing ............................................................................ 18 ‘No Connection’ Pins ................................................................................ 19 Enhanced Tool Tips ................................................................................. 20 IEC62 Value Support in DxDataBook (European format) ......................... 20 Dynamic Links Replace Static Sheet Connectors .................................... 21 User-Defined Rippers ............................................................................... 21 Net and Bus Auto Naming ........................................................................ 22 Navigator Display ..................................................................................... 22 Add Properties Command ........................................................................ 23 Symbol Editor ........................................................................................... 24 Cross Probing Enhancement ................................................................... 24 ECAD/MCAD Collaboration ......................................................................... 25 GUI Changes ........................................................................................... 25 Creation and Manipulation of Route Borders ........................................... 26 Plane Obstruct ......................................................................................... 26 Route Obstruct ......................................................................................... 27 What’s New in EE2007.9 2 3-D Viewer .................................................................................................... 28 New Data Types ....................................................................................... 28 Route Border ................................................................................................... 28 Route Obstructs ....................................................................................... 28 Variant Manager ........................................................................................... 29 Variant Selection ...................................................................................... 29 HyperLynx Analog ....................................................................................... 30 Library Manager ....................................................................................... 30 Simulation Model Properties .................................................................... 30 Spice Model Generator ............................................................................ 31 Boundary Elements .................................................................................. 32 Free Accuparts Library ............................................................................. 32 DxDatabook Entries ................................................................................. 33 System Manufacturing Solutions (SMS) .................................................... 34 Drill Table Enhancements ........................................................................ 34 DFF Enhancements ................................................................................. 35 Advanced Packaging Support .................................................................. 35 ODB++ Output Improvements .................................................................. 36 CCZ Export Control .................................................................................. 37 Variant Data Output ................................................................................. 37 Test Probe Enhancements ....................................................................... 38 What’s New in EE2007.9 3 Expedition Enterprise 2007.9 The Expedition Enterprise version 2007 has had nine update releases containing enhancements and updates, many based directly on customer feedback. There are numerous enhancements in this latest release. They are described in detail in this document. For specific details concerning changes incorporated in releases 2007.1 through 2007.7, please refer to the “What’s New” document for each release. No “What’s New” document was generated for EE 2007.8 as it was bug fixes only. This document is the pre-release version of What’s New in Expedition Enterprise 2007.9. Final contents and features are subject to change. What’s New in EE2007.9 4 General Enhancements to Expedition Library Services Library Services has been enhanced to allow copying Reuse Blocks between Central Libraries and also enables pulling down Physical Reuse Cells into a PCB design. Benefit: Users may now choose the Reuse Cells to update, rather than previously being all or nothing. What’s New in EE2007.9 5 Advanced Topologies Advanced topologies have been enhanced to include support for virtual pins. Now, there is intelligent, automatic virtual pin placement available for complex topologies, incorporating T-shaped and H-shaped tree structures based on design intent, which is defined by the routing branch points. In addition, users have the ability to manually manipulate the virtual pin locations. Further, support for complex differential pair topologies now exists, enabling HyperLynx to graphically define the topologies, and push them in to Expedition and Xtreme PCB. Benefit: Allows use of virtual pins using either automatic or manual control, and provides support to HyperLynx for simulation. What’s New in EE2007.9 6 Any Angle Dual Point Select Support has been added for Any Angle dual-point select, and also Dynamove of trace segments has been enhanced. This is available for both singled-ended and differential- pair traces. Benefit: Users can manually increase the length of nets that have segments routed by Any Angle. What’s New in EE2007.9 7 Advanced Packaging Tuning Tuning now automatically includes the Bond Wire length in its calculations. Benefit: Efficiency is improved because Pin Package lengths no longer have to be defined as a substitute for Bond Wire lengths. Undo Auto Route Previously, if a user ran an Auto Route process in ExpeditionPCB and the results were not what was expected, users had to exit and re-enter the design. Now, users can select “Undo” after and auto routing to revert to the state of the design just prior to running the auto route. Benefit: Users save time by not having to exit and re-enter design. What’s New in EE2007.9 8 Side-by-Side Die Stacking Die stacking has been enhanced to allow side-by-side stacking. Side-by-side stacking can be done anywhere within the stack. The 3D viewer provides real-time feedback to the user, making stacking easy. Benefit: Users can create more flexible stack configurations. Bond Wire Generator Several overall improvements have been made in the bond wire generator. These improvements include:  The wire pattern dialog box now shows die stacks and members more clearly  The board outline is correctly respected when a die is placed inside the board  Speed has been increased by improved 3D DRC handling Benefit: Improved usability and user productivity. What’s New in EE2007.9 9 Meander Enhancements The usability of the Meander commands have been enhanced in EE2007.9. Now included in the dropdown menu is the “Group” item for easy group assignment when adding meanders. A Lock Angle option has been added for meander editing to prevent changing the angle. Also, the Inheritance and Taper control has been enhanced. Benefit: Increased productivity. Hierarchical Matched Groups It can be difficult to setup complex matched groups for today’s bus topologies. This enhancement provides a simplified methodology for defining Hierarchical Matched Groups. These provide native support within CES and ExpeditionPCB. Benefit: Increased productivity. What’s New in EE2007.9 10 Cell Editor Enhanced Placement of Pin Text Pin Text and Property Text fields have been added to the cells in the cell library. The fields can also be modified once in a design. The data that is actually placed in these fields comes from the Pin Text and Property Text values associated with the part. This functionality works much like reference designator and part number information does in previous releases. The reference designator and part number information on the cells simply define the location and text characteristics of the reference designator or part number information. What’s New in EE2007.9 11 Jumpers Previously, the EE flow supported dynamic Jumpers, which have some limitations specific to the graphics that can be used within the cell. With this release, support has been added for static Jumpers that allow users to build a complex graphical jumper definition within the Cell Editor, then have this placed in the design WYSIWYG. Benefit: Improved graphics allow better definition. Copy Trace The Copy Trace functionality has been significantly enhanced to support many more use cases. These new cases include: Copy Trace to end of a new Trace, Define Origin for Copy, Change Base Point as origin for placement during Copy, Automatic Repeat of Pattern, and Automatic cursor jump delta distance. Benefit: Additional use cases now supported. Interactive Plow The Interactive Plow command now supports a key-in “pas ” that allows the user to define a new angle set. This key-in is remembered for the entire session. It allows offset from 0, 45, 90, etc. angles. For example, “pas 12.5” would define 12.5, 32.5, 57.5, 77.5, 102.5, etc. angles to be used during interactive plow when in the “Angle Plow” mode. Benefit: Allows users to pre-set angles to be used for entire session. What’s New in EE2007.9 12 Differential Pair Pad Entries Interactive Plow of DiffPairs or Multiplow of multiple DiffPair sets now have improved pad entries. Benefit: Provides better convergence and symmetry. The example below shows the improvements to DiffPair entries, minimizing the amount of post routing manual cleanup. Differential Pair Fanout Both Interactive and Automatic Fanout features have been enhanced to support improved symmetry for DiffPair Fanouts. Fanout now place the vias at the minimum distance from each other. Benefit: Improves convergence during routing. What’s New in EE2007.9 13 CES Multiple Group Matching Multiple Group Matching provides hierarchical entry using the existing constraint class structure; there is no need for the formula/matched pair name. This function supports DDR memory routing requirements. Benefit: Allows easy hierarchical entry. Complex Topology Support for Differential Pairs CES now supports all of today’s memory differential pair structures. Users can define complex topologies within CES, or they can be created in LineSIM and imported to CES. Benefit: Complex topologies are easier to define. What’s New in EE2007.9 14 DMS DMS Process Flow The process flow class in DMS provides a framework and basic functionality to implement custom user-defined processes. A process is characterized by a number of steps that are activated in parallel or sequential order. Those steps define a custom process flow that can be accessed and completed from another class in DMS.  The process flow class supports multiple process flow objects  The process flow object contains an overview about all steps that are in the associated process flow.  All approvals and rejections are tracked in a history that is accessible via the process flow object.  The user can approve or reject a step. In DMS in the EE2007.9 release, Process Flow is added to Requests Class. There are two tabs that indicate the presence of the process flow. The first tab is the Process Flow tab. It lists all the steps in the flow, the current step that is active and it contains the button used to approve or reject the step. The second tab in a process flow is the Process Tracking tab. This tab lists a history of the process flow of the object. It tells all the status changes of the steps of the process, who performed the status change and when the status change was performed. What’s New in EE2007.9 15 It is possible to customize whole process of creation and approval also with additional logic written in Java. It is also possible to enable Email notification for users about process progress. Filtering Generic Padstacks Production Library definition is extended with Generic Padstack Filter. It supports filtering of vias, fiducials and mounting holes exported by Update Cache to Production Cache. Fiters can be based on search masks or list of elements. What’s New in EE2007.9 16 Improved Part Request Manager Several improvements have been made to the Part Request Module to improve its usability. Firstly the search pages have been updated to incorporate the “Quick Search” methodology to make it easier to search the requests. However for those who would prefer to use the more traditional DMS stile “Search Mask” there is an advanced option available. What’s New in EE2007.9 17 More significantly though it’s now possible to include custom characteristics with a wider set of data types i.e. dates, integers, enumerated lists etc. In addition to improved flexibility of configuration users can also edit and resubmit requests that have been rejected by their librarian making the Part Request Module far more applicable to a real world request process. What’s New in EE2007.9 18 DxDesigner Cursor Modes Introduced in this release is visual feedback of the current mode using the mouse cursor. The cursor presents a different icon, depending on the mode of operation. The visual feedback prevents clicks in Net drawing mode to select a component. The function works for adding blocks, nets, buses, and graphical annotations. Benefit: Eliminates confusion as to which mode is active. Dynamic Array Spacing Introduced in this release is a new Array command that replaces distance-based component array spacing. The new command supports both Rectangular and Diagonal arrays. Component spacing is easily defined by a mouse drag (dynamics mode). Benefit: Easier spacing using the mouse.   What’s New in EE2007.9 19 ‘No Connection’ Pins A new type of termination component has been added to support ‘No Connection’ (N/C) pins. These are defined in Special Components and are attached to the Net. Benefit: Prevents “unconnected pin” warnings in the packager. What’s New in EE2007.9 20 Enhanced Tool Tips Tool tips have been enhanced to contain component properties and bus contents, as illustrated below. IEC62 Value Support in DxDataBook (European format) The DxDataBook now supports European style values for properties (2k2, 2u2 etc). The values are defined in DxDataBook -> Preferences. Benefit: Allows use of European-style values. What’s New in EE2007.9 21 Dynamic Links Replace Static Sheet Connectors Dynamic links have now replaced the static sheet connectors. Links are defined in the Special Components section of the settings, and are connected by Name. Users use the Zoom Fit to Selected objects. Using Alt+Click jumps to the next associated Link. Benefit: Links are dynamic and make navigation simpler. User-Defined Rippers An alternative ripper symbol can now be defined in the Special Components section of the Settings menu. The symbol for the ripper is single pin. The user-defined ripper definition is used by default. Benefit: User can select which ripper symbol is utilized. What’s New in EE2007.9 22 Net and Bus Auto Naming Net and bus auto-naming capability has been added with EE2007.9. Automatic net names are generated based on source or destination component name and pin. Users retain the ability to enable and disable auto-naming from the toolbar. Automatically generated names are always unique. Benefit: Avoids un-named nets and ease