电镀基础知识培训

ELECTROPLATINGTRAINING电镀基础知识培训OUTLINE内容提要INTRODUCTION 介绍ELECTROCHEMISTRY 电化学CLEANING&PREPLATE 清洗及预镀NICKEL镍Copper铜DECORATIVECHROMIUM 装饰铬TESTING 测试FILTRATION 过滤TROUBLESHOOTING 故障处理WHATISELECTROPLATING?什么是电镀？THEDEPOSITIONOFAMETALLICCOATINGUPONANEGATIVELYCHARGEDCATHODEBYTHEPASSINGOFANELECTRICCURRENT 在电流通过时，有金属层沉积在带负电荷的阴极 表 关于同志近三年现实表现材料材料类招标技术评分表图表与交易pdf视力表打印pdf用图表说话 pdf 面.WHATISTHEPURPOSE?电镀的目的是什么？TOOBTAINAMETALLICCOATINGHAVINGCERTAINPROPERTIESSUCHASHARDNESS,BRIGHTNESS,CORROSIONRESISTANCEANDTOREPRODUCEIDENTICALFORMSINELECTROFORMING.是为了得到具有某种特性的金属层，如：硬度、光亮度、耐腐性及在电铸方面复制同样的形状.REQUIREMENTS要求SOURCEOFDIRECTCURRENT 直流电源APLATINGTANK 电镀槽ASOLUTIONCONTAININGTHEDISSOLVEDSALTSOFTHEMETALTOBEPLATED 含有待镀的可溶性金属盐的溶液ANODE (POSITIVEELECTRODE) 阳极（正电极）APREPAREDOBJECT- CATHODE(NEGATIVEELECTRODE) 准备好的待镀工件--阴极（负电极）WHATISDIRECTCURRENT?何为直流电？THEFLOWOFELECTRONSINTHESAMEDIRECTIONBETWEENPOSITIVEANDNEGATIVEELECTRODES 在正负电极之间电子向同样的方向移动.WHATISAPLATINGSOLUTION?电镀液是什么？ACONDUCTINGMEDIUMFORTHEMOVEMENTOFMETALIONSINSOLUTIONBETWEENANANODEANDACATHODE 溶液中在阳极与阴极间金属离子移动的导电介质.WHATISpH?什么是pH值？THEMEASUREMENTOFACIDITYORALKALINITY 用来度量酸碱度的ONASCALEFROM0TO14 pH值的范围处于0-14之间0TO6.9BEINGACIDICAND7.1TO14ALKALINEAND7.0BEINGNEUTRAL. 小于7的为酸性，大于7且小于等于14的为碱性，7.0为中性HOWAREPLATINGSOLUTIONMAINTAINED?如何维护电镀液？CHEMICALANALYSISOFTHECONSTITUENTS 持续的化学 分析 定性数据统计分析pdf销售业绩分析模板建筑结构震害分析销售进度分析表京东商城竞争战略分析 HULLCELLPLATINGTESTS 赫氏槽电镀测试ADDITIONOFCHEMICALS 添加化学品ELIMINATIONOFCONTAMINANTS 去除污染物PERIODICPURIFICATION 定期净化REGULARINSPECTIONOFPARTSFORDEFECTS 缺陷/次品的常规检查PHYSICALTESTING 物理测试WHATISAMETALION?什么是金属离子？AMETALIONISANATOMOFAMETALHAVINGAPOSITIVEELECTRICALCHARGE 金属离子是带正电荷的金属原子(失去电子)WHATARETHESOURCESOFMETALIONS?金属离子来自何处？METALSALTSINPLATINGSOLUTION 电镀液中的金属盐SOLUBLEMETALANODES 可溶性的金属阳极WHATAREANODEBAGS?什么是阳极袋？ANODEBAGSAREPOROUSMEMBRANESPLACEDAROUNDANODESTOCOLLECTSLUDGEFORMINGONTHEDISSOLVINGANODE 阳极袋是包扎在阳极外面,会将电镀过程中产生的阳极泥收集在袋内的多孔的袋。BasicELECTROCHEMISTRY基本的电化学理论ELECTROCHEMISTRY电化学PlatingCell电镀槽Ni++Ni++Cl-Cl-++_Rectifier整流器ANODE阳极CATHODE阴极ANODE阳极CATHODEREACTIONS阴极反应Cathode阴极Reductionofions离子还原反应Drawelectronsfromtheexternalcircuit从外部电路中吸收电子TYPICALREACTION典型的反应Ni+++2e-Ni(metal金属)2H++2e-H24H2O+4e-2H2+4(OH)-ANODEREACTIONS阳极反应Anode阳极Oxidationofmetaltoions金属氧化成阳离子Releaseofelectronstoexternalcircuit将电子释放至外部电路TYPICALREACTION典型的反应NiNi+++2e-4OH-O2+2H2O+4e-2H2OO2+4H++4e-RATEOFCURRENTFLOW电流速率Ohm’sLaw欧姆定律Amperes安培=Volts伏特 Ohms欧姆I电流=E电压 R电阻FARADAY’SLAW法拉第定律Factors要素Amperes安培Time时间EquivalentWeightofMetal金属当量FARADAY’SLAW法拉第定律Oneampereflowingforonesecondrepresentsonecoulomb.Faraday’lawstatesthat96,500coulombs(oneFaraday)willdepositonegramequivalentweightofametal.Equivalentweightistheatomicweightofthemetaldividedbyit’svalence.1安培的电流1秒的时间通过的电量等于1库仑。法拉第定律：1个法拉第即96,500库仑的电量可以沉积1克当量的金属。克当量是金属的原子量除以它的化合价.FARADAY’SLAW法拉第定律weightofmetaldeposited沉积的金属重量96,500CoulombsDepositAt.Wt.=grams96,500库仑的镀层Valence WEIGHTOFNICKELPLATED电镀镍的重量KNOWNFACTORS已知的条件Current电流=50amps安培Time时间=15mins分钟原子量At.Wt.Ni=58.7Valence=化合价,2价CALCULATION计算96,500=45,000X=13.7GRAMS克58.7 xgrams2 CALCULATINGTHICKNESSFROMWEIGHT从重量计算厚度Thickness=WT1um=10-4cmdensityxarea1mil=25.4umEXAMPLE:wt=0.136grams.DensityofNi=8.9Area=4cm2Thickness=0.1368.9x4Answer=1.5milsCURRENTINCELL电镀槽中的电流Anode阳极-e=cathode阴极+eAnode阳极-e=corrosion溶解-e+Oxygen氧-eCathode阴极+e=plating所镀金属+e+hydrogen氢+eTheexchangeofelectronsattheanodeandthecathodeorthetotalflowofcurrentateachelectrodeisalwaysequal.电子在阳极和阴极上交换,在阴阳极上流动的电流总是相等的。DEPOSITIONWITHH2LIBERATION伴随着氢气释放的沉积NETRESULT 最终的结果 CathodeEfficiencyReduced 阴极电流效率的降低pHIncreasedpH值升高Anode阳极Cathode阴极Ni+2Ni+22H+H2PLATINGEFFICIENCYANDTIMEOFPLATING电镀效率和电镀时间%Efficiency效率=ActualNiPlated实际镀的镍X100Theoretical(Faraday’sLaw) 理论的（法拉第定律）FACTORSAFFECTINGPLATINGCURRENT影响电镀电流的因素HydrogenLiberation(cathode) 氢气释放（阴极）OxygenLiberation(anode) 氧气释放（阳极）Polarization 极化ConcentrationPolarization(Diffusion) 浓度极化（扩散）HydrogenOvervoltage 氢过电位POLARIZATION极化E=IRE=Volts伏特(potentialdifference电位差)R=Resistance电阻(resistanceofsolutiontotheflowofcurrent溶液对电流的阻抗)I=Current电流(flowofelectricity电荷的移动)E=CURRENT电流(I)XRESISTANCE电阻(R)Ep=ChangeinpotentialdifferenceduetoPolarizationfromresistance.由于电阻升高造成的极化,极化导致的电位差的改变.POLARIZATION极化EIEpR=EIEP=PolarizationCONCENTRATIONPOLARIZATION浓度极化CONCENTRATIONOFMETALIONSBUILDONTHESURFACEOFTHEANODE 阳极表面的金属离子浓度CONCENTRATIONOFTHEMETALIONSDECREASEATTHESURFACEOFTHECATHODE 阴极表面的金属离子浓度减少CHANGEINANODEANDCATHODEFILMSCAUSESPOLARIZATION 阳极和阴极膜层的改变导致了极化CONCENTRATIONPOLARIZATION浓度极化Ni++IonsANODE阳极CATHODE阴极++++++++++++++++++++++++++EFFECT影响Agitation打气Temperature温度HYDROGENOVERVOLTAGE氢过电位POLARIZATIONDUETOEVOLUTIONOFHYDROGENUPONASPECIFIEDELECTRODESURFACEORTHEEXCESSPOTENTIALABOVETHEEQUILIBRIUMPOTENTIALREQUIREDTOEVOLVEHYDROGENATTHECURRENTDENSITYSPECIFIED. 在指定的电极表面上氢气的形成而引起的极化或在某一电流密度下氢的形成所要求的超出平衡电位后的电位.HYDROGENOVERVOLTAGE氢过电压FACTORS要素TYPEOFMETAL 金属的种类SURFACEROUGHNESS 表面的粗糙度TYPEOFSOLUTION 溶液的类型CURRENTDENSITY 电流密度TEMPERATURE 温度HYDROGENOVERVOLTAGE氢过电位(1ma/cm2)ZnSnCdCuNiAgAuCPt-0.80-0.80-0.80-0.60-0.40-0.30-0.15-0.110.00ELECTROMOTIVESERIES电势序列VoltsAl3+ -1.66Zn2+-0.76Cr3+ -0.74Fe2+ -0.44Cd2+-0.40Co2+ -0.29Ni2+-0.25Sn2+-0.14Pb2+-0.13 VoltsH1+0.00Sb3+ +0.10Bi3++0.20Cu2++0.34Cu1++0.52Rh3+ +0.80Ag1++0.80Pt2++1.20Au1++1.68ANYQUESTIONS?有问题吗？ CLEANING&PREPLATE清洗与预镀PURPOSEFORCLEANING清洗的目的TOPROVIDEADHESIONONTHESUBSEQUENTDEPOSITS 保障后续的镀层的结合力.TOOBTAINAHIGHQUALITYFINISHDEPOSIT 得到高品质的完美镀层TOOBTAINTHEDESIREDPROPERTIESOFTHEDEPOSITS 镀层具有期望的各种特性.EFFECTSOFIMPROPERCLEANING不正确清洗的影响POORBONDINGTOBASEMETAL 与基体(素材)金属间差的结合力PEELINGOFDEPOSIT 镀层的起皮SKIPPLATE 漏镀MICROROUGHNESS 微观粗糙PITTING 起泡POORCORROSIONRESISTANCE 差的耐腐性CONTAMINATEDBATHS 污染镀液PRECLEANINGOPTIONS预清洗的选择MECHANICALCLEANING机械清洗 WETORDRYBLASTING干法喷砂/丸SOLVENTCLEANING溶剂清洗 DEGREASING,EMULSION,DIPHASE脱脂、乳化、固液相分离.ALKALINECLEANING碱洗 SPRAY,SOAK,ELECTRO,ULTRASONIC喷射、浸泡、电解、超声波ACIDCLEANING酸洗 SOAK,ELECTRO浸泡、电解HOWCLEANERSWORK清洗剂如何工作DISPERSION 分散 SAPONIFICATION 皂化 EMULSIFICATION 乳化DISPERSION分散DISPERSIONISAMETHODWHEREBYSOLIDPARTICLESAREBROKENDOWNTOSMALLPARTICLESBYTHEACTIONOFSURFACTANTSANDOTHERCOMPONENTSINACLEANER.THEPRINCIPLEISEFFECTIVEFORRESIDUELEFTFROMPOLISHINGOPERATIONS 分散是一种方法，固体的微粒通过表面活化剂和清洗剂中其它组分的作用分散成小的微粒。这个原则对抛光时留下的残余物的清洗是有效的。HOWCLEANERSWORK清洁剂如何工作DISPERSION分散DIRT污垢COATEDWITHSURFACTANT覆盖了表面活性剂HOWCLEANERSWORK清洗剂如何工作DISPERSION 分散 SAPONIFICATION 皂化 EMULSIFICATION 乳化SAPONIFICATION皂化SAPONIFICATIONISTHECHEMICALACTIONBYWHICHFATTYACID,FATTYOILOROTHERREACTABLESOILISCONVERTEDTOAWATERSOLUBLECOMPOUND,SOAP.ELEVATEDTEMPERATURES,CONCENTRATION,ANDpHPROMOTESTHESPEEDANDCOMPLETIONOFTHEREACTION 皂化是将脂肪酸/脂肪油或其它可反应的污物转化成水溶性的混合物(肥皂)。提高温度、浓度和pH值都会促进反应的速度和反应的完成。HOWCLEANERSWORK清洗剂如何工作SAPONIFICATION皂化VEGETABLEOILS植物油SOLUBLEALKALISOAPS可溶性的碱性肥皂HOWCLEANERSWORK清洗剂如何工作DISPERSION 分散 SAPONIFICATION 皂化 EMULSIFICATION 乳化EMULSIFICATION乳化EMULSIFICATIONISACHEMICALPROCESSBYWHICHSURFACTANTSPENETRATEOILSANDSOILSANDBREAKTHEMDOWNTOTINYWATERSOLUBLEGLOBULESDISPERSEDANDSUSPENDEDINSOLUTION 乳化是一种化学过程，表面活性剂渗透油和污物，将它们在溶液中分散成微小的分散性的水溶性水珠和悬浮液.HOWCLEANERSWORK清洗剂如何工作EMULSIFICATION乳化MINERALOIL矿物油COATEDWITHEMULSIFIERS覆盖了乳化剂TYPEOFCLEANING清洗的种类SOLVENTDEGREASING 溶剂脱脂ALKALINECLEANING 碱洗 SPRAYCLEANING 喷射清洁洗 ACIDPICKLING 浸酸TYPEOFCLEANING清洗的种类SOLVENTCLEANING溶剂脱脂MIXTURESOFSUITABLESOLVENTSANDSURFACTANTS. 适合的溶剂和表面活性剂的混合 USEDINVAPORDEGREASING. 在蒸汽除油时使用 MINIMALUSEDUETOHEALTHANDENVIRONMENTALCONCERNS. 由于健康和环境方面的考虑尽量少使用ALKALINECLEANERS碱洗 THREEMAJORCOMPONENTS三种主要成份BUILDERS-SODIUMHYDROXIDE氢氧化钠or 主体 POTASSIUMHYDROXIDE氢氧化钾 SILICATES硅酸盐 CARBONATES碳酸盐 CONDENSEDPHOSPHATES浓缩磷酸盐ADDITIVES-CHELATINGAGENTSTOCOUNTERACTEFFECTSOFHARDWATERANDMETALIONS. 添加剂-螯合物可以消除硬水和金属离子的影响.SURFACTANTS-DISPLACEANDDISPERSESOIL.LOWERSURFACETENSIONOFCLEANERATMETALSURFACEFORUNIFORMCOVERAGE. 表面活性剂-置换和分散污物，降低金属表面上清洗剂的表面张力,让金属表面被清洗液完全覆盖.TYPESOFALKALINECLEANERS碱洗的类型SOAK浸泡HIGHINFINITYFOROILSANDGREASESDUETOHIGHSURFACTANTCONTENT高的表面活性剂的含量可除去大量的油脂DESIGNEDFORSPECIFICCLEANING 为某些清洗而设计.SPRAY喷射MECHANICALIMPINGEMENTANDCHEMICALCLEANING 机械冲击与化学冲洗LOWFOAMING 低泡ALKALINECLEANERS碱洗SOAK/ELECTRO 浸泡/电镀 CONC.-15-90g/l TEMP.-50-82°C TIME-1-10min. SPRAY 喷射 CONC.-2-15g/l TEMP.-43-66°C TIME-15-60sec. TYPESOFALKALINECLEANING碱洗的类型CATHODIC–ELECTRO阴极电镀 -GREATESTGASEVOLUTION产生大量的气体 -REDUCESOXIDE减少氧化 -DEPOSITSSMUT脏物会沉积到阴极上.ANODIC-ELECTRO阳极电镀-REMOVESSMUT移走污物 -TOLERANCETOMETALIMPURITIES 容忍金属杂质 -FORMSOXIDEFILM形成氧化膜TYPESOFALKALINECLEANING碱洗的类型ULTRASONIC–SOAK超声波-浸泡ENERGYFROMSOUNDWAVESBEYONDTHEAUDIBLERANGEBREAKSDOWNDIRTPARTICLESDUETOFREQUENCYTHATRANGEOF15TO40kHz. 由于频率在15-40KHz之间，超出听力范围的声波的能量将污物微粒分解ALKALINECLEANING碱洗 CATHODICELECTROCLEANING阴极电除油HYDROGENLIBERATEDATTHECATHODE.THEVOLUMEOFTHEHYDROGENISTWICETHATOFOXYGENGENERATEDATTHEANODE. 阴极释放出氢气，氢气量是阳极释放的氧气量的两倍.ACTIVATESSURFACE. 活化表面.CERTAINOXIDEFILMSAREREDUCED. 某些氧化膜被还原.ADISADVANTAGEISTHATMETALLICIONSCANDEPOSITONTHEWORKASALOOSEADHERENTSMUT. 缺点是金属离子会以疏松的污物形式沉积在工件表面.ALKALINECLEANING碱洗ANODICELECTROCLEANING阳极电解除油OXYGENLIBERATEDATTHEANODE.THISTYPEOFCLEANINGWILLREMOVESMUT. 阳极释放出氧气，这种形式的清洗能除去污垢.METALLICCONTAMINATESWILLNOTDEPOSITONWORK. 金属污染物不会沉积在工件表面.FORMSOXIDES 产生氧化膜PASSIVATESSURFACE 钝化表面.ELECTROCLEANINGREACTIONS电解除油反应ANODEREACTION阳极反应 4(OH)--4e2H2O+O2CATHODEREACTION阴极反应4H2O+4e4(OH)-+2H2ALKALINECLEANING碱洗 ULTRASONIC超声波ULTRASONICGENERATORSAREUSEDTOCREATESOUNDWAVESWHICHINTURNARECONVERTEDWITHINTHESOLUTIONTOMECHANICALENERGY. 超声波发生器被用来产生声波，它在溶液中会被转化成机械能.ULTRASONICENERGYALTERNATELYCOMPRESSESANDEXPANDSTHESOLUTIONWHICHPRODUCESSEVERALCONCURRENTEFFECTS. 超生波可选择性地压缩和膨胀液体，使之产生几种同步效应CAVITATIONDUETOFREQUENCYASSISTSTHEPHYSICALREMOVALOFSOILS. 由于高频率导致的气穴现象导致污物被物理方法去除.ALKALINECLEANING碱洗 SPRAYCLEANING喷射清洁SOLUTIONISUSUALLYMILDLYALKALINEDEPENDINGUPONTHEBASEMETAL. 根据基材的不同，溶液常常含有微碱性。ACCOMPLISHEDBYPUMPINGTHECLEANINGSOLUTIONTHROUGHASERIESOFPIPESANDJETS. 通过一系列的管和喷射装置，通常由泵来输送清洗剂.ACTIONOFPHYSICALIMPACTANDCHEMICALACTIONREMOVESDUST,METALFINES,CARBONSMUTANDOTHERRESIDUES. 物理的冲击作用和化学反应去除了灰尘、金属微尘、碳化物和其它的残留物。TYPEOFCLEANING清洗的类型 ACIDPICKLING过酸WHYDOWEPICKLE?为什么要用酸浸泡？TOREMOVEOXIDESFROMTHESURFACEOFTHEMETALTOOBTAINGOODBONDINGOFTHESUBSEQUENTDEPOSIT. 去除金属表面的氧化膜，使后来的金属镀层得到好的结合力。NEUTRALIZEANYRESIDUALALKALINEFILMLEFTONTHESURFACE. 中和残留在表面的碱性膜。ACIDPICKLING过酸去氧化膜CHEMISTRYOFPICKLING过酸的化学反应ACID酸+BASE基材H2O水+SALT盐 SulfuricAcid+CausticSodaWater+SodiumSulfate 硫酸 氢氧化钠 水 硫酸钠ACID酸+METAL金属H2氢气+SALT盐 SulfuricAcid+SteelHydrogen+FerrousSulfate 硫酸 不锈钢 氢气 硫酸亚铁ACID酸+METALLICOXIDE金属氧化物H2O水+SALT盐SulfuricAcid+CopperOxideWater+CopperSulfate 硫酸 氧化铜 水 硫酸铜ACIDPICKLING酸浸泡 METALS 金属 CHEMICALS过酸使用的化学品STEEL H2SO4orHCl 不锈钢 ACIDSALTS(NH4HF)酸性盐 COPPER& H2SO4orHCl CuALLOYS ORGANICACIDS有机酸 铜及铜合金 ACIDFORMINGSALTS酸盐 ALUMINUM H2SO4,H3PO4,HNO3orHF 铝 ZINC&ALLOYS ACIDFORMINGSALTS酸盐 锌及锌合金SOAKCLEANERTYPE热浸清洗剂的类型NONETCHING 不发生浸蚀的BUFFINGCOMPOUNDREMOVAL 除腊水USEDASULTRASONICCLEANER 超声波清洗用清洗剂LIGHTDIRTANDSOILREMOVAL 轻微脏物和污物去除剂CLEANING&PICKLING清洗与过酸活化SUMMARY总结PRE-CLEANING-VERYIMPORTANT. 预清洗—非常重要SELECTIONOFPRE-CLEANINGCYCLEISDEPENDENTONNATUREOFSOIL&BASEMETAL. 预清洗 流程 快递问题件怎么处理流程河南自建厂房流程下载关于规范招聘需求审批流程制作流程表下载邮件下载流程设计 的选择根据污染物和基材的特性而定ELECTRO-CLEANINGISESSENTIALINPRODUCINGHIGHQUALITYMETALDEPOSITS. 要获得高品质的金属镀层，电解清洗是必需的THOROUGHRINSINGAFTEREVERYCLEANINGANDPICKLINGSOLUTIONISIMPORTANTINPRODUCTIONOFHIGHQUALITYDEPOSITS. 在高品质电镀的生产中，每一个除油和过酸步骤后的彻底漂洗是非常重要的CLEANEDANDRINSEDPARTSAREPICKLEDTOREMOVEOXIDESANDACTIVATETHESURFACEOFTHEBASEMETAL. 彻底除油并水洗后的工件过酸是为了除去氧化物和活化基材的表面.BRIGHTACIDCOPPERPLATING光亮酸铜电镀 BRIGHTACIDCOPPERPLATING光亮酸铜电镀APPLICATIONS应用DECORATIVEINTERMEDIATECOATING 装饰的中间层 Steel 不锈钢 ZincDieCasting锌压铸Brass 黄铜Plastics塑料Aluminum铝INDUSTRIALCOATING 工业用的镀层 Electroforming电成型Electrotyping电铸Rotogravure印刷用滚筒Electroclading电镀金属包层Stop-OffinCasehardening中转镀层ACIDCOPPERPROCESSFEATURES酸铜流程特点BRIGHT光亮GOODLEVELING好的填平DUCTILE延展性好STRESSFREE无应力FINEGRAINDEPOSITS镀层结晶细致EASYTOCONTROL容易控制FASTPLATING快速电镀EASILYBUFFED容易抛光GOODELONGATION好的延展性GOODMICROTHROW好的微观均镀性MACHINEABLE好的机械加工性能GOODELECTRICALCONDUCTIVITY好的电导性WhyAcidCopper?为什么用酸铜ProvidesLevelingofPolishing/BuffingScratches抛/磨光后提供好的填平效果MirrorSmoothSurface180GritScratchesLEVELING填平MACROTHROW宏观上的均镀THEABILITYTODEPOSITMETALRELATIVELYUNIFORMLYOVERABROADCURRENTDENSITYRANGE在一个宽的电流密度范围内相对地镀层均匀分布的能力MICROTHROW微观上的均镀THEABILITYTODEPOSITMETALINGROOVES,PORES,CRACKSANDSURFACEIMPERFECTIONSOFMICROSCOPICNATURE在凹槽、小孔、裂纹和其他表面微观缺陷上沉积镀层的能力.WhyAcidCopper?为何用酸铜？ProvidesLevelingofScratches将砂痕印填平DgTgTsGoodLevelingMicrothrow好的填平及微观均镀Poor/NoLeveling差/无填平%Leveling=Tg-Tsx100DgWhyAcidCopper?为何用酸铜ProvidesABright,EasytoBuffSurfaceforCoverageofVeryMinorBlemishesinCastings,AluminumorPlastic 提供一个光亮的、电镀后容易抛光覆盖压铸件,铝材或塑料表面的微小缺陷的镀层.BrightSurfaceThatRequiresLittle/NoBuffing 少/不要求抛光的光亮表面.LongTermProtectionAgainstCorrosion长期耐蚀MicroscopicSectionOfAPorousCasting.PlatingHasBridgedSurfacePores多孔压铸件的横截面图，电镀镀层覆盖了表面的微孔.SpotsSurfacePores表面微孔TYPICALBATHFORMULATION传统的槽液配方及条件CopperSulfate硫酸铜SulfuricAcid硫酸Chloride氯离子UltraAgents添加剂Temperature温度AnodeCurrentDensity 阳极电流密度CathodeCurrentDensity阴极电流密度20-32oz/gal(150-240g/l)6-12oz/gal(45-90g/l)20-120ppm(mg/l)AsRecommended72-90°F(22-32°C)15-30AS (1.5-3.0A/dm2) 20-80A/Ft2 (2.0-8.0A/dm2)BATHCHEMISTRY槽液化学物CuSO4Cu++ +SO4= CathodeAnode 阴极 阳极H2SO42H+ + SO4= Cathode Anode 阴极 阳极HCl H+ + Cl- Cathode AnodeAcidCopperPlate酸铜电镀KeyIngredients关键成份:CopperSulfate硫酸铜 180-225g/LSulfuricAcid硫酸 45-90g/LAcidCopperPlate酸铜电镀OtherIngredients其它成份:Chloride氯化物 80-120mg/LUltramu开缸剂 8-10ml/LUltraA添加剂 0.3-0.5ml/LUltraB添加剂 0.3-0.5ml/LCOPPERSULFATE硫酸铜HIGHCONC.高浓度 LOSSOF BRIGHTNESSANDLEVELING光亮度和填平性能的减少,并且阳极易结晶、钝化>240g/lLOWCONC.低浓度 LOSSINLEVELINGANDBATHCONDUCTIVITY槽液导电性和填平性能的减少<113g/lFunctionofIngredients各成份的功能At113g\LAt285g/LLowcoppercontentcancausereducedleveling,slowdeposition,andanarrowcurrentdensityrange 铜含量低将减少填平性能、沉积慢和电流密度范围窄.Concentrations<150g/Lcoppersulfatecanreducebrightnessandleveling 硫酸铜的含量小于150g/L会减少光亮度和填平性能Concentrations>248g/Lcoppersulfatemayproducecrystalsontankwalls,andanodebags,yieldingroughdeposits,andpooranodecorrosion. 硫酸大于248g/L会在槽壁中、阳极袋中产生结晶,引起粗糙的沉积和阳极溶解不好.LowCopperSulfate低硫酸铜TheHullCellindicatesthatat113g/LCopperSulfateadepositthatisburnedatveryhighcurrentdensitiesisproduced.赫氏槽实验显示113g/L浓度下的硫酸铜液中沉积的金属在高电流密度下出现烧焦的情况SULFURICACID硫酸GRAINREFINEMENT 晶粒细化SOLUTIONCONDUCTIVITY 溶液导电REDUCESANODEPOLARIZATION 减少阳极极化IMPROVESTHROWINGPOWER 提高均镀能力SULFURICACID硫酸HIGHCONC.高浓度INCREASEDANODECORROSION 增加阳极溶解INCREASEINCOPPERCONTENT 铜含量增加LOWCONC.低浓度HCDBURNING 高电流密度烧焦NODULATION 结瘤POORLEVELING填平差DULLNESS 颜色暗FunctionofIngredients各成份的作用Concentrations>180g/LSulfuricAcid=highcurrentdensityareaburningandanodepassivation. 浓度大于180g/L的硫酸会使高电流密度区烧焦，并使阳极钝化。Concentrations<60g/LSulfuricAcid=highplatingvoltagesandslowplatingspeed. 浓度小于60g/L的硫酸会导致高的电镀电压和低沉积速度。<23g/L180g/LLowSulfuricAcid低硫酸SmallLossofBrightnessLow(37g/L)SulfuricAcidSmallLossofBrightness光亮度稍有降低HighSulfuricAcid高硫酸High(110g/L)SulfuricAcidSmallLossofBrightnessCHLORIDES氯化物40to100mg/LIMPROVESBRIGHTNESS 提高光亮度IMPROVESLEVELING 提高填平IMPROVESANODECORROSION 改善阳极溶解CHLORIDES氯化物HIGHCONC.高浓度LOSSOFLEVELINGANDBRIGHTNESSLEVELING>120ppm 光亮度及填平度降低STRIATION 起条纹NODULATION 起块LOWCONC.低浓度DULLNESSINHCDAREA 高电流密度区颜色发暗POORLEVELING 填平差POORANODECORROSION 阳极溶解差TheChlorideHelpsAnodesDissolveAndWorksWithBrightenerForFullBrightnessAndLeveling氯化物帮助阳极溶解，并与光亮剂配合以增加光亮度和填平效果EffectofChlorideConcentration氯化物浓度的影响0ppm50ppm375ppmEffectofChlorideConcentration氯化物浓度的影响HullCellPlatedWithChlorideat150ppm氯化物含量为150ppm的赫氏槽电镀片DullAtHighCurrentDensity高密度区颜色暗EffectofChlorideConcentration氯化物浓度的影响Low(15ppm)Chloride低氯离子浓度(15ppm）Streaky“Rippled”Deposit条纹状的“波纹”沉积ChloridevsAnodeAppearance氯化物与阳极外观NormalAnodeAppearance正常的阳极外观HullCellAnode赫氏槽阳极WhiteFilm=HighChloride白膜=高氯离子Additives添加剂PanelPlatedInSolutionWithNoAdditives没有使用添加剂的电镀试片EK-CEK-BMELEKTRAIIIAdditives添加剂PanelPlatedInSolutionWithNoAdditivesAdd.1Add.2Additives添加剂HullCellPanelWithHighCurrentDensityBurn高电流密度烧焦的赫氏槽片Additives添加剂PanelPlatedInSolutionWithNoAdditivesAdd.1Add.2添加剂1 添加剂2Additive添加剂HullCellPlated,WithAdd.1@1.0%,Add2@0.25%赫氏槽电镀，1.0%的添加剂1，0.25%的添加剂2Additives添加剂PanelPlatedInSolutionWithNoAdditivesAdd.1Add.2添加剂1 添加剂2Additive添加剂LowAdd.2Concentration(0.1%/Volume)添加剂2低浓度（0.1%，体积百分比）Additives添加剂Add.1Add.2添加剂1 添加剂2Additive添加剂HighAdd.2(1.0%/Volume)添加剂2高浓度（1.0%，体积百分比）Dull&Lumpy暗且粗糙Additives添加剂Add.1Add.2添加剂1 添加剂2Additive添加剂PanelPlatedinSolutionWithAdd.1At1.5%/Volume溶液中含1.5%（体积百分比）的添加剂1的电镀片SmallLossofBrightness光亮度稍有降低CONTAMINANTS杂质IRON 铁ZINC 锌CHROMIUM 铬 ALUMINUM 铝ORGANICS 有机物WETTINGAGENTS 润湿剂 IMPROPERFILTERMEDIA 不适当的过滤杂质NICKEL 镍CONTAMINANTS杂质IRON 铁 HIGHTOLERANCEUPTO2.3g/l 高容忍度，可高达2.3g/lDECREASESPLATINGSPEED 降低电镀速度REDUCESCOPPERSULPHATESOLUBILITY 减少硫酸铜的可溶性 BUILDSCOPPERSULPHATEINBATH 在槽液中置换硫酸铜 CONTAMINANTS杂质ZINC锌 HIGHTOLERANCE UPTO2.3g/l 高容忍度，可高达2.3g/l REDUCESCHLORIDES 氯化物减少 REDUCESCOPPERSULPHATESOLUBILITY 降低了硫酸铜的可溶性CONTAMINANTS杂质NICKEL镍 HIGHTOLERANCE UPTO2.3g/l 高容忍度，可高达2.3g/l REDUCESCOPPERSULPHATESOLUBILITY 降低了硫酸铜的可溶性 CONTAMINANTS杂质CHROMIUMCr6+ OVER100PPM 六价铬 超过100PPM OXIDIZESBRIGHTENERS 氧化光亮剂 BURNING 烧焦SKIPPLATING 漏镀 STRIATIONS 条纹POORADHESION 结合力差 CONTAMINANTS杂质FILTERMEDIA-IMPROPER过滤介质–不适当的 L.C.D.DULLNESS 低密度区发暗ROUGHNESS,SPECKLING 粗糙/毛刺、麻点USEDIATOMACEOUSEARTH -ONLY 使用硅藻土–只能使用它 InorganicImpurities无机杂质GoodTolerance好的容忍度Atconcentrations>1000mg/L,ironandnickelmayreducetheelectrolyteconductivityandthrowingpower浓度大于1000mg/L时，铁和镍会减少电解液的导电性和均镀能力HullCellPanelPlatedInAcidCopperContaining1,000ppmZinc含1000ppm锌的酸铜液中镀出来的赫氏片OrganicImpurities有机杂质Canproducedullappearanceinlowcurrentdensityareas在低密度区会产生暗的外观Sources来源:Tanklinings缸的内衬,Rowmaterial原材料,PlasticMandrels塑料填充物,BrightenerBreakdownProducts光亮剂的分解物Treatment处理:ActivatedCarbonremovesorganics 活性碳Insomecasesahydrogenperoxidetreatmentmayalsoberequired. 双氧水CONTAMINANTS杂质ORGANIC有机物 PITTING针孔DULLNESS 发暗COARSEGRAINEDDEPOSIT镀层结晶粗糙BURNING 烧焦STRIATION 条纹LOSSOFLEVELING填平差OrganicImpurities有机杂质CarbonTreatment碳处理MoveSolutionToSeparateTreatmentTank 把溶液移入独立的处理槽Add3-12g/LActivatedCarbon 加3-12g/L的活性碳AgitateThoroughly 充分搅拌AllowToSettle2hours(butnottoolong,8hoursmax.) 静置2小时（不要太长，最多8小时）TransferToSecondTreatmentTank,TestForPresenceofCarbon 转入第二个槽，测试是否还含有碳粉.IfCarbonFree,TransferBackToPlatingTank 如果没有碳粉了，则泵回原来的电镀槽.OxidationTreatments氧化处理HydrogenPeroxide双氧水OxidizeComplexOrganics氧化复杂的有机物1mL/L(35%H2O2)Dilute50%BeforeAdding添加前稀释50%PotassiumPermanganate高锰酸钾AmountRequiredVaries需要的加入量是变化的;DeterminewithHullCell用赫氏槽方法 决定 郑伟家庭教育讲座全集个人独资股东决定成立安全领导小组关于成立临时党支部关于注销分公司决定 ;ActualCurrentDensityDependsOnTheDistanceBetweenASpotOnThePartAndTheAnode真实的电流密度决定于工件上A点和阳极间的距离.CathodeCurrentDensity(CCD)阴极电流密度CathodeCurrentDensity(CCD)阴极电流密度HighCurrentDensityArea高电流密度区MediumCurrentDensityArea中电流密度区LowCurrentDensityArea低电流密度区AverageCCD=AmperesofCurrentAreainSquareFeet平均的阴极电流密度=平方英尺面积的安培数PlatingThicknessCalculation镀层的厚度计算Thickness(mils)=A/ft2xHours厚度(密尔)17.8Ifamps/ft2=15,andplatingtimeis20minutes(0.33hours),thenthethicknesswillbe:如果安培/平方英尺=15，电镀时间为20分钟（0.33小时），则厚度为：Thickness(mils)=15x0.33=0.28mils厚度17.8(0.00028〞)PlatingTimeCalculation电镀时间的计算CalculatingPlatingTime计算电镀时间:Ifwewant20uofthickness,platingat3A/dm2:如果我们想得到20u的厚度,在3A/dm2下电镀：Thickness(u)=A/dm2xminx0.2厚度20u=3A/dm2x33.3minx0.2AgitationLevel搅拌程度MediumAgitation中搅拌LowAgitation低搅拌AgitationLevel搅拌程度PanelPlatedWithNoAgitation无搅拌的电镀片AnodesforAcidCopperPlating用于酸铜电镀的阳极Phosphorized磷铜(0.02-0.06%P)rolledcopperanodesorphosphorizedslugs含P0.02-0.06%的磷铜球/块COPPERANODES铜阳极ANODESWITH0.02-0.065%P 含0.02–0.065%磷的磷铜阳极ROUGHNESS 毛刺 HIGHBRIGHTENERCONSUMPTION 光亮剂消耗量大 POORLEVELING 填平差POORANODECORROSION 阳极溶解不好COPPERANODES铜阳极ANODEBASKETS阳极篮Anodesbasketsshouldbe3-5inchesshorterthanthelongestrackbeingplated.阳极钛篮应该比最长的电镀挂具短3-5英寸.PartiallyFilledTitaniumAnodeBasket没有装满磷铜的阳极钛篮.ANODEBAGS阳极袋BagTheAnodesUsingDynelOrNappedPolypropyleneBags(8oz/yd2).使用代纳尔合成纤维或聚丙烯材料做阳极袋.LooseFitIsBest!稍松的填装最好！TopsofBagsNeedToBeABOVELiquidLevel!阳极袋的封口须高于液面！ANYQUESTIONS?有问题吗？NICKELPLATING镀镍HISTORYOFNICKELPLATING电镀镍的历史1840-JosephShoreappliedforfirstpatent1840年,JosephShore申请了第一个专利.1842-Bottger-usednickelammoniumsalt．1842年，Bottger使用了胺盐镍．1849-Roseleur-goodnickeldeposit　1849年，Roseleur得到了良好的镍镀层．1869-Adams-US.patent-93,157withammoniumsalts　1869年，Adams申请了胺盐镀镍的专利．（美国专利号：93,157）HISTORYOFNICKELPLATING镀镍的历史1878-Weston-U.S.patent-211,071usingboricacid申请了硼酸镀镍的专利（美国专利211,071）19