美国印制电路协会IPC标准清单（2013-06-05更新）

美国印制电路协会IPC 标准 excel标准偏差excel标准偏差函数exl标准差函数国标检验抽样标准表免费下载红头文件格式标准下载 清单（2013-06-05更新） 美国印制电路协会IPC标准链接 序标准编号 标准名称 备注 号 1. IPC标准目录 电子组装(IPC)标准目录 IPC标准清单 日文清单 2. IPC-Publication Catalog-Chinese 3. IPC Specification Tree 4. IPC2010-2011版 标准目录 5. IPC Serving the Printed Circuit Board and Electronics Assembly Industries An Overview 6. IPC-002B:1998 元件引线、引出端、接线片、端子和导线的 可焊性试验 7. IPC-003A:2003 印制板的可焊性试验 8. IPC-004A:2004 焊剂要求 9. IPC-005A:1996 焊膏要求 10. IPC-013:1996 球栅阵列和其它高密度技术的实施 11. IPC-020C:2004 非气密的固态 表 关于同志近三年现实表现材料材料类招标技术评分表图表与交易pdf视力表打印pdf用图表说话 pdf 面安装器件的潮湿/回流敏联合工业标准 感等级 12. IPC-032:2002 球栅阵列球的特性 13. IPC-033B:2002 对潮湿、回流敏感的表面安装器件的搬运、 包装、运输和使用 14. IPC-60A:1999 锡焊后的溶剂清洗手册 15. IPC-62A:1996 锡焊后的水溶剂清洗手册 16. IPC-65A:1999 印制板及其组件清洗导则 17. IPC-645:1993 目测检验 18. IPC-770E:2004 印制板元件安装导则 19. IPC 1066-2005 Marking, Symbols and Labels for IPC 1066-2004 Identification of Lead-Free and Other IPC-1066-2004(中 Reportable Materials in Lead-Free 文版) Assemblied,Componenta and Devices 无铅组装 零件和设备的无铅验证标记 符号和标签和其它提报的材料 20. IPC-1331-2000 Voluntary Safety Standard for Electrically Heated Process Equipment 21. IPC-1710A-2004 OEM Standard for Printed Board Manufacturers' Qualification Profile 22. IPC-1720A-2004 Assembly Qualification Profile 组装评定提要 23. IPC-1730A-2000 Laminator Qualifier Profile 24. IPC-1731-2000 Strategic Raw Materials Supplier Qualification Profile (SRMSQP) .doc 25. IPC-1751A-2010 声明流程管理的通用要求 26. IPC-1752A Errata-Language. 27. IPC-1758-2012 运输、包装、包装材料的声明要求 28. IPC-2141A-2004 Design Guide for High-Speed Controlled Impedance Circuit Boards 阻抗受控高速电路板设计 指南 验证指南下载验证指南下载验证指南下载星度指南下载审查指南PDF 29. IPC-2141A Errata (These corrections should be made in user’s hard copies in accordance with the company’s documented control program) 30. IPC-2221-1998 Generic Standard on Printed Board Design 31. IPC-2222A-2007Sectional Design Standard for Rigid IPC-2222-1998 (2nd Working Organic Printed Boards Draft) 刚性有机印制板设计分标准 32. IPC-2223B-2007 Sectional Design Standard for Flexible IPC-2223-1998 Printed Boards 挠性印制板设计分标准 33. IPC-2226:2003 高密度印制板组件设计导则 高密度互连(HDI)印制板设计分标准 34. IPC-2251-2001 Design Guide for Electronic Packaging Utilizing High-speed Techniques 高速电子电路封装的设计指南 35. IPC-2252-2002 射频-微波电路板设计指南 (中英文版) 36. IPC-2315:2000 高密度互连和微孔设计导则 37. IPC-2501-2003 Definition for Web-Based Exchange of XML Data (Message Broker 38. IPC-2524-1999 PWB Fabrication Data Quality Rating System. 39. IPC-2581-2007 Generic Requirements for Printed Board (with A1) Assembly Products Manufacturing Description Data and Transfer Methodology IPC-2581-2007 制造描述数据和转换方法的印制板装配产 (with Amend.1) 品的一般要求 40. IPC-2615:2000 印制板尺寸和公差 41. IPC-4101A:2002 刚性和多层印制板基材规范 42. IPC-4101B -2007 Specification for Base Materials for Rigid Amend.1 and Multilayer Printed Boards 43. IPC-4103A-2013 Specification for Base Materials for High Errata(2013-03) Speed/High Frequency Applications 44. IPC-4204-2008 Adhesive-Coated Dielectric Films for Use as Cover Matereial and Bonding Material for Flexible Printed Circuitry 45. IPC-4412A Specification for Finished Fabric Woven Amends 1、2、3from ‘E’Glass for Printed Boards .pdf (2010-12) 46. IPC-4552-2002 印制线路板化学镍金镀覆规范 47. IPC-4552 印制线路板化学镍金镀层规范 Am.1(2012-06) 48. IPC-4552 印制线路板化学镍金镀层规范 Amend.2(2012-09) 49. IPC-4553-2005 Specification for Immersion Silver Plating 1998版 for Printed Circuit Boards 50. IPC-4554-2005 Specification for Immersion Tin Plating for Printed Circuit Boards 51. IPC-4554 PCB浸锡镀层规范 Amend.1 52. IPC-4562-2000 印制电路用金属箔(中文) 53. IPC-4562A Metal Foil for Printed Board Applications Amendment 1 (2013-02) 54. IPC-4563-2007 Guideline for Resin Coated Copper Foil for Printed Boards 55. IPC-4821 Specification for Embedded Passive Amendment 1 Device Capacitor Materials for Rigid and (2010-04) Multilayer Printed Boards Generic Performance Specification for 56. IPC-6011-1996 Printed Boards 印制板通用性能规范 57. IPC-6012B 刚性印制板的鉴定及性能规范 Amendment 2 (April 2008) 58. IPC-6012C-2010 Qualification and Performance Specification 59. IPC-6012C 刚性印制板的鉴定及性能规范 6012A:2000 -2010(CN) 中文版 IPC-6012C-2010 (中文版) 60. IPC-6013A-2002 Qualification and Performance IPC-6013A中文版 IPC-6013A:2003 Specification for Flexible Printed Boards Amendment 绕性印制版质量要求与性能规范 1:2005 61. IPC-6013Amend.1 Qualification and Performance (2000-11) Specification for Flexible Printed Boards 62. IPC-6013B ErrataQualification and Performance (2010-06) Specification for Flexible Printed Boards 63. IPC-6016-1999 高密度互连(HDI)层或印制板的鉴定与性 能规范 64. IPC 6018:1998 Microwave End Product Board Inspection and Test 65. IPC-7095A:2004 BAGs安装的设计和组装过程的实施 IPC-7095-2003 66. IPC-7095B-2008 Design and Assembly Process 暂缺BGAs(3) BGAs(1) Implementation for BGAs BGAs(2) BGAs(4) IPC-7095B-2008 BGA的设计及组装 工艺 钢结构制作工艺流程车尿素生产工艺流程自动玻璃钢生产工艺2工艺纪律检查制度q345焊接工艺规程 的实施 67. IPC-7351:2005 表面安装的设计和焊盘通用要求 IPC-7351-2005 表面贴装焊盘布局设计和标准通用要求 IPC-7351B-2010 Generic Requirements for Surface Mount Design and Land Pattern Standard 表面贴装焊盘布局设计和标准通用要求 68. IPC-7525-2006 Stencil Design Guidelines tinlead and IPC-7525-2000 (Final Draft) lead-free solder paste and surface-mount 2000中文版 adhesive 模板设计导则 69. IPC-7526-2007 Stencil and Misprinted Board Cleaning Handbook 模板和误印板清洗手册 70. IPC-7530-2001 波峰焊回流焊接工艺温度曲线指南 71. IPC-7711A/7721A 7711:Rework of electronic assemblies :2003 7721: Repair and modification of printed boards and electronic assemblies 电子组装件和印制板的返工、修理和修改 72. IPC-7711B/7721B Rework, modification and repair of :2007(第1部分) electronic assemblies 电子组件的返工、修理和修改 73. IPC-7711B/7721B Rework, modification and repair of :2007(第2部分) electronic assemblies 电子组件的返工、修理和修改 74. IPC-7711B/7721B Rework, modification and repair of :2007(第3部分) electronic assemblies 电子组件的返工、修理和修改 75. IPC-7711B-7721B-印制板与电子组装件的修复与修正 中文版 2007 教程 76. IPC-7711-7721B-2Rework, Modification and Repair of 011 Change 1 Electronic Assemblies 77. IPC-7711-7721B Rework, Modification and Repair of Change Electronic Assemblies 1(2011-11) 78. IPC-7711-2013 11-sec-5_5-5-7(2-8-13) 79. IPC-7711B-2013 Gull Wing Installation, Adhesive Backed Section 5.5,7 Stencil 80. IPC-7721-2000 Repair and Modification of Printed Boards 中文版 Change1 and Electronic Assemblies Change2 81. IPC-7711B-7721B-Jumper Wire Selection.pdf 2007 section 6.1 82. IPC-7912-2000 DPMO的计算与印制板装配的制造指标 83. IPC-8435-2004 Detail Specification for Right-angled (Final Draft) Optical Board Connector using Glass Fibers 84. IPC-9151B-2007 印制板工艺、产量、质量和相关可靠性 (PCQR2)基准测试标准和数据库 85. IPC-9151C-2010 印制板工艺、产量、质量和相关可靠性 (PCQR 2)基准测试标准和数据库 86. IPC-9151D--2012 Printed Board Process and Relative Reliability (PCQR2) Benchmark Test Standard and Database 87. IPC-9199-2002 Statistical Process Control (SPC) Quality Rating 88. IPC-9199-2002 Sections 4-6. 89. IPC-9251-2000 Test Vehicles for Evaluating Fine Line Capability 90. IPC-9251 Form 细线性能评估测试方法 .zip 91. IPC-9251 Questionnare. dot 92. IPC-9252A Amd.1 Requirements for Electrical testing of (October-2012) Unpopulated Printed Boards 93. IPC-9261-2000 印制板组装过程中每百万件缺陷数(DPMO) 及合格率估计 94. IPC-9502:1999 印制板组件的电子元件焊接过程导则 95. IPC-9503:1999 非集成电路元件的潮湿敏感性等级 96. IPC-9701A-2006 表面贴装焊接连接的性能测试方法和鉴定 要求 97. IPC-9701:NASA BGA Qualification 98. IPC-A-600G-2008 Acceptability of Printed Boards(January Amendment 1 2008) Acceptability of Printed Boards 99. IPC-A-600H-2010 IPC-A-600F-1999 IPC-A-600G-2004 Amendment 1:2008 IPC-A-600G-2004 (中文版) Acceptability of Printed Boards 100. IPC-A-600H-2010 Errata 101. IPC-A-600H-2010 印制板的可接受性 IPC-A-600E-2007 (CN) 中文版 102. IPC-A-610D-2008 Acceptability of Electronic Assemblies , - April 2008 Amendment 1 103. IPC-A-610DC Telecom-Addendum(2009-08) 104. IPC-A-610E:2010 电子组件的可接受性 IPC-A-610D:2005 (中文版) 中文版 105. IPC-A-610D 标准培训教材 IPC/WHMA-A-620B106. Requirements and Acceptance for Cable IPC/WHMA-A-620 -2012 and Wire Harness Assemblies CN(中文版) IPC-A-620A-2006 线缆及线束组件的要求与验收 107. IPC-ANSI-ESD- 静电释放控制过程 中文版 S20.20:1999 108. IPC-C-406:1990 表面安装连接器的设计和应用导则 109. IPC-CH-65A-1999 印制板及组件清洁指南 110. IPC-CI-408:1994 非焊接表面安装连接器的设计特性和应用 导则 111. IPC-D-279:1996 可靠的表面安装技术的印制板组件设计导 则 112. IPC-D-325A:1995 印制板、组件和支持图样的文件要求 113. IPC-D-326A:2004 生产印制板和其它电子组件的信息要求 114. IPC-D-859:1989 薄膜多层混合电路的设计规范 115. IPC-DR-572A 印制板钻孔指南 -2007 116. IPC-DW-425A:199离散线路板的设计和最终产品要求 0 117. IPC-DW-426:1987 离散线路板的组装规范 118. IPC-ECA Solderability Tests for Component Leads, J-STD-002C-2008 Terminations, Lugs, Terminals and Wires Amed.1 119. IPC E-Commerce IPC E-Commerce White Paper(2000-09) White Paper (2000-09) 120. IPC-EIA-J-STD Requirements for Soldered Electrical and -001D-2005 Electronic 121. IPC-EIA-J-STD Requirements for Soldered Electrical and IPC-J-STD-001B -001D:2005 Electronic Assemblies :1996 IPC-J-STD-001D 电气与电子组装件锡焊要求 IPC-EIA-J-STD Amendment -001C-2000 1-April 2008 122. IPC EIA JEDEC 元件引线、端子、焊片、接线柱及导线可焊IPC-EIA-J-STD J-STD-002B 性试验 -002A-1998 -2003 123. IPC-EIA-J-STD 印制板可焊性试验 -003B-2004 124. IPC-HDBK-001:20焊接的电器及电子组件要求的手册及指南 +A1 00 提供给J-STD-001的手册和导则 I PC-HDBK-001 -1998 125. IPC-HDBK-001 Handbook and Guide to the Requirements ANSI_J-STD-001B -1998 for Soldered Electrical and Electronic Assemblies to Supplement 126. IPC-HDBK-610 Handbook and Guide to Supplement (with Amendment 1) -2005 IPC-A-610(Includes IPC-A-610 B-C-D Comparisons) 127. IPC-HDBK-830 Guidelines for Design, Selection and -2002 Application of Conformal Coatings 敷形涂层的设计 选择和应用手册 128. IPC-HM-860:1987 多层混合电路规范 129. IPC-J-006B:2001 电子等级要求 电子焊接应用的焊接合金联合工业标准 和焊剂及非焊剂的固体焊料 130. IPC JEDEC 9703 焊点 可靠性的机械冲击测试指南 -2009 131. IPC-JEDEC Handling, Packing, Shipping and Use of J-STD-033A Moisture/Reflow Sensitive Surface Mount -2002 Devices 132. IPC-J-STD-001D-Requirements for Soldered Electrical and 2008 Electronic Equipment ( April 2008) Amendment 1 133. IPC J-STD Space Applications Electronic Hardware -001DS-2006 Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies 134. IPC-J-STD-001ESSpace Applications Electronic Hardware -2010 Addendum to Requirements for Soldered Electrical and Electronic Assemblies. 135. IPC-JEDEC Handling, Packing, Shipping and Use J-STD-033B.1 Moisture/Reflow Sensitive Surface Mount -2007 Devices 136. IPC-J-STD-033C Handling, Packing, Shipping and Use of -2011 Moisture/Reflow and/or Process Sensitive Components 137. IPC-JEDEC Marking and Labeling of Components, J-STD-609-2007 PCBs and PCBAs to Identify Lead (Pb), Pb-Free and Other Attributes 138. IPC J-STD-001 Requirements for Soldered Electrical and IPC-J-STD-001C DS-2006 Electronic Assemblies :2001 Amendment 电气和电子组装件的焊接要求 1:2008 139. IPC-J-STD-004A Requirements for Soldering Fluxes :2004 140. IPC-J-STD-033A Handling, Packing,Shipping and Use of :2002 Moisture_Reflow Sensitive Surface Mount Devices 141. IPC-JEDEC Monotonic Bend Characterization of -9702-2004 Board-Level Interconnects 142. IPC-JEDEC Mechanical Shock Test Guidelines for 9703-2009 Solder Joint Relibility 143. IPC-JEDEC- Printed Wiring Board Strain Gage Test 9704-2005 Guideline 印制线路板应变测试指南 144. IPC-JEDEC J-STD Handling, Packing, Shipping and Use of IPC-JEDEC -033B.1-2007 Moistrue_Reflow Sensitive Surface Mount J-STD-033A-2002 Devices 145. IPC-JEDEC J-STD Marking and Labeling of -609-2007 Components,PCB and PCBA to Identify Lead(Pb),Pb-Free and Other Attributes 146. IPC JEDEC J-STD 元器件 PCB及PCBA的有铅、无铅及其它 -609-2007 属性的标识及标记 147. IPC JPCA-2315 高密度互联与微导通孔设计导则 2000中文版 -2000 148. IPC-JPCA-6202 单、双面绕性印制板的性能手册 (中文版) -1999 149. IPC-J-STD-001C:2电气和电子组装件的焊接要求 联合工业标准 000 150. IPC-J-STD-001D 焊接的电气和电子组件要求 (Amendment 1 -April 2008) 151. IPC J-STD-001DS 焊接的电气和电子组件要求 -2006 152. IPC-J-STD-001DSSpace Applications Electronic Hardware -2009 Addendum to J-STD-001D Requirements Amend 1 for Soldered Electrical and Electronic Assemblies 153. J-STD-001E-2010 redline(April-2010) 154. IPC J-STD-003B 印制板可焊性测试方法 -2007 155. IPC J-STD-020C 非密封型固相表面黏著元件的湿度回焊敏中文版 -2004 感度分类 156. IPC-M-109 电子工业潮湿敏感元件的防护 中文版 157. IPC Policy IPC Policy Statement Concerning Legacy Statement Drawings Use of IPC-4204 158. IPC-QE-605A:199印制板质量评估手册 9 159. IPC-S-816:1993 表面安装技术过程导则和检查表 160. IPC-SM-782A:199Surface Mount Design and Land Pattern +A1:1996 3 Standard +A2:1999 IPC-SM-782A 表面安装设计和焊盘标准 -1999 161. IPC-SMEMA-9851Mechanical Equipment Interface Standard -2007 162. IPC-T-50G:2003 电子电路互连与封装术语及定义 中文版 163. IPC-TM-650- 2007 Test methods manual IPC-TM-650-2005 (中文版) 164. IPC-TM-650-MDP-IPC Test method development packet 2012 165. IPC-TR-586-2009 Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium 166. IPC-WHMA-A Requirements and Acceptance for Cable 620A-2006 中文版 -620A-2006 and Wire Harness Assemblies 线缆及线束组件的要求与验收 167. IPC-WHMA-A-620Space Applications Electronic Hardware AS-2012 Addendum to IPCWHMA-A-620A with Amend 1(2012-06-18) 168. IPC规范(SOP) SMT品质. 169. ITRI 50000-1999 North American PWB Technology Hurdles, Barriers and Strategies(1999-10) 170. JEDEC 22-B102D Solderability 以下为电子 工程 路基工程安全技术交底工程项目施工成本控制工程量增项单年度零星工程技术标正投影法基本原理 -2004 器件联合会标准 171. JESD 22-A104D Temperature Cycling -2009 172. JESD 22-A119 Low Temperature Storage Life -2004 173. JEDEC 22-B106C Resistance to Soldering Temperature for -2004 Through-Hole Mounted Devices 174. JESD 22-B101B External Visual -2009 175. JESD 97-2004 Marking, Symbols, and Labels for Identification of Lead (Pb) Free Assemblies, Components, and Devices 176. JESD 435-2009 Standard for the Measurement of Small-Signal Transistor Scattering Parameters 177. JIG-101-2011-03Joint Industry Guide) Material (Ed 4.0) Composition Declaration for Electrotechnical Products. 178. J-STD-001B:1996 Requirements for soldered electrical and 以下为联合工业 electronic assemblies 标准 179. J-STD-001C:2000 Requirements for soldered electrical and electronic assemblies 电气电子组装件的焊接要求 180. J-STD-002A:1998 Solderability tests for component leads, terminations, lugs, terminals and wire 181. J-STD-002C:2004Solderability tests for component leads, (WD) terminations, lugs, terminals and wire 182. J-STD-003:1992 Solderability tests for printed boards 183. J-STD-003B:2004Solderability tests for printed boards (WD) 184. J-STD-004:1995 Requirements for soldering fluxes 焊剂要求 185. J-STD-005:1995 Requirements for soldering pastes 焊膏要求 186. J-STD-006:1995 Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications 187. Measles in 印制板内的白斑 PWB(1973-11) 188. REV:A IPC规范(SOP)-SMT品质 企业标准 SMT In-Line Inspection Standards SMT Workmanship Standards 189. UL 796-2009 Printed-Wiring Boards 2007版 (Ed_9) 190. UL 796F-2006 Standard for Flexible Materials Interconnect Constructions