Micro_SD卡座规格书

ky01 PROCONN Rev. A Sheet Of 51 Proconn Technology Co., Ltd. PRODUCT SPECIFICATION Title : Micro-SD Memory Card Connector. Part Number : MSPN09 SERIES Spec. No. : PS-MSPN04 Revision : A Revisions Control Rev. ECN Number Originator Approval Issue Date A Initial Release Jacky Kengel 2008/09/02 Product Specification Origination Originator: Checked By: Approved By: PROCONN PRODUCT SPECIFICATION PS-MSPN04 Rev. A Sheet Of 52 Micro-SD Memory Card Connector. 1. SCOPE This specification defines the detailed requirements for the PROCONN Micro-SD Memory Card Connector. 2. APPLICABLE DOCUMENTS The following documents form a part of this specification to the extent specified herein. In the event of conflict between the requirements of this specification and the product drawing, the product drawing shall take precedence. In the event of conflict between the requirements of this specification and the referenced documents, this specification shall take precedence. 2.1 COMMERCIAL STANDARDS AND SPECIFICATION: IEC-512 Test methods for electrical connectors. MIL-STD-202/1344 Test methods for electrical connectors. EIA 364-09 Test methods for electrical connectors. 3. REQUIREMENTS 3.1 DESIGN AND CONSTRUCTION Product shall be of the design, construction and physical dimensions specified on the applicable product drawing. 3.2 MATERIALS A .Housing & Slide: High temperature thermoplastic, UL94V-0 Housing Color : Black；Slide Color :Ivory B .Terminal & CD Pin & GND Pin：Copper Alloy. Finish : (a) Contact Area : Gold plated over Nickel (b) Solder Tail : Tin plated over Nickel (c) Under plated : 50μ〞Nickel plated over all C. Lock Pin & Sprin: Stainless D .Cover: Stainless Finish : (a) Solder Tail : Gold plated over Nickel (b) Under plated : 50μ〞Nickel plated over all 3.3 RATINGS Operating Current Rating : 0.5A Voltage Rating : 5 V Operating Temperature : -40℃ to 85℃ Storage Temperature : -40℃ to 85℃ Humidity : 95% max. (non condensing) PROCONN PRODUCT SPECIFICATION PS-MSPN04 Rev. A Sheet Of 53 3.4 TEST REQUIREMENTS AND PROCEDURES SUMMARY TEST DESCRIPTION REQUIREMENT PROCEDURED Examination of Product Meets requirements of product Drawing. Visual inspection No physical damage ELECTRICAL Contact resistance Contact Resistance shall not exceed. Initial:100mΩ Max. After Test :140mΩ Max. Card Detect Switch Contact Resistance: Initial : 500 mΩ Max. After Test :540mΩ Max. between adjacent contact to contact. IEC 512-2-2a, Open voltage 20mV,Test current 100mA Insulation resistance Initial: 1000MΩ Min. After Test : 100MΩ Min. between adjacent contact to contact. IEC 512-2-3a, Measure within 1 minute after applying 500VDC. Dielectric Withstanding Voltage resistance 500VACrms between adjacent contact to contact. IEC 512-2-4a, (a) No shorting or other damages when 500Vrms AC is applied for 1 minute. (b) Current leakage 1mA maximum. MECHANICAL Insertion/Extraction force Insertion Force : 30N Max. Extraction Force : 1.0N Min.~30N Max. Lock Extraction Force : 2N Min. Insertion and Extraction at speed of 25 mm/minute. Except influence of the force for eject and module lock mechanism. Static mechanism strength for card correct insertion (1) No mechanical damage will occur on the part . (2) Be parallel to card insertion direction. (1)Force to push the mating card for 20 seconds. (2) Warranty strength:2Kg force. Static mechanism strength for card reversed insertion (1) No mechanical damage will occur on the part. (2) Be parallel to card insertion direction. (1)Force to push card by reversed insertion for 20 seconds. (2) Warranty strength:2Kg force. Durability for card reversed insertion (1) No mechanical damage will occur on the part. (2) Warranty cycles:40 cycles. (1)One cycle as defined to parallel to card insertion direction,to push card to the end. (2)Reversed insertion of 1Kg force , and then remove card. Operating random vibration (1) No mechanical damage will occur on parts. (2) Criteria: Duringtest,signal discontinuity is never more than 1μsec. 3 axes,30 minutes per axes,1.67Grms Frequency (Hz) A.S.D.(G²/Hz) 10~200 0.01 200~500 0.003 Mated connectors shall be subjected during test.(Audio plug or memory card shall mate with connector). Operating sine vibration (1) No mechanical damage will occur on parts. (2)Criteria:Duringtest,signal discontinuity is never more than 1μsec. Sweep reate:0.5 octave/minute 3 axe,3 sweeps per axis Frequency (Hz) amplitude 5~9 6.6mm(p-p) 9~200 1.0G 200~500 1.5G Mated connectors shall be subjected during test.(Audio plug or memory card shall mate with connector). PROCONN PRODUCT SPECIFICATION PS-MSPN04 Rev. A Sheet Of 54 Operating shock resistance No mechanical damage will occur on parts (1)mate a card (2)half-sine wave shock (3)acceleration:50G (4)Duration time:2ms (5)3 shocks per axis,total 18 shocks Insertion/Extraction durability (1) No physical damage. (2) Insertion/Extraction 10,000 Cycles. (3) Check point:1000 cycles EIA 364-09. Mate and unmated connectors for 500±50 cycles per hour. One cycle as defined to insert card into the socked,and then push to release latch to extract card ENVIRONMENTAL Operation thermal shock (1)No physical damage. (2)Contact resistance \ Insulation Resistance shall not exceed Final value.(mate a card) Test condition:-40℃/30 minutes to +85℃ 30 minutes. Warranty Cycle:32cycles (1cycle=1hour) Humidity-Temperature cycling (1)No physical damage . (2)Contact Resistance\Insulation Resistance shall not exceed Final Value. IEC 512-6-11m With all kind of cards mated connectors to 10 Cycles (240 hours) between -10℃ and 65℃ at 80~98% relative humidity(1 cycle/day). Operating heat resistance (1)No physical damage . (2)Contact Resistance\Insulation Resistance shall not exceed Finel Value. Mated connectors shall be subjected during test. Temperature:70℃ Duration:240 hours Operating cold resistance (1)No physical damage . (2)Contact Resistance\Insulation Resistance shall not exceed Final Value. Mated connectors shall be subjected during test. Temperature:-40℃ Duration:240 hours Humidity Contact resistance \ Insulation Resistance shall not exceed Final value. Steady State 60+/-2℃,95% RH 240 hours. Salt spray No harmful corrosion MIL-STD-202F, method101D Temperature:35 ±2℃ ℃ Concentration: 5% Period:48 hours. PHYSICAL Solder ability Solder Tail shall be covered more than 95% of immersed area with flash solder. MIL-STD-202F, method 208 Solder temperature : 230 ±5℃ ℃ Period : 5±0.5sec. Resistance to reflow physical surface heat No physical damage shall occur. Pre Heat：160~190 , ℃ 60~120sec. Reflow time: above 220 Min,30~90sec. Peak Temp.：250+5/-0 , ℃ 10sec. Duration：2 cycles(see figure3) PROCONN PRODUCT SPECIFICATION PS-MSPN04 Rev. A Sheet Of 55 Figure 1 3.5 PRODUCT QUALIFICATION AND REQUALIFICATION TEST SEQUENCE Test Group A B C D E F G H I J K L M N OTest or Examination Test Sequence (a) Resistance to Reflow Physical Surface Heat 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Examination of Product 2 2,6 2,6 2,6 2,6 2,6 2,6 2,8 2,8 2,10 2,6 2,6 2,10 2,6 1,3 Contact Resistance 3,5 3,5 3,5 3,5 3,5 3,5 3,7 3,7 3,9 3,5 3,5 3,9 3,5 Insulation Resistance 4,6 4,8 4,8 DWV 5,7 5,7 Insertion/Extraction force 3 4,6 Static mechanism strength for card correct insertion 4 Static mechanism strength for card reversed insertion 4 Durability for card reversed insertion 4 Operating random vibration 4 Operating sine vibration 4 Operating shock resistance 4 Insertion/Extraction durability 5 Operation thermal shock 5 Humidity-Temperature cycling 6 Operating heat resistance 4 Operating cold resistance 4 Humidity 6 Salt spray 4 Solder ability 2 Sample Quantity(pcs) 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 Figure 2 NOTE:(a) The numbers indicate sequence in which tests were performed . (b) The test samples were randomly selected from normal current production lots . (c) The test Group “O” doesn’t have to be test in IR reflow . PROCONN PRODUCT SPECIFICATION PS-MSPN04 Rev. A Sheet Of 56 3.5 RECOMMENDED IR REFLOW CONDITION Figure 3 .Temperature Condition graph (Lead free) Rev. B Sheet Of 7 PMS-B06-26(B) 1 鉅 航 科 技 股 份 有 限 公 司 Proconn Technology Co., Ltd. TEST REPORT Title : Micro-SD Memory Card Connector Part Number : MSPN09 SERIES Spec. No. : T-MSPN08 Revision : B Revisions Control Rev. ECN Number Originator Approval Issue Date A Initial Release BILL 2009/02/12 B JUE WANG 2011/05/18 Test Report Origination Originator: Checked By: Approved By: PROCONN TEST REPORT T-MSPN08 Rev.B Sheet Of 7 2 Micro SD Memory Card Connector 1. INTRODUCTION 1.1. Purpose The primary purpose of the test was performed on the Proconn Micro-SD Memory Card Connector to determine its conformance to the requirements of Proconn project specification. 1.2. Scope This report includes the electrical, mechanical, and environmental performance of Proconn Micro-SD Memory Card Connector and be manufactured by the Proconn. 1.3. Conclusion Micro-SD Memory Card Connector meets the electrical, mechanical, and environmental performance requirements of Proconn product specification. 1.4. Product Description The Proconn Micro-SD Memory Card Connector applied at printed circuit board. The contacts are made from copper alloy with gold plating on the contact interface and Tin only plating on the soldertail , Nickel under plating over all. The housing material is UL94V-0 High Temperature Thermoplastic insulating polymer. 1.5. Test Samples The test sample following Project Specification sequence in which tests were performed. Test Group Quantity Part Number Description A,B,C,D,E,F,G,H,I,J,K,L,M,N ,O 4 each. MSPN09 Series Micro-SD Memory Card Connector DR DATE 2011/05/18 APVD DATE 2010/05/18 PROCONN TEST REPORT T-MSPN08 Rev.B Sheet Of 7 3 1.6. Qualification Test Sequence Test Group A B C D E F G H I J K L M N OTest or Examination Test Sequence (a) Resistance to Reflow Physical Surface Heat 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Examination of Product 2 2,6 2,6 2,6 2,6 2,6 2,6 2,8 2,8 2,10 2,6 2,6 2,10 2,6 1,3 Contact Resistance 3,5 3,5 3,5 3,5 3,5 3,5 3,7 3,7 3,9 3,5 3,5 3,9 3,5 Insulation Resistance 4,6 4,8 4,8 DWV 5,7 5,7 Extraction and Insertion Force 3 4,6 Static mechanism strength for card Correct insertion 4 Static mechanism strength for card Reversed insertion 4 Durability for card reversed insertion 4 Operating Random Vibration 4 Operating Sine Vibration 4 Operating Shock Resistance 4 Insertion/Extraction Durability Cycle 5 Operation Thermal Shock 5 Humidity-Temperature cycling 6 Operating heat resistance 4 Operating cold resistance 4 Humidity 6 Salt Spray 4 Solder ability 2 Figure 1 NOTE:(a) The numbers indicate sequence in which tests were performed (b) Sampling Quantity: 4 pcs for each test Group. The test samples were randomly selected from normal current production lots. (c) All the test Group should be tested after 2-time-IR reflow except Group O . PROCONN TEST REPORT T-MSPN08 Rev.B Sheet Of 7 4 2.TEST RESULT DATA Max. Min. G P TEST SPEC. Micro SD Micro SD Examination of Product No Damage OK OK Insertion Force:30N Max 6.7N 2.2N A Extraction and Insertion Force Extraction Force: 1N Min~30N Max 6.1N 1.5N Examination of Product No Damage OK OK Signal 100mΩ Max. 54.2mΩ 22.0mΩ Contact Resistance Switch500mΩ Max. 68.7mΩ 33.6mΩ Static mechanism strength forcard correct Insertion No Damage OK OK Signal 140mΩ Max. 56.4mΩ 24.2mΩ Contact Resistance Switch 540mΩ Max. 64.8mΩ 36.1mΩ B Examination of Product No Damage OK OK Examination of Product No Damage OK OK Signal 100mΩ Max. 57.3mΩ 21.4mΩ Contact Resistance Switch500mΩ Max. 66.7mΩ 38.6mΩ Static mechanism strength for card reversed Insertion No Damage OK OK Signal 140mΩ Max. 58.2mΩ 23.6mΩ Contact Resistance Switch 540mΩ Max. 64.0mΩ 33.5mΩ C Examination of Product No Damage OK OK Examination of Product No Damage OK OK Signal 100mΩ Max. 56.8mΩ 25.3mΩ Contact Resistance Switch 500mΩ Max. 64.0mΩ 37.5mΩ Durability for card reversed insertion No Damage OK OK Signal 140mΩ Max. 56.5mΩ 21.4mΩ Contact Resistance Switch540mΩ Max. 65.2mΩ 37.8mΩ D Examination of Product No Damage OK OK Examination of Product No Damage OK OK Signal 100mΩ Max. 53.8mΩ 25.6mΩ Contact Resistance Switch 500mΩ Max. 62.4mΩ 35.7mΩ Operating Random Vibration 10-200-500Hz (1.67G) OK OK Signal 140mΩ Max. 55.6mΩ 23.8mΩ Contact Resistance Switch540mΩ Max. 64.2mΩ 30.9mΩ E Examination of Product No Damage OK OK PROCONN TEST REPORT T-MSPN08 Rev.B Sheet Of 7 5 DATA Max. Min. G P TEST SPEC. Micro SD Micro SD Examination of Product No Damage OK OK Signal 100mΩ Max. 51.3mΩ 20.3mΩ Contact Resistance Switch 500mΩ Max. 67.4mΩ 54.3mΩ Operating sine vibration 5-9-200-500Hz(1.5G) OK OK Signal 140mΩ Max. 55.3mΩ 25.2mΩ Contact Resistance Switch 540mΩ Max. 67.3mΩ 33.0mΩ F Examination of Product No Damage OK OK Examination of Product No Damage OK OK Signal 100mΩ Max. 55.6mΩ 21.4mΩ Contact Resistance Switch 500mΩ Max. 63.6mΩ 25.3mΩ Operating Shock Resistance 50G OK OK Signal 140mΩ Max. 50.5mΩ 23.2mΩ Contact Resistance Switch 540mΩ Max. 64.0mΩ 24.8mΩ G Examination of Product No Damage OK OK Examination of Product No Damage OK OK Signal 100mΩ Max. 53.8mΩ 22.5mΩ Contact Resistance Switch 500mΩ Max. 60.3mΩ 22.0mΩ Insertion Force:30N 6.3N 2.1N Extraction and Insertion Force Extraction Force: 1N Min~30N Max 6.0N 1.8N Insertion/ Extraction durability No Damage OK OK Signal 140mΩ Max. 68.4mΩ 23.4mΩ Contact Resistance Switch540mΩ Max. 72.3mΩ 37.1mΩ Insertion Force:30N 5.9N 2.3N Extraction and Insertion Force Extraction Force: 1N Min~30N Max 5.0N 1.4N H Examination of Product No Damage OK OK Examination of Product No Damage OK OK Signal 100mΩ Max. 53.3mΩ 23.2mΩ Contact Resistance Switch 500mΩ Max. 63.5mΩ 30.2mΩ Insulation Resistance 1000 MΩ Min. OK OK Operating thermal shock No Damage OK OK Signal 140mΩ Max. 55.6mΩ 25.5mΩ Contact Resistance Switch 540mΩ Max. 64.5mΩ 35.4mΩ Insulation Resistance 100 MΩ Min. OK OK I Examination of Product No Damage OK OK PROCONN TEST REPORT T-MSPN08 Rev.B Sheet Of 7 6 DATA Max. Min. G P TEST SPEC. Micro SD Micro SD Examination of Product No Damage OK OK Signal 100mΩ Max. 49.3.3mΩ 21.5mΩ Contact Resistance Switch 500mΩ Max. 63.3mΩ 31.6mΩ Insulation Resistance 1000 MΩ Min. OK OK DWV 500VrmsAC is applied for 1 minute OK OK Humidity-Temperature cycling No Damage OK OK Signal 140mΩ Max. 54.5mΩ 22.5mΩ Contact Resistance Switch 540mΩ Max. 65.6mΩ 34.2mΩ Insulation Resistance 100 MΩ Min. OK OK DWV 500VrmsAC is applied for 1 minute OK OK J Examination of Product No Damage OK OK Examination of Product No Damage OK OK Signal 100mΩ Max. 58.3mΩ 23.4mΩ Contact Resistance Switch500mΩ Max. 62.4mΩ 33.4mΩ Operating Heat Resistance No Damage OK OK Signal 140mΩ Max. 58.1mΩ 21.3mΩ Contact Resistance Switch 540mΩ Max. 61.6mΩ 34.2mΩ K Examination of Product No Damage OK OK Examination of Product No Damage OK OK Signal 100mΩ Max. 57.3mΩ 22.4mΩ Contact Resistance Switch 500mΩ Max. 65.2mΩ 31.6mΩ Operating Cold Resistance No Damage OK OK Signal 140mΩ Max. 58.5mΩ 22.3mΩ Contact Resistance Switch 540mΩ Max. 68.2mΩ 34.5mΩ L Examination of Product No Damage OK OK PROCONN TEST REPORT T-MSPN08 Rev.B Sheet Of 7 7 DATA Max. Min. G P TEST SPEC. Micro SD Micro SD Examination of Product No Damage OK OK Signal 100mΩ Max. 55.1mΩ 22.3mΩ Contact Resistance Switch 500mΩ Max. 68.5mΩ 34.1mΩ Insulation Resistance 1000 MΩ Min. OK OK DWV 500VrmsAC is applied for 1 minute OK OK Humidity No Damage OK OK Signal 140mΩ Max. 52.8mΩ 22.8mΩ Contact Resistance Switch 540mΩ Max. 65.2mΩ 34.2mΩ Insulation Resistance 100 MΩ Min. OK OK DWV 500VrmsAC is applied for 1 minute OK OK J Examination of Product No Damage OK OK