IPC-A-600H-2010 印制板的可接受性(中文版 )(1)

IPC-A-600H-2010印制板的可接受性(中文版)目录Acknowledgment（鸣谢）.................................................................iii1Introduction（前⾔）..................................................................11.1Scope（范围）..............................................................................11.2Purpose（⽬的）..........................................................................11.3ApproachToThisDocument（本⽂件的使⽤⽅法）...........11.4Classification（产品分级）........................................................21.5AcceptanceCriteria（验收准则）............................................21.6ApplicableDocuments（引⽤⽂件）......................................41.6.1IPC....................................................................................41.6.2AmericanSocietyofMechanicalEngineers（美国机械 工程 路基工程安全技术交底工程项目施工成本控制工程量增项单年度零星工程技术标正投影法基本原理 师协会）...............................41.7DimensionsandTolerances（尺⼨与公差）.........................51.8TermsandDefinitions（术语和定义）....................................51.9RevisionLevelChanges（版本修订变化）............................51.10Workmanship（⼯艺质量）.......................................................52ExternallyObservableCharacteristics（外部可观察特性）......................................................................62.1PrintedBoardEdges（印制板边缘）......................................62.1.1Burrs（毛刺）..................................................................62.1.1.1NonmetallicBurrs（非金属毛刺）.................................72.1.1.2MetallicBurrs（金属毛刺）...........................................82.1.2Nicks（缺口）.................................................................92.1.3Haloing（晕圈）............................................................102.2BaseMaterialSurface（基材 表 关于同志近三年现实表现材料材料类招标技术评分表图表与交易pdf视力表打印pdf用图表说话 pdf ⾯）......................................112.2.1WeaveExposure（露织物）.........................................122.2.2WeaveTexture（显布纹）............................................132.2.3Exposed/DisruptedFibers（暴露/断裂的纤维）.........142.2.4PitsandVoids（麻点和空洞）.....................................152.3BaseMaterialSubsurface（基材表⾯下）...........................162.3.1Measling（白斑）..........................................................212.3.2Crazing（微裂纹）........................................................222.3.3Delamination/Blister（分层/起泡）.............................242.3.4ForeignInclusions（外来杂夹物）...............................262.4SolderCoatingsandFusedTinLead（焊料涂覆层和热熔锡铅层）....................................................282.4.1Nonwetting（不润湿）.................................................282.4.2Dewetting（退润湿）...................................................292.5Holes–Plated-Through–General（镀覆孔-通则）.......312.5.1Nodules/Burrs（结瘤/毛刺）.......................................312.5.2PinkRing（粉红圈）....................................................322.5.3Voids–CopperPlating（铜镀层空洞）.......................332.5.4Voids–FinishedCoating（最终涂覆层空洞）............342.5.5LiftedLands–(Visual)（焊盘起翘–（目检））...........352.5.6CapPlatingofFilledHoles–(Visual)（填塞孔的盖覆电镀–（目检））..................................362.6Holes–Unsupported（⾮⽀撑孔）.......................................382.6.1Haloing（晕圈）............................................................382.7PrintedContacts（印制接触⽚）............................................392.7.1SurfacePlating–PlatedContacts（表面镀层–电镀的接触片）.....................................392.7.1.1SurfacePlating–WireBondPads（表面镀层–金属线键合盘）.....................................412.7.2BurrsonEdge-BoardContacts（印制接触片–边缘毛刺）.........................................432.7.3AdhesionofOverplate（外镀层附着力）....................442.8Marking（标记）........................................................................452.8.1EtchedMarking（蚀刻标记）.......................................482.8.2ScreenedorInkStampedMarking（丝印或油墨盖印标记）.............................................502.9SolderMask（阻焊膜（阻焊剂））...........................................522.9.1CoverageOverConductors(SkipCoverage)（导体上的覆盖（跳印））...........................532.9.2RegistrationtoHoles(AllFinishes)（与孔的重合度（所有涂覆层））................................542.9.3RegistrationtoOtherConductivePatterns（与其它导电图形的重合度）.....................................552.9.3.1BallGridArray(SolderMask-DefinedLands)（球栅列阵（阻焊膜限定的焊盘））............................562.9.3.2BallGridArray(Copper-DefinedLands)（球栅列阵（铜箔限定的焊盘））................................572.9.3.3BallGridArray(SolderDam)（球栅列阵（阻焊坝））................................................582.9.4Blisters/Delamination（起泡/分层）...........................592.9.5Adhesion(FlakingorPeeling)（附着力（剥落或起皮））............................................612.9.6Waves/Wrinkles/Ripples（波纹/褶皱/皱纹）.............622.9.7Tenting(ViaHoles)（掩蔽（导通孔））.......................632.9.8SodaStrawing（吸管状空隙）.....................................642.10PatternDefinition–Dimensional（图形精确度-尺⼨要求）........................................................662.10.1ConductorWidthandSpacing（导体宽度和间距）.....................................................662.10.1.1ConductorWidth（导体宽度）.....................................672.10.1.2ConductorSpacing（导体间距）..................................682.10.2ExternalAnnularRing–Measurement（外层环宽的测量）.....................................................692.10.3ExternalAnnularRing–SupportedHoles（支撑孔的外层环宽）.................................................702.10.4ExternalAnnularRing–UnsupportedHoles（非支撑孔的外层环宽）.............................................722.11Flatness（平整度）...................................................................733InternallyObservableCharacteristics（内部可观察特性）....................................................................753.1DielectricMaterials（介质 材料 关于××同志的政审材料调查表环保先进个人材料国家普通话测试材料农民专业合作社注销四查四问剖析材料 ）...........................................763.1.1LaminateVoids/Cracks(OutsideThermalZone)（层压板空洞/裂缝（受热区外））..............................763.1.2Registration/ConductortoHoles（导体与孔的重合度）.................................................78TableofContents（⽬录）IPC-A-600H-20102010年4月v3.1.3ClearanceHole,Unsupported,toPower/GroundPlanes（电源层/接地层上的非支撑孔，隔离孔）....793.1.4Delamination/Blister（分层/起泡）.............................803.1.5Etchback（凹蚀）..........................................................813.1.5.1Etchback（凹蚀）..........................................................823.1.5.2NegativeEtchback（负凹蚀）......................................843.1.6SmearRemoval（去钻污）...........................................853.1.7DielectricMaterial,Clearance,MetalPlaneforSupportedHoles（金属层上支撑孔的介质间距）......873.1.8Layer-to-LayerSpacing（层间间距）..........................883.1.9ResinRecession（树脂凹缩）......................................893.1.10HoleWallDielectric/PlatedBarrelSeparation(HoleWallPullaway)（孔壁介质与孔壁镀层分离（孔壁拉脱））........................................................903.2ConductivePatterns–General（导电图形-总则）.........913.2.1EtchingCharacteristics（蚀刻特性）...........................943.2.2PrintandEtch（丝印及蚀刻）......................................963.2.3SurfaceConductorThickness(FoilPlusPlating)（表面导体厚度（铜箔加上镀层））...............973.2.4FoilThickness–InternalLayers（内层铜箔厚度）.....983.3Plated-ThroughHoles–General（镀覆孔-总则）...........993.3.1AnnularRing–InternalLayers（内层环宽）............1013.3.2LiftedLands–(Cross-Sections)（焊盘起翘（显微切片））..........................................1033.3.3FoilCrack–(InternalFoil)‘‘C’’Crack（铜箔裂缝–（内层铜箔）C型裂缝）......................1043.3.4FoilCrack(ExternalFoil)（铜箔裂缝（外层铜箔））..........................................1053.3.5PlatingCrack(Barrel)‘‘E’’Crack（镀层裂缝（孔壁）–E型裂缝）..........................1063.3.6PlatingCrack–(Corner)‘‘F’’Crack（镀层裂缝–（拐角）F型裂缝）..............................1073.3.7PlatingNodules（镀层结瘤）.....................................1083.3.8CopperPlatingThickness–HoleWall（铜镀层厚度–孔壁）...............................................1093.3.9CopperWrapPlating（铜包覆电镀）.........................1103.3.10PlatingVoids（镀层空洞）.........................................1133.3.11SolderCoatingThickness(OnlyWhenSpecified)（焊料涂覆层厚度（仅当有规定时））.....1153.3.12SolderMaskThickness（阻焊膜厚度）.....................1163.3.13Wicking（芯吸）.........................................................1173.3.13.1Wicking,ClearanceHoles（隔离孔的芯吸）............1183.3.14InnerlayerSeparation–Vertical(Axial)Microsection（内层分离–垂直（轴向）显微切片）...................1193.3.15InnerlayerSeparation–Horizontal(Transverse)Microsection（内层分离–水平（横向）显微切片）...................................................................1203.3.16MaterialFillofBlindandBuriedVias（埋/盲导通孔的材料填塞）.....................................1213.3.17CapPlatingofFilledHoles（填塞孔的盖覆电镀）...............................................1233.4Plated-ThroughHoles–Drilled（镀覆孔-钻孔）...........1253.4.1Burrs（毛刺）..............................................................1263.4.2Nailheading（钉头）...................................................1273.5Plated-ThroughHoles–Punched（镀覆孔-冲孔）.......1283.5.1RoughnessandNodules（粗糙度和结瘤）................1293.5.2Flare（锥口）..............................................................1304Miscellaneous（其他类型板）..............................................1314.1FlexibleandRigid-FlexPrintedBoards（挠性及刚挠性印制板）..........................................................1324.1.1CoverlayCoverage–CoverfilmSeparations（覆盖层覆盖–覆盖膜分离）...................................1334.1.2Coverlay/CovercoatCoverage–Adhesives（覆盖层/覆盖涂层的覆盖–粘接剂）.....................1344.1.2.1AdhesiveSqueeze-Out–LandArea（焊盘区域粘接剂的挤出）.......................................1344.1.2.2AdhesiveSqueeze-Out–FoilSurface（铜箔表面粘接剂的挤出）.......................................1354.1.3AccessHoleRegistrationforCoverlayandStiffeners（元器件孔与覆盖层及增强板的重合度）...................................................................1364.1.4PlatingDefects（镀层缺陷）......................................1374.1.5StiffenerBonding（增强板的粘接）..........................1384.1.6TransitionZone,RigidAreatoFlexibleArea（刚性区域与挠性区域的过渡区）...........................1404.1.7SolderWicking/PlatingPenetrationUnderCoverlay（覆盖层下的焊料芯吸/镀层渗透）..........1414.1.8LaminateIntegrity（层压板完整性）.........................1434.1.8.1LaminateIntegrity–FlexiblePrintedBoard（层压板完整性–挠性印制板）...............................1444.1.8.2LaminateIntegrity–Rigid-FlexPrintedBoard（层压板的完整性–刚挠性印制板）.......................1454.1.9Etchback(Type3andType4Only)（凹蚀（仅3型和4型板））......................................................1464.1.10SmearRemoval(Type3and4Only)（去钻污（仅3型和4型板））......................................................1474.1.11TrimmedEdges/EdgeDelamination（裁切边缘/边缘分层）.............................................1484.1.12Fold/BendMarks（折叠/弯曲痕迹）........................1504.1.13SilverFilmIntegrity（银膜完整性）..........................1514.2MetalCorePrintedBoards（⾦属芯印制板）...................1534.2.1TypeClassifications（分类）......................................1544.2.2SpacingLaminatedType（层压型板的间距）..........1554.2.3InsulationThickness,InsulatedMetalSubstrate（绝缘型金属基板的绝缘厚度）...............................1564.2.4InsulationMaterialFill,LaminatedTypeMetalCore（层压型金属芯板的绝缘材料填充）.......................1574.2.5CracksinInsulationMaterialFill,LaminatedType（层压型板绝缘材料填充中的裂缝）.......................1584.2.6CoreBondtoPlated-ThroughHoleWall（金属芯与镀覆孔壁的连接）...................................1594.3FlushPrintedBoards（齐平印制板）.................................1604.3.1FlushnessofSurfaceConductor（表面导体的平整性）...............................................1605Cleanliness（清洁度测试）...................................................1615.1Solderability（可焊性测试）.................................................1625.1.1Plated-ThroughHoles(ApplicabletoTestC/C1)（镀覆孔（适用于C/C1测试））...............................1635.2ElectricalIntegrity（电⽓完整性）.......................................164完整资料：https://item.taobao.com/item.htm?id=542957151315其它IPC 标准 excel标准偏差excel标准偏差函数exl标准差函数国标检验抽样标准表免费下载红头文件格式标准下载 （IPC-A-610，IPC-A-600,IPC-A-620等）请联系：QQ:1395833280Mail:cdm_lj@163.com