HBA_with_edge_connector_routing_guideline
Brocade
1745 Technology Drive
San Jos, CA 95110
HBA with edge connector routing guideline
HBA with Edge Connector Routing
Guideline
S. Mokhtarzad
Revision 1.0
“HBA with Edge connector Routing Guideline...
Brocade
1745 Technology Drive
San Jos, CA 95110
HBA with edge connector routing guideline
HBA with Edge Connector Routing
Guideline
S. Mokhtarzad
Revision 1.0
“HBA with Edge connector Routing Guideline” is an unreleased product from BROCADE
Communications. The information contained in this document is considered confidential
information and should not be disclosed without prior consent of BROCADE. This
information is considered preliminary and may change in substance or form prior to final
product release.
UNAPPROVED. This draft has not completed technical approval cycles.
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HISTORY
Date Rev Author Summary of Change
08/19/09 1.0 Shahriar Mokhtarzad Initial draft
HBA with edge connector routing guideline
APPROVAL LIST
Signal Integrity
Sherri Azgomi SI Engineer
Shahriar Mokhtarzad SI Engineer
Tony Luan SI Engineer
Shaohua Li SI Engineer
Hardware
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HBA with edge connector routing guideline
Table of Contents
HISTORY......................................................................................................................................... 2
APPROVAL LIST............................................................................................................................. 3
List of Figures .................................................................................................................................. 5
1 Introduction............................................................................................................................... 7
1.1 Reference Documents ...................................................................................................... 7
1.2 General features of HBA with edge connector ................................................................. 7
1.3 Routing rule executive summary....................................................................................... 9
1.4 Server side PCIe links and the Edge connector ............................................................... 9
1.5 SFP+ port differential pairs ............................................................................................. 11
1.6 ASIC pin padstack........................................................................................................... 13
1.7 Differential pair Transition via ......................................................................................... 16
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List of Figures
Figure 1 - HBA with edge connector ............................................................................................... 8
Figure 2 - Stackup document for a HBA with edge connector ........................................................ 8
Figure 3 - PCIe traces are routed on surface layers ..................................................................... 10
Figure 4 - PCIe differential pair phase adjustment ........................................................................ 10
Figure 5 - Plane and edge finger overlap limit............................................................................... 11
Figure 6 - SFP+ port differential pair ............................................................................................. 12
Figure 7 - SFP+ port differential pair phase tolerance adjustment................................................ 12
Figure 8 - Plane cut under SFP+ TX & RX pins ............................................................................ 13
Figure 9 - High-speed BGA pin via padstack definition (part1) ..................................................... 14
Figure 10 - High-speed BGA pin via padstack definition (part2) ................................................... 15
Figure 11 - ASIC high speed differential pin antipad on Ground layers ........................................ 16
Figure 12 - ASIC high speed differential pin antipad on Power layers.......................................... 16
Figure 13 - Center-to-center separation of differential transition via ............................................. 17
Figure 14 - Differential transition via padstack definition (part1) ................................................... 18
Figure 15 - Differential transition via padstack definition (part2) ................................................... 19
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LIST of Tables
Table 1 - Summary of the important routing rules for Highspeed traces......................................... 9
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1 Introduction
This document provided basic guidelines for stackup and routing HBA with edge connector.
1.1 Reference Documents
• BRD-1000262-01_revA.brd (Tomcat board file)
1.2 General features of HBA with edge connector
The type HBAs are installed in desktop servers. The HBA's environment suffers the following
shortcomings
• Unpredictable air flow
• Dirty and insufficient power
Most HBAs of this type following high speed links
• Two nGFC and/or 10GE ports for connections to outside devices which can support
SFP+, active and passive cables.
• 2n links of PCIe or PCIe gen2 as connection to the host server.
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HBA with edge connector routing guideline
Figure 1 - HBA with edge connector
Figure 2 - Stackup document for a HBA with edge connector
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HBA with edge connector routing guideline
1.3 Routing rule executive summary
The following table describes the important parameter for routing the high speed traces
Table 1 - Summary of the important routing rules for Highspeed traces
Description Value Comment
PCIe Differential pair trace
Differential Impedance 85Ω DIFF
Phase tolerance adjustment
segment impedance
42.5 SE
Phase Tolerance (end to end) 10 mil
Route on layers Surface
Phase Tolerance (end to end) 10mil
Phase Tolerance per segment 5mil A segment is a part of the trace between
any two discontinuity e.g., via, pin, etc
SFP+ port
Differential Impedance 100Ω DIFF
Phase tolerance adjustment
segment impedance
50 SE
Phase Tolerance (end to end) 10mil
Phase Tolerance per segment 5mil A segment is a part of the trace between
any two discontinuity e.g., via, pin, etc
Route on layers Surface Use Differential transition via for AC
coupling caps and layer transition. Avoid
layer transition if at all possible.
Differential pair separation
from any trace
25 mil
1.4 Server side PCIe links and the Edge connector
The PCIe traces are differential pair with their geometry specified in the stackup document
provided by Brocade. Several points must be considered
1. All PCIe traces must be routed differential 85Ω ob the surface layers (refer to stackup
document).
2. For phase matching the PCIe differential pair use SE 42.5Ω segments as shown below
(refer to stackup document).
3. All Ground and power planes are cut. Overlap of any Plane with any edge fingers ≤
30mils.
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Figure 3 - PCIe traces are routed on surface layers
Figure 4 - PCIe differential pair phase adjustment
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Figure 5 - Plane and edge finger overlap limit
1.5 SFP+ port differential pairs
The SFP+ ports nGFC or 10GE. Since they can be connected to the outside world, special care
must be taken to ensure the cleanest channel possible.
1. All SFP+ port traces must be routed differential 100Ω on the surface layers.
2. For phase matching the SFP+ port differential pair use SE 50Ω segments as shown
below.
3. All ground and power planes under the TX and RX pins of the SFP+ connector are cut as
shown below.
4. All transition vias are to be as shown below.
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Figure 6 - SFP+ port differential pair
Figure 7 - SFP+ port differential pair phase tolerance adjustment
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Figure 8 - Plane cut under SFP+ TX & RX pins
1.6 ASIC pin padstack
It is very important to have High speed BGA pins that are impedance matched to the rest of the
channel to improve lunch of the signal by TX and reduce reflections in the RX channel. For this
reason, each ASIC uses a optimized padstack to accomplish this. The current ASIC (Catapult)
requires the following via padstack VIA24R12_TOMAR2.
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Figure 9 - High-speed BGA pin via padstack definition (part1)
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Figure 10 - High-speed BGA pin via padstack definition (part2)
Notice the different "Anti pad" specification for Power,
Ground layers and Keepout on Signal layers..
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HBA with edge connector routing guideline
Figure 11 - ASIC high speed differential pin antipad on Ground layers
Figure 12 - ASIC high speed differential pin antipad on Power layers
1.7 Differential pair Transition via
The transition via described below provided a near 100Ω impedance environment allowing the
trace to transition between routing layers. Brocade padstack name for each individual via is
VIA24R12_60ANTI
1. Center to center of the differential via is 60 mil.
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HBA with edge connector routing guideline
2. Antipad diameter of each via is 60 mil.
3. FHS of each via is 12 mil
4. Each differential pair transition via MUST have a Ground via no closer than 65 mil and no
further than 165 mil
Figure 13 - Center-to-center separation of differential transition via
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Figure 14 - Differential transition via padstack definition (part1)
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Figure 15 - Differential transition via padstack definition (part2)
End ☺
1 Introduction
1.1 Reference Documents
1.2 General features of HBA with edge connector
1.3 Routing rule executive summary
1.4 Server side PCIe links and the Edge connector
1.5 SFP+ port differential pairs
1.6 ASIC pin padstack
1.7 Differential pair Transition via
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