TDKMCLL电容规格

SPECIFICATIONFORTDKMULTILAYERCERAMICCHIPCAPACITORSNAMEOFCOMPANYDWG.NO.TDKITEMDATEISSUEDC0603,C1005,C1608,C2012,C3216,C3225,C4532,C5750Type/6.3Vto630VC0G,X5R,X7R,Y5VCharacteristicsTDKENGINEERINGSIGNATUREDRAWNBYCHECKEDBYAPPROVEDBYDATEDATEDATEPleasereturnthisspecificationtoTDKrepresentativeswithyoursignature.Ifordersareplacedwithoutreturnedspecification,pleaseallowustojudgethatspecificationisacceptedbyyourside.CUSTOMERRESPONSEPleasecheckoneofthreeconditionsbelow.□Approval□Approvalwiththefollowingchanges□RejectwiththefollowingreasonsNAMEOFCOMPANYSIGNATUREDATETDKCORPORATION13-1,Nihonbashi1-chome,Chuo-ku,Tokyo103-8272,JapanPhone:Tokyo(03)3278-51111.SCOPEThisspecificationisapplicabletochiptypemultilayerceramiccapacitorswithapriorityovertheotherrelevantspecifications.ProductionplacesdefinedinthisspecificationshallbeTDKCorporationJapan,TDKTaiwanCorporation,TDKXiamenCo.,Ltd,TDK(Suzhou)Co.,Ltd,TDKKoreaCorporation,TDK(Malaysia)Sdn.Bhd,TDKComponentsU.S.A.Inc,andTDKHungaryLtd.EXPLANATORYNOTE:Thisspecificationwarrantsthequalityoftheceramicchipcapacitors.Thechipsshouldbeevaluatedorconfirmedastateofmountedonyourproduct.Iftheuseofthechipsgoesbeyondtheboundsofthespecification,wecannotaffordtoguarantee.2.CODECONSTRUCTION(Example)C2012X7R1E105KT(1)(2)(3)(4)(5)(6)(1)TypeTerminalelectrodeLBWGBTInternalelectrodeCeramicdielectricTypeTypicalDimensions(Unit:mm)TDK(EIAstyle)LWTBGC0603(CC0201)0.60±0.030.30±0.030.30±0.030.10-0.200.20min.C1005(CC0402)1.00±0.050.50±0.050.50±0.050.10min.0.30min.C1608(CC0603)1.60±0.100.80±0.100.80±0.100.20min.0.30min.C2012(CC0805)2.00±0.201.25±0.201.25±0.200.20min.0.50min.C3216(CC1206)3.20±0.201.60±0.201.60±0.200.20min.1.00min.C3225(CC1210)3.20±0.402.50±0.302.50±0.300.20min.-C4532(CC1812)4.50±0.403.20±0.402.50±0.300.20min.-C5750(CC2220)5.70±0.405.00±0.402.50±0.300.20min.-*Asforeachitem,pleaserefertothetableAintheendofthespecification——1——(2)TemperatureCharacteristics(Detailsareshownintable1No.6andNo.7atpage6)(3)RatedVoltageSymbolRatedVoltage2JDC630V2EDC250V2ADC100V1HDC50V1EDC25V1CDC16V1ADC10V0JDC6.3V(4)RatedCapacitanceStatedinthreedigitsandinunitsofpicofarads(pF).ThefirstandSeconddigitsidentifythefirstandsecondsignificantfiguresofthecapacitance,thethirddigitidentifiesthemultiplier.Risdesignatedforadecimalpoint.Example2R2→2.2pF105→1,000,000pF(5)CapacitancetoleranceSymbolToleranceCapacitanceC±0.25pF10pFandunderD±0.5pFJ±5%K±10%Over10pFM±20%Z+80,-20%(6)PackagingSymbolPackagingBBulkTTaping——2——3.RATEDCAPACITANCEANDTOLERANCE3.1StandardcombinationofratedcapacitanceandtolerancesTemperatureClassCapacitancetoleranceRatedcapacitanceCharacteristics1C0GX5RX7R2Y5V10pFandunder12pFto10,000pFOver10,000pF10uFandunderOver10uF0.1uFandunderC(±0.25pF)0.5,1,1.5,2,2.2,3,3.3,4,4.7,5D(±0.5pF)6,6.8,7,8,9,10J(±5%)E–12seriesK(±10%)K(±10%)E–6seriesK(±10%)*1E–6seriesM(±20%)E–1seriesZ(+80,-20%)Over0.1uFE–3series*1ThestandardcapacitancetoleranceforC1005X5R0J155,C1005X5R0J225andC1608X5R0J106isM(±20%).3.2CapacitanceStepinEseriesEseriesCapacitanceStepE-11.0E-31.02.24.7E-61.01.52.23.34.76.8E-121.01.21.51.82.22.73.33.94.75.66.88.24.OPERATINGTEMPERATURERANGET.C.Min.operatingMax.operatingReferenceTemperatureTemperatureTemperatureX5R-55°C85°C25°CY5V-30°C85°C25°CX7R-55°C125°C25°CC0G——3——5.STORINGCONDITIONANDTERM5to40°Cat20to70%RH6monthsMax.6.P.C.BOARDWhenmountingonanaluminumsubstrate,largecasesizessuchasC3225,C4532andC5750typesaremorelikelytobeaffectedbyheatstressfromthesubstrate.Pleaseinquireseparatespecificationforthelargecasesizeswhenmountedonthesubstrate.7.INDUSTRIALWASTEDISPOSALDisposethisproductasindustrialwasteinaccordancewiththeIndustrialWasteLaw.——4——8.PERFORMANCEtable1No.ItemPerformanceTestorinspectionmethod1ExternalAppearanceNodefectswhichmayaffectInspectwithmagnifyingglass(3),×incaseperformance.ofC0603type,withmagnifyingglass(10)×2InsulationResistance10,000M?or500M?·μFmin.Applyratedvoltagefor60s.(AsforthecapacitorsofratedAsfortheratedvoltage630VDC,applyvoltage16,10,6.3VDCandthe500V.itembelow,10,000M?or100M?·μFmin.,)whicheversmaller.C1005X5R1E683C1005X5R1E104C1608X5R1E334C1608X5R1E474C1608X5R1E684C1608X5R1E105C2012X5R1E335C2012X5R1E4753VoltageProofWithstandtestvoltagewithoutinsulationbreakdownorotherdamage.4CapacitanceWithinthespecifiedtolerance.5QPleaserefertothetableAinthe(Class1)endofthespecificationDissipationFactor(Class2)ClassRatedvoltageApplyvoltageClass1100Vandunder3×ratedvoltageOver100V1.5×ratedvoltageClass2100Vandunder2.5×ratedvoltageOver100V1.5×ratedvoltageAboveDCvoltageshallbeappliedfor1to5s.Charge/dischargecurrentshallnotexceed50mA.ClassCapacitanceMeasuringMeasuringfrequencyvoltage1000pFand1MHz±10%Class1under0.5-5Vrms.Over1000pF1kHz±10%10uFand1kHz±10%1.0±0.2Vrms.Class2under120Hz±20%0.5±0.2Vrms.Over10uFThemeasurementvoltageofitemsbelow,0.5±0.2Vrms.C1005X5R0J155C1005X5R0J225SeeNo.4inthistableformeasuringcondition.——5——(continued)No.ItemTemperatureCharacteristicsofCapacitance(Class1)温度电容特性（1類）PerformanceT.C.TemperatureCoefficientC0G0±30(ppm/°C)Capacitancedriftwithin0.2%±or±0.05pF,whicheverlarger.TestorinspectionmethodTemperaturecoefficientshallbecalculatedbasedonvaluesat25C°and85°Ctemperature.Measuringtemperaturebelow20°Cshallbe-10°Cand-25°C.TemperatureCharacteristicsofCapacitance(Class2)RobustnessofTerminations9BendingCapacitanceChange(%)NovoltageappliedX5R:±15X7R:±15Y5V:+22/-82Nosignofterminationcomingoff,breakageofceramic,orotherabnormalsigns.Nomechanicaldamage.Capacitanceshallbemeasuredbythestepsshowninthefollowingtableafterthermalequilibriumisobtainedforeachstep.?Cbecalculatedref.STEP3readingStepTemperature(°C)1Referencetemp.±22Min.operatingtemp.±33Referencetemp.±24Max.operatingtemp.±2Asformeasuringvoltage,pleaserefertothetableAintheendofthespecification.AsforMin./Max.operatingtemp.andReferencetemp.,pleasereferto“4.operatingtemperaturerange”atpage3.ReflowsolderthecapacitorsonaP.C.BoardshowninAppendix1aorAppendix1bandapplyapushingforceof2N(C0603andC1005)or5N(C1608,C2012,C3216,C3225,C4532,C5750)with10±1s.PushingforceCapacitorReflowsolderthecapacitorsonaP.C.BoardshowninAppendix2aorAppendix2bandbenditfor1mm.2050FR23014545(Unit:mm)——6——(continued)No.ItemPerformance10SolderabilityNewsoldertocoverover75%oftermination.25%mayhavepinholesorroughspotsbutnotconcentratedinonespot.CeramicsurfaceofAsectionsshallnotbeexposedduetomeltingorshiftingofterminationmaterial.Asection11ResistanceExternalNocracksareallowedandtosolderappearanceterminationsshallbecoveredatheatleast60%withnewsolder.CapacitanceCharacteristicsChangefromthevaluebeforetestCapacitancedriftClass1C0Gwithin2±.5%or±0.25pF,whicheverlarger.X5R±7.5%Class2X7R±7.5%Y5V±20%Q(Class1)CapacitanceQ30pFandover1,000min.Under30pF400+20×Cmin.C:Ratedcapacitance(pF)D.F.Meettheinitialspec.(Class2)InsulationMeettheinitialspec.ResistanceVoltageNoinsulationbreakdownorproofotherdamage.TestorinspectionmethodCompletelysoakbothterminationsinsolderat235±5°Cfor2±0.5s.Solder:H63A(JISZ3282)Flux:Isopropylalcohol(JISK8839)Rosin(JISK5902)25%solidsolution.Completelysoakbothterminationsinsolderat260±5°Cfor5±1s.PreheatingconditionTemp.:150±10°CTime:1to2min.Flux:Isopropylalcohol(JISK8839)Rosin(JISK5902)25%solidsolution.Solder:H63A(JISZ3282)Leavethecapacitorsinambientconditionfor6to24h(Class1)or242h±(Class2)beforemeasurement.——7——(continued)No.Item12VibrationExternal振動appearanceCapacitanceQ(Class1)PerformanceNomechanicaldamage.ChangefromtheCharacteristicsvaluebeforetestCapacitancedriftwithin2±.5%orClass1C0G±0.25pF,whicheverlarger.X5R±7.5%Class2X7R±7.5%Y5V±20%CapacitanceQ30pFandover1,000min.Under30pF400+20×Cmin.TestorinspectionmethodReflowsolderthecapacitorsonaP.C.BoardshowninAppendix1aorAppendix1bbeforetesting.Vibratethecapacitorswithamplitudeof1.5mmP-Pchangingthefrequenciesfrom10Hzto55Hzandbackto10Hzinabout1min.Repeatthisfor2heachin3perpendiculardirections.C:Ratedcapacitance(pF)D.F.Meettheinitialspec.(Class2)13TemperatureExternalNomechanicaldamage.cycleappearanceCapacitanceChangefromtheCharacteristicsvaluebeforetestClass1C0GPleaserefertoX5RthetableAintheendoftheClass2X7RY5Vspecification.QCapacitanceQ(Class1)30pFandover1,000min.Under30pF400+20×Cmin.C:Ratedcapacitance(pF)D.F.Meettheinitialspec.(Class2)InsulationMeettheinitialspec.ResistanceVoltageNoinsulationbreakdownorproofotherdamage.ReflowsolderthecapacitorsonaP.C.BoardshowninAppendix1aorAppendix1bbeforetesting.Exposethecapacitorsintheconditionstep1throughstep4andrepeat5timesconsecutively.Leavethecapacitorsinambientconditionfor6to24h(Class1)or24±2h(Class2)beforemeasurement.StepTemperature(°C)Time(min.)1Min.operating30±3temp.±32ReferenceTemp.±22-53Max.operating30±2temp.±24ReferenceTemp.±22-5AsforMin./Max.operatingtemp.andReferencetemp.,pleasereferto“4.operatingtemperaturerange”atpage3.——8——(continued)No.Item14MoistureExternalResistanceappearance(SteadyCapacitancePerformanceNomechanicaldamage.TestorinspectionmethodReflowsolderthecapacitorsonaP.C.BoardshowninAppendix1aorAppendix1bbeforetesting.State)CharacteristicsClass1C0GX5RClass2X7RY5VChangefromthevaluebeforetestPleaserefertothetableAintheendofthespecification.Leaveattemperature40±2°C,90to95%RHfor500+24,0h.Leavethecapacitorsinambientconditionfor6to24h(Class1)orQ(Class1)D.F.(Class2)InsulationResistanceCapacitanceQ30pFandover350andover10pFandover275+5/2×Cmin.tounder30pFUnder10pF200+10×Cmin.C:Ratedcapacitance(pF)CharacteristicsX5R:200%ofinitialspec.max.X7R:200%ofinitialspec.max.Y5V:150%ofinitialspec.max.1,000M?or50M?·μFmin.(Asforthecapacitorsofratedvoltage16,10,6.3VDCanditembelow,1,000M?or10M?·μFmin.,)whicheversmaller.C1005X5R1E683C1005X5R1E104C1608X5R1E334C1608X5R1E474C1608X5R1E684C1608X5R1E105C2012X5R1E335C2012X5R1E47524±2h(Class2)beforemeasurement.——9——(continued)No.Item15MoistureExternalResistanceappearanceCapacitanceQ(Class1)D.F.(Class2)PerformanceNomechanicaldamage.CharacteristicsChangefromthevaluebeforetestClass1C0GPleaserefertoX5RthetableAinClass2X7RtheendoftheY5Vspecification.CapacitanceQ30pFandover200andoverUnder30pF100+10/3×Cmin.C:Ratedcapacitance(pF)CharacteristicsX5R:200%ofinitialspec.max.X7R:200%ofinitialspec.max.Y5V:150%ofinitialspec.max.TestorinspectionmethodReflowsolderthecapacitorsonaP.C.BoardshowninAppendix1aorAppendix1bbeforetesting.Applytheratedvoltageattemperature40±2°Cand90to95%RHfor500+24,0h.Charge/dischargecurrentshallnotexceed50mA.Leavethecapacitorsinambientconditionfor6to24h(Class1)or24±2h(Class2)beforemeasurement.Voltageconditioning(onlyforclass2)Voltagetreatthecapacitorsundertestingtemperatureandvoltagefor1hour.Insulation500M?or25M?·μFmin.Resistance(Asforthecapacitorsofratedvoltage16,10,6.3VDCanditembelow,500M?or5M?·μFmin.,)whicheversmaller.C1005X5R1E683C1005X5R1E104C1608X5R1E334C1608X5R1E474C1608X5R1E684C1608X5R1E105C2012X5R1E335C2012X5R1E475Leavethecapacitorsinambientconditionfor242h±beforemeasurement.Usethismeasurementforinitialvalue.——10——(continued)No.16LifeItemExternalappearanceCapacitanceQ(Class1)D.F.(Class2)InsulationResistancePerformanceNomechanicaldamage.CharacteristicsChangefromthevaluebeforetestClass1C0GPleaserefertoX5RthetableAinClass2X7RtheendoftheY5Vspecification.CapacitanceQ30pFandover350andover10pFandover275+5/2×Cmin.tounder30pFUnder10pF200+10×Cmin.C:Ratedcapacitance(pF)CharacteristicsX5R:200%ofinitialspec.max.X7R:200%ofinitialspec.max.Y5V:150%ofinitialspec.max.1,000M?or50M?·μFmin.(Asforthecapacitorsofratedvoltage16,10,6.3VDCandtheitembelow,1,000M?or10M?·μFmin.,)whicheversmaller.C1005X5R1E683C1005X5R1E104C1608X5R1E334C1608X5R1E474C1608X5R1E684C1608X5R1E105C2012X5R1E335C2012X5R1E475TestorinspectionmethodReflowsolderthecapacitorsonaP.C.BoardshowninAppendix1aorAppendix1bbeforetesting.Testcondition:maximumoperatingtemperature±2°Cfor1,000+48,0hAsforappliedvoltage,pleaserefertothetableAintheendofthespecification..Charge/dischargecurrentshallnotexceed50mA.Leavethecapacitorsinambientconditionfor6to24h(Class1)or24±2h(Class2)beforemeasurement.VoltageconditioningVoltagetreatthecapacitorsundertestingtemperatureandvoltagefor1hour.Leavethecapacitorsinambientconditionfor242h±beforemeasurement.Usethismeasurementforinitialvalue.*Asfortheinitialmeasurementofcapacitors(Class2)onnumber7,11,12,13and14,leavecapacitorsat150–10,0°Cfor1hourandmeasurethevalueafterleavingcapacitorsfor242hinambient±condition.——11——Appendix-1aAppendix-1bP.C.BoardforreliabilitytestP.C.BoardforreliabilitytestAppliedforC0603,C1005,C1608,C2012,C3216AppliedforC3225,C4532,C5750100100ccba0ba044SolderresistCopperSlitSolderresistCopper(Unit：mm)(Unit:mm)Appendix-2aAppendix-2bP.C.BoardforbendingtestP.C.BoardforbendingtestAppliedforC0603,C1005AppliedforC1608,C2012,C3216,C3225,C4532,C5750100100bb00a..1c10044Solderresistac(Unit:mm)bCopperMaterial:GlassEpoxy(AsperJISC6484GE4)P.C.Boardthickness:Appendix-2a0.8mmAppendix-1a,1b,2b1.6mmCopper(thickness0.035mm)SolderresistSolderresistCopper(Unit:mm)TDK(EIAstyle)Dimensions(mm)abcC0603(CC0201)0.30.80.3C1005(CC0402)0.41.50.5C1608(CC0603)1.03.01.2C2012(CC0805)1.24.01.65C3216(CC1206)2.25.02.0C3225(CC1210)2.25.02.9C4532(CC1812)3.57.03.7C5750(CC2220)4.58.05.6——12——9.INSIDESTRUCTUREANDMATERIAL34512No.NAMEMATERIALClass1Class21DielectricCaZrO3BaTiO32ElectrodeNickel(Ni)3Copper(Cu)4TerminationNickel(Ni)5Tin(Sn)10.RECOMMENDATIONAsforC3225,C4532andC5750types,Itisrecommendedtoprovideaslit(about1mmwide)intheboardunderthecomponentstoimprovewashingFlux.Andpleasemakesuretodrydetergentupcompletelybefore.11.SOLDERINGCONDITIONAsforC0603,C1005,C3225,C4532andC5750types,reflowsolderingonly.——13——12.CautionNo.ProcessOperatingCondition(Storage,Transportation)CircuitdesignCautionCondition1-1.Storage1)Thecapacitorsmustbestoredinanambienttemperatureof5to40Cwitha°relativehumidityof20to70%RH.Theproductsshouldbeusedwithin6monthsuponreceipt.ThecapacitorsmustbeoperatedandstoredinanenvironmentfreeofdewcondensationandthesegasessuchasHydrogenSulphide,HydrogenSulphate,Chlorine,Ammoniaandsulfur.Avoidstoringinsunlightandfallingofdew.Donotusecapacitorsunderhighhumidityandhighandlowatmosphericpressurewhichmayaffectcapacitorsreliability.Capacitorsshouldbetestedforthesolderabilitywhentheyarestoredforlongtime.1-2.HandlingintransportationIncaseofthetransportationofthecapacitors,theperformanceofthecapacitorsmaybedeteriorateddependingonthetransportationcondition.(RefertoJEITARCR-2335B9.2Handlingintransportation)2-1.OperatingtemperatureOperatingtemperatureshouldbefollowedstrictlywithinthisspecification,especiallybecarefulwithmaximumtemperature.Donotusecapacitorsabovethemaximumallowableoperatingtemperature.Surfacetemperatureincludingselfheatingshouldbebelowmaximumoperatingtemperature.(Duetodielectricloss,capacitorswillheatitselfwhenACisapplied.EspeciallyathighfrequenciesarounditsSRF,theheatmightbesoextremethatitmaydamageitselfortheproductmountedon.Pleasedesignthecircuitsothatthemaximumtemperatureofthecapacitorsincludingtheselfheatingtobebelowthemaximumallowableoperatingtemperature.Temperatureriseatcapacitorsurfaceshallbebelow20°C)3）Theelectricalcharacteristicsofthecapacitorswillvarydependingonthetemperature.Thecapacitorsshouldbeselectedanddesignedintakingthetemperatureintoconsideration.2-2.Operatingvoltage1)Operatingvoltageacrosstheterminalsshouldbebelowtheratedvoltage.WhenACandDCaresuperimposed,V0-Pmustbebelowtheratedvoltage.———(1)and(2)ACorpulsewithovershooting,VP-Pmustbebelowtheratedvoltage.———(3),(4)and(5)Whenthevoltageisstartedtoapplytothecircuitoritisstoppedapplying,theirregularvoltagemaybegeneratedforatransitperiodbecauseofresonanceorswitching.BesuretousethecapacitorswithinratedvoltagecontainingtheseIrregularvoltage.Voltage(1)DCvoltage(2)DC+ACvoltage(3)ACvoltageMeasurementV0-PV0-PVP-P000Voltage(4)Pulsevoltage(A)(5)Pulsevoltage(B)PositionalVP-PVP-P0Measurement(Ratedvoltage)0——14——No.ProcessCircuitdesignCautionConditionEvenbelowtheratedvoltage,ifrepetitivehighfrequencyACorpulseisapplied,thereliabilityofthecapacitorsmaybereduced.TheeffectivecapacitancewillvarydependingonappliedDCandACvoltages.Thecapacitorsshouldbeselectedanddesignedintakingthevoltagesintoconsideration.2-3.FrequencyWhenthecapacitors(Class2)areusedinACand/orpulsevoltages,thecapacitorsmayvibratethemselvesandgenerateaudiblesound.Theamountofsolderattheterminationshasadirecteffectonthereliabilityofthecapacitors.1)Thegreatertheamountofsolder,thehigherthestressonthechipcapacitors,andthemorelikelythatitwillbreak.WhendesigningaP.C.board,determinetheshapeandsizeofthesolderlandstohaveproperamountofsolderontheterminations.Avoidusingcommonsolderlandformultipleterminationsandprovideindividualsolderlandforeachterminations.Sizeandrecommendedlanddimensions.ChipcapacitorsSolderlandCSolderresistBAFlowsoldering(mm)TypeC1608C2012C3216Symbol(CC0603)(CC0805)(CC1206)A0.7-1.01.0-1.32.1-2.5B0.8-1.01.0-1.21.1-1.3C0.6-0.80.8-1.11.0-1.3Reflowsoldering(mm)TypeC0603C1005C1608C2012Symbol(CC0201)(CC0402)(CC0603)(CC0805)A0.25-0.350.3-0.50.6-0.80.9-1.2B0.2-0.30.35-0.450.6-0.80.7-0.9C0.25-0.350.4-0.60.6-0.80.9-1.2TypeC3216C3225C4532C5750Symbol(CC1206)(CC1210)(CC1812)(CC2220)A2.0-2.42.0-2.43.1-3.74.1-4.8B1.0-1.21.0-1.21.2-1.41.2-1.4C1.1-1.61.9-2.52.4-3.24.0-5.0——15——No.ProcessCondition3Designing4)Recommendedchipcapacitorslayoutisasfollowing.DisadvantageagainstAdvantageagainstbendingstressbendingstressPerforationorslitPerforationorslitMountingfaceBreakP.C.boardwithBreakP.C.boardwithmountedsideup.mountedsidedown.MountperpendicularlytoMountinparallelwithperforationorslitperforationorslitPerforationorslitPerforationorslitChiparrangement(Direction)ClosertoslitishigherstressAwayfromslitislessstress??12Distancefromslit(?1B=C>D>E6)LayoutrecommendationUseofcommonSolderingwithUseofcommonExamplesolderlandwithsolderlandchassisotherSMDLeadwireChassisSolderchipSolderExcessivesolderlandNeedtoavoidExcessivesolderPCBAdhesive?1SolderlandMissingSolderlandsolderLeadwireSolderresistSolderresistRecommen-dation?2Solderresist21?>?——17——No.ProcessCondition4Mounting4-1.StressfrommountingheadIfthemountingheadisadjustedtoolow,itmayinduceexcessivestressinthechipcapacitorstoresultincracking.Pleasetakefollowingprecautions.1)AdjustthebottomdeadcenterofthemountingheadtoreachontheP.C.boardsurfaceandnotpressit.Adjustthemountingheadpressuretobe1to3Nofstaticweight.Tominimizetheimpactenergyfrommountinghead,itisimportanttoprovidesupportfromthebottomsideoftheP.C.board.Seefollowingexamples.NotrecommendedRecommendedSinglesidedCrackmountingSupportpinDouble-sidesmountingSolderCr