单片机 外文翻译 外文文献 英文文献ROM的单片机

单片机 外文翻译 外文文献 英文文献ROM的单片机 外文翻译 外文原文 Method of manufacturing a single chip semiconductor integrated circuit device including a mask rom in a short time This application is based upon and claims the benefit of priority from Japanese patent application No. 2006-207797, filed on Jul. 31, 2006, the disclosure of which is incorporated herein its entirety by reference. BACKGROUND OF THE INVENTION This invention relates to a method of manufacturing a single chip semiconductor integrated circuit device (a microcontroller) and a method of debugging a program of the single chip semiconductor integrated circuit device. As well know in the art, a microcomputer is defined by a miniaturized electronic computer constituted by a microprocessor. The microprocessor is a processor where in a central processing unit (CPU) of the computer is integrated on one or few large-scale integrated circuits (LSIs). The microcomputer normally comprises the CPU, an input/output device, and a main memory device. The main memory device comprises a random access memory (RAM) and a read only memory (ROM). An input/output control LSI is used as a connecting circuit portion for the input/output device. A single chip microcomputer is a microcomputer where the CPU, the RAM, the ROM, and the input/output LSI are mounted in a one chip. The single chip microcomputer is called a one chip microcomputer. A program is read from an outside of a chip of the microprocessor while the program is preliminarily installed in the inside in the chip of the signal chip microcomputer. The microprocessor is capable of changing processing contents by renewing the program of the outside while it is almost impossible for the single chip microcomputer to change processing contents by a user because the program is already installed in the inside in the chip thereof. Herein, the program is preliminarily stored in the ROM. In addition, as well know in the art, read only memories (ROMs) are broadly divided into mask ROMs wherein wiring of contents is carried out at a manufacturing process in a semiconductor maker and programmable ROMs (PROMs) where a user can electrically write with the program therein. The mask ROMs can be manufactured at the lowest price among the semiconductor memories in principle. Therefore, products having a large memory capacity are manufactured as the mask ROMs. On the other hand, the programmable ROMs have features wherein the writing of the program can carry out by a user at hand. The programmable ROMs are classified into EPROM in a narrow sense wherein the user can program only once, erasable and programmable ROMs (EPROMs) which can be electrically programmed and can be erased by ultraviolet light or the like, and electrically erasable programmable ROMs (EEPROMs). In the EPROM, the user can program and all of data can be erased by irradiating it with ultraviolet light to be enable to rewrite therein. Inasmuch as a glass window for erasing by ultraviolet light is required in the EPROM, the EPROM is commonly contained in a ceramic package. There is a one time programmable ROM (OTP) as the EPROM in a narrow sense. The OPT comprises a semiconductor chip embedded there in that is similar to that of the EPROM but the OTP cannot be erased by ultraviolet light because the OTP comprises a package with no window. By using an ordinary EPROM programmer, the user can program information to each memory cell in the OTP only once. The OTP has a cost which is higher than that of the mast ROM and which is lower than that of the EPROM. There is a flash EEPROM as a kind of the EEROMs. The flash EEPROM is also called a flash memory which can electrically erase all of bit contents (which may erase every block) to rewrite contents therein among the programmable read only memories (PROMs). Such a single chip microcomputer is mounted in an ordinary electric calculator, a printer, a keyboard, a microprocessor-controlled automatic (electric) rice cooker, a microprocessor-controlled camera, an engine controller for an automobile, an so on. Inasmuch as the single chip microcomputer mainly often controls operations of its equipment with it installed in the equipment, the single chip microcomputer may be called a microcontroller. In addition, the microcontroller is a kind of the single chip semiconductor integrated circuit devices. In order to effectively carry out development of the equipment (an electronic device) in which such a single chip microcomputer (microcontroller) is installed, various development systems (development tools) are delivered by semiconductor makers or development tool makers. Inasmuch as the single chip microcomputer (microcontroller) comprises hardware and software which are closely related to each other and has a short time period of development, debug of the software and checking of the hardware must be simultaneously carried out. That is, development of the hardware and the software must often carried out concurrently. In this event, the debug of the software is required with a yet-to-be-completed hardware. There is an emulator as one of debug tools (development tools). Herein, the emulator is a device or a computer program for imitating, by using a system, another system. With the help of the emulator, verification of functional operations of the equipment (electronic device) installed with the software is carried out. Emulators are divided into an in-circuit emulator (ICE) which is used with it directly connected to the equipment (the electronic device) under development and a software emulator using a logic simulator. That is, the in-circuit emulator is a development tool for supporting the verification of the functional operations of the equipment (electronic device) by directly connecting it to the equipment (electronic device) mounting a program-controlled microcontroller under development. Usually, development of the hardware of the microcontroller is carried out by the semiconductor maker side while development of the software of the microcontroller is carried out by the user side. That is, development of the microcontroller is carried out by cooperative working of the semiconductor maker and the user. Now, the description will proceed to a conventional method of manufacturing of a microcontroller. Herein, the description will be directed to the method of manufacturing, as an ultimate product, a microcontroller comprising a mask ROM in which an ultimate program is stored. [0013]First of all, between the semiconductor maker and the user, investigation of specifications of the microcontroller (the single chip semiconductor integrated circuit device) to be manufactured is carried out. Herein, the ultimate microcontroller to be manufactured comprises a CPU, an RAM, a mask ROM, and an input/output control LSI which are incorporated into a one chip. In addition, the CPU, the RAM, the mask ROM, and the input/output control LSI are mutually connected to each other via an internal bus. The internal bus comprises an address bus and a data bus. The semiconductor maker provides the user with the emulator (the software emulator and the in-circuit emulator) as the envelopment tool while the user develops, by using the emulator, software (a program) to be stored in the above-mentioned mask ROM. Subsequently, the semiconductor maker designs a product in OTP version and the user carries out debug of the program using the software emulator. Herein, the product in OTP version (a provisional microcontroller) to be designed comprises a CPU, an RAM, the OTP, and an input/output control LSI which are incorporated into a one chip. In other words, the provisional microcontroller is similar in structure to the ultimate microcontroller except that the OTP is used in lieu of the mask ROM. However, any program is not stored in the OTP and storing of the program to the OTP is carried out by the user side in the manner which will later be described. The provisional microcontroller is sealed in a semiconductor package. On the other hand, carried out by the user, debug of the program using the software emulator is carried out with the hardware put into a yet-to-be-completed state. The semiconductor maker provides the user with a plurality of the provisional microcontrollers which are similar in structure to one another. The user stores, by using the EPROM programmer (writer), a provisional program (which is a program debugged by using the software emulator) in the OTP in one selected from the plurality of the provisional microcontrollers, mounts the selected provisional microcontroller in question in an equipment (a target board), and carries out a test of the provisional program. That is, by using the above-mentioned in-circuit emulator, the user carries out verification of functional operations of the equipment (target board). In the manner which is described above, the OTP is a PROM in which information can be written only once. Accordingly, if any correction place (error) is found out in the provisional program by the test, the user stores a corrected provisional program in another provisional microcontroller, and carries out retest and re-correction of the corrected provisional program. That is, the test and the correction (the retest and the re-correction) of the provisional program is repeatedly carried out. By repeating operations of the test and the correction (the retest and the re-correction) for the provisional program, an ultimate program is determined by the user side. On the other hand, after the provisional controllers are provided to the user, the semiconductor maker subsequently carries out design of a produce in mask ROM version. Herein, the product in mask ROM version (an actual microcontroller to be mounted in the equipment) to be designed comprises a CPU, an ROM, the mask ROM, and an input/output control LSI which are incorporated in a one chip. However, at this time instance, the ultimate program has yet to be written in the mask ROM of the actual microcontroller. [0018]The user sends (provides) the above-mentioned determined ultimate program to the semiconductor maker. The semiconductor maker stores, using ion implantation, the ultimate program in the mask ROM of the actual microcontroller, thereby a microcontroller as the ultimate product is manufactured. In addition, the microcontroller manufactured in the manner which is described above is sealed in a semiconductor package and is produced in large quantity. And, ultimate microcontrollers produced in large quantity are provided to the user. [0019]The user mounts the ultimate microcontrollers in the respective equipments (electronic devices), thereby the equipments are produced in large quantity. Although the above-mentioned microcontroller comprises one semiconductor chip, U.S. Pat. No. 7,199,469 or U.S. Pat. No. 7,199,469 B2 issued to Ishida et al. discloses a semiconductor device (a microcontroller) having stacked two semiconductor chips sealed with a resin seal member. As the semiconductor device, a semiconductor device called a multi chip package (MCP) type is known. Although ones having various structures are developed and manufactured in the MCP type semiconductor devices, the MCP type semiconductor device comprising the stacked two semiconductor devices sealed with the resin seal member becomes most widespread. Ishida et al. discloses the semiconductor device wherein a chip for a microcomputer (a first semiconductor chip) and a chip for EEPROM (a second semiconductor chip) are incorporated in a package. That is, Ishida et al. discloses the semiconductor device wherein the chip for EEPROM (the second semiconductor chip) is stacked on the chip for the microcomputer (the first semiconductor chip) and the two chips are sealed with the resin seal member. The chip for the microcomputer comprises a processor unit (CPU), an ROM unit, an RAM unit, a timer unit, an A/D conversion unit, a serial communication interface unit, a data input/output circuit unit, and so on which are mounted on the same board. Those units are mutually connected through a data bus and an address bus. The processor unit mainly comprises a central processing portion, a control circuit portion, an arithmetic circuit portion, and so on. The chip for the microcomputer having such a structure is operated by a program. On the other hand, the chip for the EEPROM comprises a serial communication interface unit, a nonvolatile storage unit, and so on which are mounted on the same board. According to Ishida et al., electrical connection between the first semiconductor chip and the second semiconductor chip is carried out by internal leads among leads disposed around the first semiconductor chip and two bonding wires. [0021]In addition, United States Patent Application Publication No. 2002/0027281 A1 or US 2002/0027281 A1 discloses a multi chip package (a semiconductor device) which is capable of controlling a rise in temperature, which occurs inside a package due to heat (self-heating) radiated from a semiconductor chip. According to US 2002/0027281 A1, the multi chip package constructing a microcontroller comprises a lower semiconductor chip on which the microcontroller including a mask ROM is formed and an upper semiconductor chip including flash memory mounted on the lower semiconductor chip. Inasmuch as no transistor is formed on the lower semiconductor chip under the upper semiconductor chip, it is possible to neglect the self-heating in this area. In addition, US 2002/0027281 A1 discloses an embodiment wherein transistors having a mask ROM function are formed on the lower semiconductor chip at a mounting area (a substantially central area) for the upper semiconductor chip and the upper semiconductor chip (the flash memory) is mounted on the mounting area. In this event, the mask ROM function in the lower semiconductor chip is discarded. In the above-mentioned conventional method of manufacturing the microcontroller, the semiconductor maker must carry out design of two kinds of products, namely, design of a product of the OTP version and design of a product of the mask ROM version. As a result, the conventional method is disadvantageous in that it takes very much time (e.g. one year or one and half years) to develop the microcontroller as the ultimate product. In addition, the product of the OTP version and the product of the mask ROM version are a pin-for-pin equivalent in a package state and can be substituted by each other. However, the product of the OTP version and the product of the mask ROM version are different from each other as semiconductor chips and cannot be compatible in characteristics in abundance. That is, when the product of the mask ROM version is replaced with the product of the OTP which is completed with evaluation, there are cases where a malfunction such as no operation occurs. 译文 在短时间内制造集成在电路器件中含有掩膜ROM的单片机的方法 此应用程序是基于在2006年7月31日从日本申请的专利号2006-207797中， 提交了关于披露注册在这里的完整参考，拥有优先索赔利益的权利。， 背景 说明 关于失联党员情况说明岗位说明总经理岗位说明书会计岗位说明书行政主管岗位说明书 本发明涉及到一种制造单芯片半导体集成电路器件(微控制器)的方法和关 于这种单芯片半导体集成电路装置调试程序的方法。 众所周知，在工艺方面，微机的定义是由微型电子计算机所构成的微处理器。 微处理器是一个或几个大规模集成电路集成在一个中央处理单元(CPU)上而构 成的一个处理器(LSIs)。微处理器通常由CPU，输入/输出装置，主要存储器 装置组成。主要存储器装置包括随机存取存储器(RAM)和只读存储器(ROM)。 处理器LSI的输入/输出控制用来作为连接电路部分的输入/输出端口。单芯片微 处理器是中央处理单元CPU ，RAM存储器，ROM存储器，以及LSI的输入/ 输出都安装在同一芯片上的一个微处理器。单芯片微处理器也被称为单片机。 在开始准备将程序安装在单片机的信号芯片里面时，程序是由微处理器外部 读入单片机的。在外部更新程序指令下，微处理器有改变处理 内容 财务内部控制制度的内容财务内部控制制度的内容人员招聘与配置的内容项目成本控制的内容消防安全演练内容 的权限，但是 由用户修改单片机处理的内容几乎是不可能的，因为该程序已经安装在单片机晶 片内。程序在初始已被储存在ROM存储器中。 此外，工艺方面，只读存储器(只读存储器)在广义上被定义为掩膜只读存 储器，其中接线的内容是由半导体制造商在可编程只读存储器制造过程中定义 的，这样，用户能够电可擦除式地编写程式。 原则上，在半导体记忆器件之中可以制造最低价格的掩膜只读存储器。然而，作为掩膜只读存储器，产品要有一个大的记忆容量的制造。在另一方面，根据可编程只读存储器的特点，其中程序的 书 关于书的成语关于读书的排比句社区图书漂流公约怎么写关于读书的小报汉书pdf 写可以由用户来执行。狭义上讲，可编程只读存储器被定义为电可编程只读存储器EPROM，对这种存储器用户只能进行一次编程。可擦除可编程只读存储器(EPROMS)不仅可以电动编写程序，而且可以由紫外光或类似紫外光擦除程序。 ，用户可以编程或者在紫外线光照射下将所有的数据擦除，以在EPROM中 使数据能够重写。EPROM需要一个作为紫外光可擦除的玻璃窗口，这样的EPROM通常是陶瓷封装而成。这是对可编程ROM存储器作为狭义EPROM的时候而言的。OTP中包含了一个类似EPROM的半导体芯片，但OTP不能由紫外线光擦除，因为OTP中没有封装紫外光照射擦除的玻璃窗口。通过使用一个普通的EPROM程序员，用户可以对每个存储单元编写信息，不过，在OTP中只能进行一次编写。OTP的费用高于ROM但是比EPROM的要低。另外，闪光存储器是EEPROM的一种。闪存EEPROM也被称为闪速存储器，能够电擦除所有的位内容(可擦除每块)以重写新内容，其中有可编程只读存储器(PROMs) 。 这样的单片机是安装在一个普通的电动计算器，印表机，键盘，微处理器控制的自动(电动)电饭煲，微处理器控制的摄像头，汽车的发动机控制器等等上的。因为单片机通常主要是设备安装上控制设备的管理员，因此单片机可称为微控制器。而且，该微控制器是一种单片集成的半导体电路器件。 为了有效地进行设备(电子设备)的开发，在设备中安装了这种单片机(微控制器)，而各种开发系统(开发工具)是由半导体制造商或开发工具制造商提供的。因为单片机(微控制器)组成的软件和硬件密切相关，一个短的开发时期内，软件调试和硬件检查必须同时进行。也就是说，开发单片机的硬件和软件必须经常交错进行。在此种情况下，软件的调试是被要求在硬体尚未完成之前进行的。 有一个模拟器作为软件调试工具(开发工具)。在这里，作为使用的另外一个系统，模拟器是为仿真的装置或计算机程序。借助模拟器，由软件对所安装设备(电子设备)的功能进行核查。模拟器分为在电路模拟器(ICE)和软件仿真器使用的逻辑模拟器，电路模拟器直接连接到开发的设备(电子设备)下。也就是说，电路模拟器是一个支持核查设备(电子设备)功能的开发工具，在开发时安装程序微控制器直接连接设备(电子设备)。 通常，微控制器硬件的开发是半导体制造商一方所进行的，而微控制器软件的开发由用户方完成。也就是说，微控制器的开发是由所有半导体制造商和用户合作进行的工作。 下面将介绍制造微控制器的常规的方法。在这里，制造方法由说明指导，作为一个终端产品，微控制器组成了掩膜ROM，在其中一个初始程序被储存。 首先，在半导体制造商和用户之间，检查微控制器(单片机半导体集成电路装置)的规格是在产品制造时进行的。最终微控制器制造包括一个CPU ，内存，掩膜ROM，LSI的输入/输出控制，这些单元被镶嵌在同一个芯片上。此外，该CPU， RAM存储器，掩膜ROM存储器，LSI的输入/输出控制被相互连接到其他每根内部总线上。内部总线包括地址总线和数据总线。 半导体制造商为用户提供模拟器(软件模拟器和电路模拟器)以其作为包络工具，使用模拟器用户将开发的软件(程序)储存在上面提到的掩膜ROM存储器中。 此后，在OTP版本中由半导体制造商 设计 领导形象设计圆作业设计ao工艺污水处理厂设计附属工程施工组织设计清扫机器人结构设计 产品，用户使用软件模拟器进行程序的调试。如此，OTP版本(临时微控制器)的产品在设计上包括一个CPU ，数据存储器，以及LSI的一个输入/输出控制都被嵌入在同一个芯片上。换而言之，临时微控制器是类似的结构，以终端微控制器OTP来代替的掩膜ROM。但是，在OTP中不能储存任何程序，OTP程序的储存是以用户一方的方式进行操作，这种方式稍后会加以说明。临时微控制器是被密封的半导体封装。另一方面，调试程序由用户使用软件模拟器进行，这一工作是在硬件投入尚未完成时开始的。 半导体制造商为用户提供多元化的临时微控制器，他们同另一个微处理器之间有相同的结构。用户将临时程序(使用软件模拟器调试程序)存储在一个从多元化的临时微控制器中选定的OTP上，再将选定的临时单片机安装在应用设备(目标板)上，并对临时程序进行试运行。到此，用上面提到的电路仿真器，用户可以对应用设备(目标板)的功能进行核查。这样的方式在上文已有所述，OTP是一个掩膜PROM，其中的数据只可以编写一次。因此，如果任何需要校正的地方(错误)在临时程序测试时被发现，用户要将更正的临时程序存储在在另一临时微控制器中，并进行复测以重新更正临时程序。那就是说，测试和校正(测和重新校正)临时程序是反复进行的。重复的运作测试和校正(重测和重新校正)临时程序，由用户方决定最终程序。 在另一方面，临时控制器被提供给用户之后，半导体制造商随后在掩膜ROM方面进行了设计。在这里，该掩膜ROM版本(一个实际的微控制器被安装在设备上)的产品在设计上包括一个CPU ，一个光盘，掩膜ROM ，LSI的输入/输出控制，他们被集成在一个芯片上。此外，例如这样的最终程序被写在实际微控制器的掩膜ROM内 用户将上面提到的最终程序发送(提供)给半导体制造商。半导体制造商用离子注入的方法把最终程序存储在实际微控制器的该掩膜ROM上，微控制器作为终端产品被生产。此外，该微控制器制造的方法就是上文所述的半导体密闭封装和大批量生产。同时，最终生产的大量微控制器被提供给用户。 用户将终端微控制器安装在各自的设备(电子设备)上，从而使该设备大批量生产。 虽然上面提到的微控制器只包括一个半导体芯片，但是美国第7,199,469和美国第 7,199,469 B2的发明者石田等人发现了一种半导体器件(微控制器)是由叠二半导体芯片和混合树脂成分密封而成。作为半导体器件，半导体器件的所谓一个多芯片封装(MCP的)类型是众所周知的。在MCP型半导体器件中虽然有多种结构的开发和制造，但是 MCP类型半导体器件组成的叠二半导体器件与树脂成分的密闭封装成为最普遍的微控制器。石田等人揭示半导体器件中有一个微机芯片(第一个半导体芯片)和EEPROM芯片(第二个半导体芯片)被集成在一个模块上。同样，他们还披露EEPROM中的半导体器件芯片(第二半导体芯片)是堆放在微处理器(第一半导体芯片)的芯片上的，这两个芯片由树脂成分密封。该微处理器芯片包括一个处理器单元(CPU)，一个ROM单元，一个RAM的单元，计时器单元，一个A/D转换单元，串行通信接口单元， 以及数据输入/输出电路的单元等等，他们被安装在同一局域内。这些单元是通过数据 总线和地址总线相互连接。该处理器单元主要包括一个中央处理部分，控制电路部分，算术电路的部分等等。单片机这样的结构由一个程序来管理。在另一方面，该芯片的EEPROM包括一个串行通信接口单元，非易失性存储单元等等，他们被安装在在同一局域内的部分。根据石田等人所述，第一半导体芯片和第二半导体芯片之间是由第一半导体芯片和两键的电线进行内部引导的。 此外，美国专利申请出版物第0027281/2002 A1和0027281/2002 A1中揭示一个多芯片封装器件(半导体器件)，它有控制温度上升的能力，这种发生在器件内部的现象是由一系列热(自热)辐射导致的。据美国0027281/2002 A1之规定，这种多芯片封装构造的含有掩膜ROM组成的微型控制器包括一个较低位的半导体芯片和一个较高的半导体芯片，它所含有的闪速存储器安装在较低的半导体芯片上。因为较低的半导体芯片不是由晶体管组成，这一面积区域内自加热可以被忽略。随之，美国0027281/ 2002 A1 中提出的一种晶体管有掩膜ROM的功能这种晶体管在较低的半导体芯片安装面积之(大幅中部心区域)上形成，也就是半导体晶片较上(快闪记忆体)的安装面积内安装晶体管。在单片机应用中，掩膜ROM功能在较低的半导体晶片中被弃用。 以上提及了制造微控制器的传统方法，半导体制造商必须进行两种产品的设计，即设计一种OTP规格的产品和一种掩膜ROM规格的产品。因此，传统的制造方法是有弊端的，因为当开发微控制器用作终端产品时，它需要很长的时间(如一年或一年半的时间) 的产品和掩膜ROM规格的产品是一个引脚对引脚相对除此之外，OTP规格 于一个套件内的封装状态，可以相互取代对方。不过，OTP规格的产品和掩膜ROM规格的产品有所不同，两种半导体芯片的特点使他们不能相互兼容。也就是说，当掩膜ROM规格的产品被OTP规格的产品取代时，在有些情况下，如没有发生行为故障，可以由OTP规格完成与评估。